Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

2016 ◽  
Author(s):  
Yu-An Shen ◽  
Chih Chen
Keyword(s):  
Intermetallic Compounds ◽  
Grain Orientation ◽  
Sn Grain Orientation

Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

2013 ◽  
Vol 114 (15) ◽  
pp. 153509 ◽  
Author(s):  
Jian-Qiang Chen ◽  
Jing-Dong Guo ◽  
Kai-Lang Liu ◽  
Jian-Ku Shang
Keyword(s):  
Grain Orientation ◽  
Solder Joints ◽  
Sn Grain Orientation

Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint

2014 ◽  
Vol 95 ◽  
pp. 166-171 ◽  
Author(s):  
Jie-Shi Chen ◽  
Meng-Jia Xu ◽  
Yu-Jing Jin ◽  
Kai-Yun Wang ◽  
Yu Chun ◽  
...  
Keyword(s):  
Solder Joint ◽  
Electric Field ◽  
Grain Orientation ◽  
Sn Grain Orientation
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