Simulation of a fully submerged bubble bursting through a free surface

2016 ◽  
Vol 55 ◽  
pp. 1-14 ◽  
Author(s):  
B.Y. Ni ◽  
A.M. Zhang ◽  
G.X. Wu
Keyword(s):  
Free Surface ◽  
Bubble Bursting

Numerical Study on Bubble Bursting at Free Surface by CIP Method

2000 ◽  
Vol 2000.13 (0) ◽  
pp. 117-118
Author(s):  
Takashi SUZUKI ◽  
Koshi MITACHI ◽  
Ryoko NAKANO
Keyword(s):  
Free Surface ◽  
Numerical Study ◽  
Cip Method ◽  
Bubble Bursting

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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