Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)
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Published By IEEE

0780355024

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Making the six sigma leap using SPC data [quality]

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804795 ◽

2003 ◽

Author(s):

R.L. Horst

Keyword(s):

Data Quality ◽

Six Sigma

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Investigation of a low cost solder bumping technique for flip-chip interconnection

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804842 ◽

2003 ◽

Cited By ~ 1

Author(s):

D.A. Hutt ◽

D.G. Rhodes ◽

P.P. Conway ◽

S.H. Mannan ◽

D.C. Whalley ◽

...

Keyword(s):

Flip Chip ◽

Low Cost

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Plastic strain in thermally cycled flip-chip PBGA solderballs

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804827 ◽

2003 ◽

Cited By ~ 1

Author(s):

E.S. Drexler

Keyword(s):

Plastic Strain ◽

Flip Chip

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Shear testing and failure mode analysis for evaluation of BGA ball attachment

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804791 ◽

2003 ◽

Cited By ~ 40

Author(s):

R. Erich ◽

R.J. Coyle ◽

G.M. Wenger ◽

A. Primavera

Keyword(s):

Failure Mode ◽

Mode Analysis ◽

Shear Testing ◽

Failure Mode Analysis

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How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804858 ◽

2003 ◽

Author(s):

J.H. Lau ◽

R. Lee ◽

H. Chao

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Analysis of copper plating baths-new developments

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804819 ◽

2003 ◽

Author(s):

B. Newton ◽

E. Kaiser

Keyword(s):

Copper Plating ◽

New Developments

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Monolith/sup TM/ package-a novel FBGA using 3-D transfer laminate circuit process

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804789 ◽

2003 ◽

Author(s):

T. Yamazaki ◽

K. Suzuki ◽

Y. Wakashima ◽

N. Suzuki ◽

N. Fukutomi

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Fine pitch low-cost bumping for flip chip technology

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804806 ◽

2003 ◽

Author(s):

Szu-Wei Lu ◽

Ruoh-Huey Uang ◽

Kuo-Chuan Chen ◽

Hsu-Tien Hu ◽

Ling-Chen Kung ◽

...

Keyword(s):

Flip Chip ◽

Low Cost ◽

Chip Technology ◽

Fine Pitch

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Copper interconnect: migration or bust

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804816 ◽

2003 ◽

Cited By ~ 12

Author(s):

G. Deltoro ◽

N. Sharif

Keyword(s):

Copper Interconnect

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Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804801 ◽

2003 ◽

Cited By ~ 37

Author(s):

Jianbiao Pan ◽

G.L. Tonkay ◽

R.H. Storer ◽

R.M. Sallade ◽

D.J. Leandri

Keyword(s):

Solder Paste ◽

Stencil Printing ◽

Fine Pitch

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Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Making the six sigma leap using SPC data [quality]

Investigation of a low cost solder bumping technique for flip-chip interconnection

Plastic strain in thermally cycled flip-chip PBGA solderballs

Shear testing and failure mode analysis for evaluation of BGA ball attachment

How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?

Analysis of copper plating baths-new developments

Monolith/sup TM/ package-a novel FBGA using 3-D transfer laminate circuit process

Fine pitch low-cost bumping for flip chip technology

Copper interconnect: migration or bust

Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)
Latest Publications