Adhesion Study of Copper Layer Deposited onto Liquid Crystalline Polymer for Electronic Packaging
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1990 ◽
Vol 48
(4)
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pp. 1092-1093
1992 ◽
1995 ◽
Vol 60
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pp. 1869-1874
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2005 ◽
Vol 443
(1)
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pp. 127-135
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