The effect of surface roughness on Auger electron spectroscopy

P.H. Holloway

doi:10.1016/0368-2048(75)80062-4

The effect of surface roughness on Auger electron spectroscopy

Journal of Electron Spectroscopy and Related Phenomena ◽

10.1016/0368-2048(75)80062-4 ◽

1975 ◽

Vol 7 (3) ◽

pp. 215-232 ◽

Cited By ~ 65

Author(s):

P.H. Holloway

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron ◽

Effect Of Surface

Download Full-text

Variations of surface roughness for deposition of Co-sputtered-ZnO(002) by Auger electron spectroscopy and surface magneto-optic Faraday effect

The European Physical Journal Applied Physics ◽

10.1051/epjap/2010100312 ◽

2011 ◽

Vol 53 (2) ◽

pp. 21501 ◽

Cited By ~ 3

Author(s):

Y.-C. Chang ◽

C.-W. Su ◽

S.-C. Chang ◽

Y.-H. Lee

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron ◽

Faraday Effect ◽

Magneto Optic

Download Full-text

Extension of Atomic Mixing, Surface Roughness and Information Depth Model for Auger Electron Spectroscopy Sputter-Depth Profile Using Tilted Cylindrical Mirror Analyzer

Japanese Journal of Applied Physics ◽

10.1143/jjap.42.7580 ◽

2003 ◽

Vol 42 (Part 1, No. 12) ◽

pp. 7580-7584 ◽

Cited By ~ 9

Author(s):

Takuya Bungo ◽

Yuzuru Mizuhara ◽

Takaharu Nagatomi ◽

Yoshizo Takai

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Depth Profile ◽

Electron Spectroscopy ◽

Auger Electron ◽

Cylindrical Mirror ◽

Information Depth ◽

Atomic Mixing

Download Full-text

Depth resolution and surface roughness effects in sputter profiling of NiCr multilayer sandwich samples using Auger electron spectroscopy

Thin Solid Films ◽

10.1016/0040-6090(77)90289-9 ◽

1977 ◽

Vol 43 (3) ◽

pp. 275-283 ◽

Cited By ~ 92

Author(s):

S. Hofmann ◽

J. Erlewein ◽

A. Zalar

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron ◽

Depth Resolution ◽

Roughness Effects

Download Full-text

THE EFFECTS OF SURFACE ROUGHNESS ON AUGER ELECTRON SPECTROSCOPY

Le Journal de Physique Colloques ◽

10.1051/jphyscol:1984272 ◽

1984 ◽

Vol 45 (C2) ◽

pp. C2-319-C2-322

Author(s):

D. Wehbi ◽

C. Roques-Carmes

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron

Download Full-text

Effect of surface composition observed by Auger electron spectroscopy on magnetization and magnetostriction of NiFe and NiFeRh thin films

Journal of Applied Physics ◽

10.1063/1.343014 ◽

1989 ◽

Vol 65 (3) ◽

pp. 1230-1233 ◽

Cited By ~ 9

Author(s):

K. Ounadjela ◽

H. Lefakis ◽

V. S. Speriousu ◽

C. Hwang ◽

P. S. Alexopoulos

Keyword(s):

Thin Films ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron ◽

Surface Composition ◽

Effect Of Surface

Download Full-text

Quantitative evaluation of sputtering induced surface roughness in depth profiling of polycrystalline multilayers using Auger electron spectroscopy

Thin Solid Films ◽

10.1016/s0040-6090(03)01112-x ◽

2003 ◽

Vol 444 (1-2) ◽

pp. 120-124 ◽

Cited By ~ 21

Author(s):

J.Y. Wang ◽

S. Hofmann ◽

A. Zalar ◽

E.J. Mittemeijer

Keyword(s):

Surface Roughness ◽

Auger Electron Spectroscopy ◽

Quantitative Evaluation ◽

Electron Spectroscopy ◽

Auger Electron ◽

Depth Profiling

Download Full-text

The formation of low temperature Cu3Si in Ag(Cu)/Si structure upon annealing and its effects on adhesion and resistivity

MRS Proceedings ◽

10.1557/proc-766-e3.15 ◽

2003 ◽

Vol 766 ◽

Cited By ~ 3

Author(s):

Sungjin Hong ◽

Seob Lee ◽

Yeonkyu Ko ◽

Jaegab Lee

Keyword(s):

Low Temperature ◽

Auger Electron Spectroscopy ◽

Electron Spectroscopy ◽

Auger Electron ◽

Si Substrate ◽

Copper Silicide ◽

Alloy Films ◽

Cu Alloy ◽

Cu Film ◽

Rapid Drop

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.

Download Full-text