Regulated cooling for reduced thermal cycling of power devices

2012 ◽  
Author(s):  
Xiang Wang ◽  
Alberto Castellazzi ◽  
Pericle Zanchetta
Keyword(s):  
Thermal Cycling ◽  
Power Devices

Reliability Analysis for Power Devices Which Undergo Fast Thermal Cycling

2016 ◽  
Vol 16 (3) ◽  
pp. 336-344 ◽  
Author(s):  
Dan Simon ◽  
Cristian Boianceanu ◽  
Gilbert De Mey ◽  
Vasile Topa ◽  
Andreas Spitzer
Keyword(s):  
Thermal Cycling ◽  
Reliability Analysis ◽  
Power Devices

Reliability study of thermal cycling stress on smart power devices

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EP12 ◽  
Author(s):  
Ming Zhang ◽  
Yasuki Yoshihisa ◽  
Keiichi Furuya ◽  
Yukari Imai ◽  
Kenichi Hatasako ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Reliability Study ◽  
Smart Power

Fracture Process of Aluminum/Aluminum Nitride Interfaces during Thermal Cycling

2010 ◽  
Vol 638-642 ◽  
pp. 3895-3900 ◽  
Author(s):  
Yoshiyuki Nagatomo ◽  
Ryo Muranaka ◽  
Hiromasa Hayashi ◽  
Yoshirou Kuromitsu ◽  
Noriyuki Kuwano
Keyword(s):  
Thermal Cycling ◽  
Fracture Process ◽  
Bending Test ◽  
Power Devices ◽  
Cross Sectional ◽  
Fine Grained ◽  
Backscattered Electron ◽  
Shear Strains ◽  
Device Operation ◽  
Scanning Electron

Al circuit substrates, which are composed of a sintered AlN plate and pure Al plate joined to both sides of the AlN plate, are used for semiconductor power devices. It is important to prevent fracture of the Al/AlN interface to ensure normal and stable device operation. In this study, the fracture process of Al/AlN interface during thermal cycling was investigated using advanced scanning electron microscopy (SEM). Al circuits joined to an AlN plate were plastically deformed with thermal cycling. Al grains were divided with the formation of sub-boundaries due to the plastic deformation. After 2000 thermal cycles, a crack was generated at edges of the Al/AlN interface and propagated gradually to the center of the substrate. Cross-sectional observation, using an angle selective backscattered electron detector (AsB), revealed that the Al grain size near the Al/AlN interface decreased to 3 m or less, and the crack proceeded along the Al grain boundaries. To clarify the temperature dependence of the fracture process, a repeated bending test was performed at various temperatures. Shear strains were induced at the Al/AlN interface by the repeated bending. The rate of crack propagation tends to be higher at higher temperatures for bending test. In substrates bent at 373 K or higher, the crack proceeded after the Al grains had been refined. These results indicate that fine-grained Al resulting from thermal cycling is formed by creep deformation and recrystallization at higher temperatures. Thus, improving the creep strength of the Al plate is thought to be effective for prevent cracking during thermal cycling. The effect of additive elements in the Al plate was also discussed in this study.

scholarly journals Experimental Reliability Improvement of Power Devices Operated Under Fast Thermal Cycling

2015 ◽  
Vol 36 (7) ◽  
pp. 696-698 ◽  
Author(s):  
Dan Simon ◽  
Cristian Boianceanu ◽  
Gilbert De Mey ◽  
Vasile Topa
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Reliability Improvement

PENGARUH THERMAL CYCLING TERHADAP PERUBAHAN DIMENSI DAN STABILITAS WARNA BAHAN BASIS GIGI TIRUAN NILON TERMOPLASTIK

2015 ◽  
Vol 18 (3) ◽  
pp. 280-284
Author(s):  
Dwi Tjahyaning Putranti ◽  
Oktia Kiki Triana
Keyword(s):  
Thermal Cycling

Nilon termoplastik sebagai bahan basis gigi tiruan mulai menjadi pilihan perawatan. Salah satu sifat fisis nilontermoplastik yang menjadi perhatian dalam penggunaannya sebagai bahan basis gigi tiruan adalah stabilitas dimensi danstabilitas warna. Penggunaan basis gigi tiruan di rongga mulut dalam waktu tertentu akan mengakibatkan berbagaiperubahan sifat bahan. Salah satu metode yang dapat digunakan untuk mengevaluasi sifat suatu bahan yaitu thermalcycling. Sampel dibuat sesuai ADA No. 12 untuk uji perubahan dimensi dan ISO No. 1567 untuk uji stabilitas warna.Thermal cycling 70 cycles dan 300 cycles dilakukan pada masing-masing sampel perlakuan. Hasil uji dianalisismenggunakan uji ANOVA untuk mengetahui pengaruh thermal cycling terhadap perubahan dimensi dan stabilitas warnayang menunjukkan hasil signifikan (p < 0,05) dibandingkan kelompok kontrol, serta uji LSD yang menunjukkan terdapatperbedaan pengaruh thermal cycling terhadap perubahan dimensi dan stabilitas warna bahan basis gigi tiruan nilontermoplastik. Thermal cycling 70 cycle dan 300 cycle pada bahan basis gigi tiruan nilon termoplastik dapat meningkatkannilai perubahan dimensi dan menurunkan nilai stabilitas warna bahan basis gigi tiruan nilon termoplastik. Kesimpulan,penggunaan gigi tiruan selama 1 minggu dibandingkan 1 bulan menyebabkan perubahan dimensi semakin besar danberkurangnya stabilitas warna pada basis gigi tiruan nilon termoplastik.

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