scholarly journals Opportunities and challenges for spintronics in the microelectronics industry

2020 ◽  
Vol 3 (8) ◽  
pp. 446-459 ◽  
Author(s):  
B. Dieny ◽  
I. L. Prejbeanu ◽  
K. Garello ◽  
P. Gambardella ◽  
P. Freitas ◽  
...  
Keyword(s):  
Microelectronics Industry

In situ observations of electromigration induced void behavior

1995 ◽  
Vol 53 ◽  
pp. 244-245
Author(s):  
T. Marieb ◽  
J. C. Bravman ◽  
P. Flinn ◽  
D. Gardner ◽  
M. Madden
Keyword(s):  
Electron Microscopy ◽  
Void Nucleation ◽  
Plan View ◽  
Transmission Electron ◽  
Nucleation Sites ◽  
Microelectronics Industry ◽  
In Situ Observations ◽  
Backscatter Electron Detector ◽  
Voltage Scanning

Electromigration and stress voiding have been active areas of research in the microelectronics industry for many years. While accelerated testing of these phenomena has been performed for the last 25 years[1-2], only recently has the introduction of high voltage scanning electron microscopy (HVSEM) made possible in situ testing of realistic, passivated, full thickness samples at high resolution.With a combination of in situ HVSEM and post-testing transmission electron microscopy (TEM) , electromigration void nucleation sites in both normal polycrystalline and near-bamboo pure Al were investigated. The effect of the microstructure of the lines on the void motion was also studied.The HVSEM used was a slightly modified JEOL 1200 EX II scanning TEM with a backscatter electron detector placed above the sample[3]. To observe electromigration in situ the sample was heated and the line had current supplied to it to accelerate the voiding process. After testing lines were prepared for TEM by employing the plan-view wedge technique [6].

Identifying groups of airborne particles by ordination

1994 ◽  
Vol 52 ◽  
pp. 856-857
Author(s):  
M. Shlepr ◽  
C. M. Vicroy
Keyword(s):  
Elemental Analysis ◽  
Energy Dispersive Spectroscopy ◽  
Manufacturing Process ◽  
Spatial Representation ◽  
Airborne Particles ◽  
Common Source ◽  
Data Set ◽  
Microelectronics Industry ◽  
Induced Changes ◽  
Source Materials

The microelectronics industry is heavily tasked with minimizing contaminates at all steps of the manufacturing process. Particles are generated by physical and/or chemical fragmentation from a mothersource. The tools and macrovolumes of chemicals used for processing, the environment surrounding the process, and the circuits themselves are all potential particle sources. A first step in eliminating these contaminants is to identify their source. Elemental analysis of the particles often proves useful toward this goal, and energy dispersive spectroscopy (EDS) is a commonly used technique. However, the large variety of source materials and process induced changes in the particles often make it difficult to discern if the particles are from a common source.Ordination is commonly used in ecology to understand community relationships. This technique usespair-wise measures of similarity. Separation of the data set is based on discrimination functions. Theend product is a spatial representation of the data with the distance between points equaling the degree of dissimilarity.

INDALLOY 7

Alloy Digest ◽  
1978 ◽  
Vol 27 (9) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
Heat Treating ◽  
Microelectronics Industry

Abstract INDALLOY No. 7 is a solder (50% indium-50% lead) that drastically reduces gold scavenging when used to solder components to gold-coated substrates in place of conventional (63% tin-37% lead) solder. Thus it has had obvious applications in the hybrid microelectronics industry. This datasheet provides information on composition, physical properties, microstructure, hardness, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: In-2. Producer or source: Indium Corporation of America.

scholarly journals Applications of synchrotron X-rays in microelectronics industry research

2005 ◽  
Vol 241 (1-4) ◽  
pp. 247-252 ◽  
Author(s):  
Jean L. Jordan-Sweet ◽  
Christophe Detavernier ◽  
Christian Lavoie ◽  
Patricia M. Mooney ◽  
Michael F. Toney
Keyword(s):  
X Rays ◽  
Industry Research ◽  
Microelectronics Industry

Novel Chemical Route to Size-Controlled Ta(0) and Ru-Ta Nanoparticles in Ionic Liquids

2012 ◽  
Vol 1473 ◽  
Author(s):  
Inga S. Helgadottir ◽  
Philippe P. Arquillière ◽  
Paul S. Campbell ◽  
Catherine C. Santini ◽  
P.-H. Haumesser
Keyword(s):  
Ionic Liquids ◽  
Melting Point ◽  
Metallic Nanoparticles ◽  
Room Temperature ◽  
Chemical Route ◽  
High Interest ◽  
Microelectronics Industry ◽  
Synthetic Routes ◽  
Size Controlled

ABSTRACTMetallic nanoparticles under 10 nm are of particular interest for the microelectronics industry. However, there is a lack of convenient synthetic routes to control their size Oxophilic metals, such as Ta, are also of high interest, however, the high oxophilicity and melting point makes the synthesis of such nanoparticles challenging. Making use of imidazolium-based ionic liquids, monodisperse zero-valent tantalum nanoparticles (Ta(0)NPs) have been successfully synthesised at room temperature by reduction of tris(neopentyl)neopentylidenetantalum(V). Furthermore; well size-controlled bimetallic Ru-Ta NPs have also been synthesized.

Microelectronics, industry, and the third world

Futures ◽  
1980 ◽  
Vol 12 (4) ◽  
pp. 289-302 ◽  
Author(s):  
Kurt Hoffman ◽  
Howard Rush
Keyword(s):  
Third World ◽  
The Third ◽  
Microelectronics Industry ◽  
The Third World
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