2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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115

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3

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9781509047697

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Novel design for high thermal performance and SMT process yield QFP

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800008 ◽

2016 ◽

Author(s):

Ian Hu ◽

P. C. Liu

Keyword(s):

Thermal Performance ◽

Process Yield ◽

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A dual band divide by four frequency divider for biomedical sensor and wearable applications

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800014 ◽

2016 ◽

Author(s):

Wen-Cheng Lai ◽

Sheng-Lyang Jang ◽

Cheng-Lin Li

Keyword(s):

Frequency Divider ◽

Dual Band ◽

Biomedical Sensor

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Grain growth of (111) nanotwined Cu on (100)-oriented Cu films

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800027 ◽

2016 ◽

Author(s):

Hsin-Yong Liu ◽

Chih Chen

Keyword(s):

Grain Growth ◽

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Advanced materials with low dielectric properties and highly thermal conductivity

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800072 ◽

2016 ◽

Author(s):

Wen-Pin Ting ◽

Feng-Po Tseng ◽

Kuo-Chan Chiou

Keyword(s):

Thermal Conductivity ◽

Dielectric Properties ◽

Advanced Materials ◽

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Inkjet printing of nano-silver conductive lines on polyimide substrates

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800018 ◽

2016 ◽

Author(s):

Chia-Yen Chan ◽

Kuan-Cheng Shih ◽

Ting-Ming Huang

Keyword(s):

Inkjet Printing ◽

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Component drop-off caused by gold embrittlement

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800012 ◽

2016 ◽

Author(s):

Chun-Chi Chiu ◽

Hsun-Fa Li

Keyword(s):

Gold Embrittlement

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Observation and analysis of metal oxide reduction by formic acid for soldering

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7799990 ◽

2016 ◽

Author(s):

Naoto Ozawa ◽

Tatsuo Okubo ◽

Jun Matsuda ◽

Tatsuo Sakai

Keyword(s):

Metal Oxide ◽

Formic Acid ◽

Oxide Reduction ◽

Metal Oxide Reduction

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The new vertical continuous transport equipment, U-VCPS

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800006 ◽

2016 ◽

Author(s):

Jl. Huang ◽

Ken Wang

Keyword(s):

Transport Equipment

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CFD analysis about surface roughness dependence of thermal contact resistance

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7799993 ◽

2016 ◽

Author(s):

Tomoyuki Hatakeyama ◽

Risako Kibushi ◽

Masaru Ishizuka

Keyword(s):

Surface Roughness ◽

Contact Resistance ◽

Thermal Contact Resistance ◽

Thermal Contact ◽

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Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800040 ◽

2016 ◽

Author(s):

Yu-An Shen ◽

Chih Chen

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Sn Grain Orientation

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