Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
2017 ◽
Vol 73
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pp. 42-53
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2007 ◽
Vol 129
(4)
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pp. 421-426
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2019 ◽
Vol 146
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pp. 2209-2213
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2014 ◽
Vol 38
(11-12)
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pp. 2848-2866
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Keyword(s):
2005 ◽
Vol 11
(5-6)
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pp. 103-110
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