A 3x3mm2 embedded-wafer-level packaged WCDMA GaAs HBT power amplifier module with integrated Si DC power management IC

2008 ◽  
Author(s):  
Gary Hau ◽  
Shih Hsu ◽  
Yutaka Aoki ◽  
Takeshi Wakabayashi ◽  
Naoki Furuhata ◽  
...  
Keyword(s):  
Power Management ◽  
Power Amplifier ◽  
Wafer Level ◽  
Dc Power ◽  
Power Management Ic

A New Power Management IC Architecture for Envelope Tracking Power Amplifier

2011 ◽  
Vol 59 (7) ◽  
pp. 1796-1802 ◽  
Author(s):  
Jinsung Choi ◽  
Dongsu Kim ◽  
Daehyun Kang ◽  
Bumman Kim
Keyword(s):  
Power Management ◽  
Power Amplifier ◽  
Envelope Tracking ◽  
Power Management Ic

Reflection-Type RTD Low-Power Amplifier With Deep Sub-mW DC Power Consumption

2014 ◽  
Vol 24 (8) ◽  
pp. 551-553 ◽  
Author(s):  
Jongwon Lee ◽  
Jooseok Lee ◽  
Kyounghoon Yang
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Power Amplifier ◽  
Dc Power

Power Management for Wafer-Level Test During Burn-In

2008 ◽  
Author(s):  
Sudarshan Bahukudumbi ◽  
Krishnendu Chakrabarty
Keyword(s):  
Power Management ◽  
Wafer Level

Crown Defect Reduction and Cp Yield Improvement for High Voltage Power Management IC Product

2019 ◽  
Vol 27 (1) ◽  
pp. 377-382
Author(s):  
Guan-Qun Zhang ◽  
Athics Gu ◽  
Yi-Hui Lin ◽  
Peng Sun ◽  
Jiwei Zhang ◽  
...  
Keyword(s):  
Power Management ◽  
High Voltage ◽  
Yield Improvement ◽  
Defect Reduction ◽  
Power Management Ic
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