Tape ball grid array package analysis

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853436 ◽

2002 ◽

Author(s):

Y.P. Wang ◽

T.D. Her

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507785 ◽

2008 ◽

Author(s):

Victor Lim ◽

Ibrahim Ahmad ◽

Foong Chee Seng ◽

Nowshad Amin ◽

Rozaidi Rasid

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Catalytic Activation ◽

Heat Spreaders ◽

Ball Grid Array Package

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A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.926382 ◽

2001 ◽

Vol 24 (2) ◽

pp. 191-198 ◽

Author(s):

S. Shidore ◽

V. Adams ◽

T.T. Lee

Keyword(s):

Thermal Model ◽

Flip Chip ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Ceramic ball grid array package stress analysis

10.1063/1.5002485 ◽

2017 ◽

Author(s):

S. H. B. S. Badri ◽

M. H. A. Aziz ◽

N. R. Ong ◽

Z. Sauli ◽

J. B. Alcain ◽

...

Keyword(s):

Stress Analysis ◽

Ball Grid Array ◽

Ceramic Ball ◽

Ball Grid Array Package

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Review on the Ball Drop-off Mechanisms of Lead-free Ball Grid Array Package

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783838 ◽

2008 ◽

Author(s):

Charlie Tsung-hsing Lu

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Ball Grid Array Package

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Electrical performance trade-offs in ball grid array package designs

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526196 ◽

2002 ◽

Author(s):

K.N. Wang ◽

J.M. Adam ◽

P.A. Dziekowicz

Keyword(s):

Ball Grid Array ◽

Electrical Performance ◽

Ball Grid Array Package

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Popcorn phenomena in a ball grid array package

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.404107 ◽

1995 ◽

Vol 18 (3) ◽

pp. 491-495 ◽

Author(s):

Seung-Ho Ahn ◽

Young-Shin Kwon

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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A new breed of ball grid array package

10.1109/wptmt.1994.763535 ◽

2005 ◽

Author(s):

Seung-Ho Ahn ◽

Gu-Sung Kim

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.257 ◽

2016 ◽

Author(s):

Yaojian Lin ◽

Chen Kang ◽

Linda Chua ◽

Won Kyung Choi ◽

Seung Wook Yoon

Keyword(s):

Ball Grid Array ◽

Wafer Level ◽

Ball Grid Array Package

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Thermal evaluation of a cost-effective plastic ball grid array package-NuBGA

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606186 ◽

2002 ◽

Author(s):

F. Wu ◽

J. Lau ◽

K.-L. Chen

Keyword(s):

Cost Effective ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Analysis of a thermally enhanced ball grid array package

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.477460 ◽

1995 ◽

Vol 18 (4) ◽

pp. 749-757 ◽

Author(s):

B.M. Guenin ◽

R.C. Marrs ◽

R.J. Molnar

Keyword(s):

Ball Grid Array ◽

Ball Grid Array Package

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