Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)
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70

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Making the six sigma leap using SPC data [quality]

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804795 ◽

2003 ◽

Author(s):

R.L. Horst

Keyword(s):

Data Quality ◽

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Shear testing and failure mode analysis for evaluation of BGA ball attachment

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804791 ◽

2003 ◽

Author(s):

R. Erich ◽

R.J. Coyle ◽

G.M. Wenger ◽

A. Primavera

Keyword(s):

Failure Mode ◽

Mode Analysis ◽

Shear Testing ◽

Failure Mode Analysis

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Investigation of a low cost solder bumping technique for flip-chip interconnection

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804842 ◽

2003 ◽

Author(s):

D.A. Hutt ◽

D.G. Rhodes ◽

P.P. Conway ◽

S.H. Mannan ◽

D.C. Whalley ◽

...

Keyword(s):

Flip Chip ◽

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Plastic strain in thermally cycled flip-chip PBGA solderballs

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804827 ◽

2003 ◽

Author(s):

E.S. Drexler

Keyword(s):

Plastic Strain ◽

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How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804858 ◽

2003 ◽

Author(s):

J.H. Lau ◽

R. Lee ◽

H. Chao

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Monolith/sup TM/ package-a novel FBGA using 3-D transfer laminate circuit process

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804789 ◽

2003 ◽

Author(s):

T. Yamazaki ◽

K. Suzuki ◽

Y. Wakashima ◽

N. Suzuki ◽

N. Fukutomi

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Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804801 ◽

2003 ◽

Author(s):

Jianbiao Pan ◽

G.L. Tonkay ◽

R.H. Storer ◽

R.M. Sallade ◽

D.J. Leandri

Keyword(s):

Solder Paste ◽

Stencil Printing ◽

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Wafer to wafer direct bonding using surfaces activated by hydrogen plasma treatment

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804810 ◽

2003 ◽

Author(s):

W.B. Choi ◽

C.M. Ju ◽

B.K. Ju ◽

M.Y. Sung

Keyword(s):

Plasma Treatment ◽

Hydrogen Plasma ◽

Wafer Direct Bonding

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Analysis of copper plating baths-new developments

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804819 ◽

2003 ◽

Author(s):

B. Newton ◽

E. Kaiser

Keyword(s):

Copper Plating ◽

New Developments

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Fine pitch low-cost bumping for flip chip technology

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) ◽

10.1109/iemt.1999.804806 ◽

2003 ◽

Author(s):

Szu-Wei Lu ◽

Ruoh-Huey Uang ◽

Kuo-Chuan Chen ◽

Hsu-Tien Hu ◽

Ling-Chen Kung ◽

...

Keyword(s):

Flip Chip ◽

Low Cost ◽

Chip Technology ◽

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