SiC via fabrication for wide-band-gap high electron mobility transistor/microwave monolithic integrated circuit devices

Author(s):  
L. F. Voss ◽  
K. Ip ◽  
S. J. Pearton ◽  
R. J. Shul ◽  
M. E. Overberg ◽  
...  
2015 ◽  
Vol 117 (22) ◽  
pp. 225702 ◽  
Author(s):  
Anshu Goyal ◽  
Ashok K. Kapoor ◽  
R. Raman ◽  
Sandeep Dalal ◽  
Premila Mohan ◽  
...  

Materials ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1599 ◽  
Author(s):  
Fabrizio Roccaforte ◽  
Giuseppe Greco ◽  
Patrick Fiorenza ◽  
Ferdinando Iucolano

Today, the introduction of wide band gap (WBG) semiconductors in power electronics has become mandatory to improve the energy efficiency of devices and modules and to reduce the overall electric power consumption in the world. Due to its excellent properties, gallium nitride (GaN) and related alloys (e.g., AlxGa1−xN) are promising semiconductors for the next generation of high-power and high-frequency devices. However, there are still several technological concerns hindering the complete exploitation of these materials. As an example, high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures are inherently normally-on devices. However, normally-off operation is often desired in many power electronics applications. This review paper will give a brief overview on some scientific and technological aspects related to the current normally-off GaN HEMTs technology. A special focus will be put on the p-GaN gate and on the recessed gate hybrid metal insulator semiconductor high electron mobility transistor (MISHEMT), discussing the role of the metal on the p-GaN gate and of the insulator in the recessed MISHEMT region. Finally, the advantages and disadvantages in the processing and performances of the most common technological solutions for normally-off GaN transistors will be summarized.


2014 ◽  
Vol 2 (17) ◽  
pp. 6042-6050 ◽  
Author(s):  
M. A. Moram ◽  
S. Zhang

ScAlN and ScGaN alloys are wide band-gap semiconductors which can greatly expand the options for band gap and polarisation engineering required for efficient III-nitride optoelectronic devices, high-electron mobility transistors and energy-harvesting devices.


2000 ◽  
Vol 39 (Part 1, No. 4B) ◽  
pp. 2468-2472 ◽  
Author(s):  
Munenari Kawashima ◽  
Hitoshi Hayashi ◽  
Hiroyuki Fukuyama ◽  
Hiroshi Okazaki ◽  
Hideaki Matsuzaki ◽  
...  

2019 ◽  
Vol 217 (7) ◽  
pp. 1900694
Author(s):  
Uiho Choi ◽  
Donghyeop Jung ◽  
Kyeongjae Lee ◽  
Taemyung Kwak ◽  
Taehoon Jang ◽  
...  

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