scholarly journals Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver.

2018 ◽  
Vol 1082 ◽  
pp. 012055
Author(s):  
S.F. Lim ◽  
M.S. Nurulakmal
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Surface Evolver ◽  
Solder Interconnect ◽  
Free Solder

Process characterization of PCB assembly using 0201 packages with lead‐free solder

2003 ◽  
Vol 15 (2) ◽  
pp. 22-27 ◽  
Author(s):  
David Geiger ◽  
Fredrik Mattsson ◽  
Dongkai Shangguan ◽  
MT Ong ◽  
Patrick Wong ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Pcb Assembly ◽  
Process Characterization ◽  
Free Solder

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

Study on PLCC Lead Free Solder Joint's Thermal Reliability Based on Shape Prediction and Response Surface Methodology

2013 ◽  
Vol 706-708 ◽  
pp. 1697-1700 ◽  
Author(s):  
Jing Zhu ◽  
Zhao Hua Wu
Keyword(s):  
Response Surface Methodology ◽  
Response Surface ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Reliability ◽  
Surface Evolver ◽  
Fatigue Lifetime ◽  
Shape Prediction ◽  
Free Solder

In this paper, PLCC lead free solder joint’s thermal fatigue lifetime is analyzed by using the Response Surface Methodology, combined with solder joint’s shape prediction and finite element simulation. Three key solder joint’s process parameters, pad length, gap height and solder paste’s volume are chosen to build an orthogonal array , 25 PLCC lead free SAC305 solder joint’s models with different parameters combination are built in Surface Evolver to predict the solder joint’s shape. Then the PLCC device’s surface shape models in Surface Evolver are converted to three-dimensional finite element models by using a special method. Thermal analyses give the distribution and the change of thermal stress and strain, which show the dangerous solder joint in the whole PLCC device and position with weak thermal reliability in single solder joint. Furthermore, the PLCC solder joints’ thermal fatigue lifetime are calculated with the modified Coffin-Manson equation, and the series of thermal fatigue lifetime data are processed by the Response Surface Methodology. Regression equation between thermal fatigue lifetime and the three key factors is concluded. With the solder joint’s influencing rule on thermal fatigue lifetime and the solder joint’s process parameter combination belong to the highest thermal fatigue lifetime, assembly process of PLCC is improved and then enhance the PLCC solder joint’s reliability.

Fundamentals of Lead-Free Solder Interconnect Technology

2015 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Thomas R. Bieler ◽  
Choong-Un Kim ◽  
Hongtao Ma
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Interconnect ◽  
Free Solder ◽  
Interconnect Technology
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