2015 IEEE CPMT Symposium Japan (ICSJ)
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9781479988143, 9781479988150
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CDR-integrated Sn-Ag-Cu-solder reflow-capable miniature 28-Gb/s × 4-channel optical modules

2015 ◽  
Author(s):  
Kazuya Nagashima ◽  
Tomofumi Kise ◽  
Yozo Ishikawa ◽  
Hideyuki Nasu
Keyword(s):  
Solder Reflow

Electrical performance analysis of fine line on high density package substrate

2015 ◽  
Author(s):  
Hung-Chun Kuo ◽  
Ming-Fong Jhong ◽  
Hung-Hsiang Cheng ◽  
Chen-Chao Wang ◽  
Chih-Pin Hung
Keyword(s):  
Performance Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Fine Line

Functionality emergence of single molecule electronics

2015 ◽  
Author(s):  
Takuji Ogawa ◽  
Murni Handayani ◽  
Tomoko Inose ◽  
Takashi Tamaki ◽  
Minoru Fukumori ◽  
...  
Keyword(s):  
Single Molecule ◽  
Single Molecule Electronics

3DIC/TSV process developments by printing technologies

2015 ◽  
Author(s):  
Hiroaki Ikeda ◽  
Shigenobu Sekine ◽  
Ryuji Kimura ◽  
Koichi Shimokawa ◽  
Keiji Okada ◽  
...  

Thermal characterization and modeling of BEOL for 3D integration

2015 ◽  
Author(s):  
Shunichi Kikuchi ◽  
Makoto Suwada ◽  
Hiroshi Onuki ◽  
Yoshihisa Iwakiri ◽  
Naoaki Nakamura
Keyword(s):  
Thermal Characterization ◽  
3D Integration

A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques

2015 ◽  
Author(s):  
Yasunobu Matsuoka ◽  
Yong Lee ◽  
Hideo Arimoto ◽  
Toshiaki Takai ◽  
Norio Chujo ◽  
...  
Keyword(s):  
High Density ◽  
Optical Interconnect
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