Study of thermal fatigue lifetime of fan-in package on package (FiPoP) by finite element analysis

Author(s):  
Xueyou Yan ◽  
Guoyuan Li
2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung

2007 ◽  
Vol 345-346 ◽  
pp. 1453-1456
Author(s):  
Byoung Ho Choi ◽  
Dong Ho Joo ◽  
Sam Hong Song

The fatigue characteristic of triple spot welded SPCC plates with the variation of the thickness and the geometry under tensile-shear loading is studied by finite element analysis (FEA) and the obtained data is compared with experimental data. Using 3-D solid element model and 3-D beam-shell model, the maximum equivalent stress and the beam deformation angle (BDA) for various thickness and geometry is studied. The linear relation between crack opening angle (COA) from experiment and the BDA from FEA for beam-shell model is represented, and the empirical prediction of fatigue lifetime is proposed using the relation between COA and BDA.


2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad A. Gharaibeh

PurposeThis paper aims to examine the thermal cycling fatigue life performance of two-common solder array configurations, full and peripheral, using three-dimensional nonlinear finite element analysis.Design/methodology/approachThe finite element simulations were used to identify the location of the critical solder interconnect, and using Darveaux's model, solder thermal fatigue life was computed.FindingsThe results showed that the solder array type does not significantly influence thermal fatigue life of the interconnect. However, smaller size packages result in improved life by almost 45% compared to larger package designs. Additionally, this paper provided an engineered study on the effect of the number of rows available in a perimeter array component on solder thermal fatigue performance.Originality/valueGeneral design recommendations for reliable electronic assemblies under thermal cycling loaded were offered in this research.


2010 ◽  
Vol 26 ◽  
pp. e50 ◽  
Author(s):  
Y. Duan ◽  
P.A. Kulkarni ◽  
J.A. Gonzalez ◽  
W.W. Nagy ◽  
J.A. Griggs

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