2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

363
(FIVE YEARS 363)

H-INDEX

6
(FIVE YEARS 6)

Published By IEEE

9781728114996
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Improving the Solder Wettability Via Atmospheric Plasma Technology

2019 ◽  
Author(s):  
Sagung Dewi Kencana ◽  
Yu-Lin Kuo ◽  
Yee-Wen Yen ◽  
Eckart Schellkes ◽  
Wallace Chuang
Keyword(s):  
Atmospheric Plasma ◽  
Plasma Technology

Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics

2019 ◽  
Author(s):  
Rajesh Sharma Sivasubramony ◽  
Ashwin Varkey Zachariah ◽  
Mohammed Alhendi ◽  
Manu Yadav ◽  
Peter Borgesen ◽  
...  
Keyword(s):  
Highly Stretchable ◽  
Stretchable Interconnects

Sub-Micron RDL Patterning for Advanced Packaging

2019 ◽  
Author(s):  
Ken-Ichiro Mori ◽  
Yoshio Goto ◽  
Yasuo Hasegawa ◽  
Seiya Miura ◽  
Douglas Shelton
Keyword(s):  
Advanced Packaging

Structuring of Laser Activated Polymers for Sensor Applications

2019 ◽  
Author(s):  
Sebastian Bengsch ◽  
Maximilian Aue ◽  
Kevin Cromwell ◽  
-Ing. Wurz ◽  
Marc Christopher
Keyword(s):  
Sensor Applications

Integrating Solid State Protection with a RF-MEMS Switch for Achieving ESD Robustness

2019 ◽  
Author(s):  
Srivatsan Parthasarathy ◽  
Padraig Fitzgerald ◽  
Javier Salcedo ◽  
Ray Goggin ◽  
Jean-Jacques Hajjar
Keyword(s):  
Solid State ◽  
Rf Mems ◽  
Rf Mems Switch ◽  
Mems Switch ◽  
State Protection

Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

2019 ◽  
Author(s):  
Toshiki Iwai ◽  
Taiji Sakai ◽  
Daisuke Mizutani ◽  
Seiki Sakuyama ◽  
Kenji Iida ◽  
...  
Keyword(s):  
Glass Substrate ◽  
High Density
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