Thermomechanical reliability of Ag flake paste for die-attached power devices in thermal cycling

2013 ◽  
Author(s):  
Soichi Sakamoto ◽  
Shijo Nagao ◽  
Katsuaki Suganuma
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Thermomechanical Reliability

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

2005 ◽  
Vol 128 (3) ◽  
pp. 208-214 ◽  
Author(s):  
John G. Bai ◽  
Jesus N. Calata ◽  
Guo-Quan Lu
Keyword(s):  
Thermal Cycling ◽  
Solder Bump ◽  
Coefficient Of Thermal Expansion ◽  
Operating Temperature ◽  
Power Device ◽  
Element Analysis ◽  
Temperature Changes ◽  
Power Cycling ◽  
Thermomechanical Reliability ◽  
Cycling Experiment

Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling experiment and finite element analysis (FEA). The SB interconnection shows superior reliability over the DS interconnection in the thermal cycling experiment because the mismatched coefficient of thermal expansion leads to smaller stresses at the SB interconnection under the same temperature changes. On the other hand, FEA results show that the DS package has significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis.

Reliability Analysis for Power Devices Which Undergo Fast Thermal Cycling

2016 ◽  
Vol 16 (3) ◽  
pp. 336-344 ◽  
Author(s):  
Dan Simon ◽  
Cristian Boianceanu ◽  
Gilbert De Mey ◽  
Vasile Topa ◽  
Andreas Spitzer
Keyword(s):  
Thermal Cycling ◽  
Reliability Analysis ◽  
Power Devices

Reliability study of thermal cycling stress on smart power devices

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EP12 ◽  
Author(s):  
Ming Zhang ◽  
Yasuki Yoshihisa ◽  
Keiichi Furuya ◽  
Yukari Imai ◽  
Kenichi Hatasako ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Reliability Study ◽  
Smart Power

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

2007 ◽  
Vol 129 (4) ◽  
pp. 427-433 ◽  
Author(s):  
Krishna Tunga ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Cycling ◽  
Experimental Technique ◽  
Electronic Packages ◽  
Solder Balls ◽  
Bga Package ◽  
Accelerated Thermal Cycling ◽  
Thermal Cycling Fatigue ◽  
Number Of Cycles ◽  
Thermomechanical Reliability ◽  
Ball Grid Array Packages

Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques are continuously being sought. This paper outlines a laser-moiré based experimental technique to quickly assess the thermal cycling reliability of microelectronic packages. Unlike accelerated thermal cycling that takes several months to complete, the proposed technique takes one to two weeks to complete and does not suffer from various modeling assumptions used in finite-element simulations. The developed technique has been used to determine the thermomechanical reliability of organic and ceramic ball grid array packages, and it is shown that the number of cycles determined by the proposed technique is comparable to the number of cycles determined through accelerated thermal cycling.

Fracture Process of Aluminum/Aluminum Nitride Interfaces during Thermal Cycling

2010 ◽  
Vol 638-642 ◽  
pp. 3895-3900 ◽  
Author(s):  
Yoshiyuki Nagatomo ◽  
Ryo Muranaka ◽  
Hiromasa Hayashi ◽  
Yoshirou Kuromitsu ◽  
Noriyuki Kuwano
Keyword(s):  
Thermal Cycling ◽  
Fracture Process ◽  
Bending Test ◽  
Power Devices ◽  
Cross Sectional ◽  
Fine Grained ◽  
Backscattered Electron ◽  
Shear Strains ◽  
Device Operation ◽  
Scanning Electron

Al circuit substrates, which are composed of a sintered AlN plate and pure Al plate joined to both sides of the AlN plate, are used for semiconductor power devices. It is important to prevent fracture of the Al/AlN interface to ensure normal and stable device operation. In this study, the fracture process of Al/AlN interface during thermal cycling was investigated using advanced scanning electron microscopy (SEM). Al circuits joined to an AlN plate were plastically deformed with thermal cycling. Al grains were divided with the formation of sub-boundaries due to the plastic deformation. After 2000 thermal cycles, a crack was generated at edges of the Al/AlN interface and propagated gradually to the center of the substrate. Cross-sectional observation, using an angle selective backscattered electron detector (AsB), revealed that the Al grain size near the Al/AlN interface decreased to 3 m or less, and the crack proceeded along the Al grain boundaries. To clarify the temperature dependence of the fracture process, a repeated bending test was performed at various temperatures. Shear strains were induced at the Al/AlN interface by the repeated bending. The rate of crack propagation tends to be higher at higher temperatures for bending test. In substrates bent at 373 K or higher, the crack proceeded after the Al grains had been refined. These results indicate that fine-grained Al resulting from thermal cycling is formed by creep deformation and recrystallization at higher temperatures. Thus, improving the creep strength of the Al plate is thought to be effective for prevent cracking during thermal cycling. The effect of additive elements in the Al plate was also discussed in this study.

scholarly journals Experimental Reliability Improvement of Power Devices Operated Under Fast Thermal Cycling

2015 ◽  
Vol 36 (7) ◽  
pp. 696-698 ◽  
Author(s):  
Dan Simon ◽  
Cristian Boianceanu ◽  
Gilbert De Mey ◽  
Vasile Topa
Keyword(s):  
Thermal Cycling ◽  
Power Devices ◽  
Reliability Improvement
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