A Hybrid Antenna in Package Solution Using FOWLP Technology

Widespread millimeter wave applications have promoted rapid development of System in Package (SiP) and Antenna in Package (AiP). Most AiP structures take the form of flip chip on antenna substrate, where interconnect losses are caused by solder bumps, and manufacturing difficulties may be encountered for chips with fine pad pitches. Fan-out wafer level package (FOWLP) with antenna patterning on Redistributed Layers (RDL) is another method for mm-wave AiP realization. In this project a hybrid integration AiP structure is developed. The Microwave Monolithic Integrated Circuit (MMIC) chip and antenna unit are integrated with chip-first FOWLP process. By using multilayer organic substrate and fine pitch RDL interconnection, proper antenna performance and lower transmission loss can be achieved. Modified coplanar waveguide is adopted to feed 2x2 aperture array formed on RDL. Package warpage is evaluated using ANSYS and Shadow Moire measurement. The antenna realizes bandwidth 25% and gain 8.5dBi using aperture-coupled stacked patch for 60GHz digital communication system. The proposed approach is a convenient solution for the hybrid integration of millimeter wave AiP systems.

GaN low-noise X-band MMIC amplifier.

The purpose of this paper is to design a microwave monolithic integrated circuit (MMIC) for low noise amplifier (LNA) X-band (7-12 GHz) based on technology of gallium nitride (GaN) high electron mobility transistor (HEMT) with a T-gate, which has 100 nm width, on a silicon (Si) semi-insulating substrate of the OMMIC company. The amplifier is based on common-source transistors with series feedback, which was formed by high-impedance transmission line, and with parallel feedback to match noise figure and power gain. The key characteristics of an LNA are noise figure and gain. However, in this paper, it was decided to design the LNA, which should have a good margin in terms of input and output power. As a result, GaN technology was chosen, which has a higher noise figure compared to other technologies, but eliminates the need for an input power limiter, which in turn significantly increases the overall noise figure. As a result LNA MMIC was developed with the following characteristics: noise figure less than 1.6 dB, small-signal gain more than 20 dB, return loss better than -13 dB and output power more than 19 dBm with 1 dB compression in the range from 7 to 12 GHz in dimensions 2x1.5 mm², which has a supply voltage of 8 V and a current consumption of less than 70 mA. However, it should be said that LNA was only modeled in the AWR DE.

Shielding Device for Microwave Electronic Components of a Multilayer Board for the AFAR Transceiver Module for Space Purposes

A method of shielding the elements of a microwave module based on the principles of forming a Faraday cage, with different power and different frequency paths of the AFAR receiving-transmitting module, excluding their mutual electromagnetic influence, is presented. A description of the structure of a multilayer board and various structural elements is given, allowing to limit (screen) the signal in a small volume, commensurate with the size of a monolithic integrated circuit or a set of monolithic integrated circuits, isolating parasitic electromagnetic interference. Polyimide is considered as a dielectric material of a multilayer microwave board for use in space technology devices, as well as promising design solutions for reducing the mass and dimensions of the module.

РАЗРАБОТКА ФАЗИРОВАННОЙ АНТЕННОЙ РЕШЕТКИ ДЛЯ СИСТЕМЫ СВЯЗИ ПЯТОГО ПОКОЛЕНИЯ ДИАПАЗОНА НИЖЕ 6 ГГЦ

В докладе представлены результаты исследования и разработки активной фазированной антенной решетки (АФАР) на основе кремниевой монолитной интегральной схемы (МИС) управления амплитудой и фазой сигнала, а также печатных антенных излучателей диапазона частот ниже 6 ГГц. The article deals with research and development results of an active electronically scanned antenna (AESA) based on silicon monolithic integrated circuit (MIC) for amplitude and phase control, as well as printed antennas of sub-6 GHz frequency band.

Design of patch active electronically scanned antenna for 5G communication system

The article deals with the research and design results of an active electronically scanned antenna (AESA) based on beamforming BiCMOS monolithic integrated circuit (MIC) and patch antenna radiators. The operating frequency band is sub-6 GHz. MIC design is at the stage of transferring files to the manufacture and verification of integrated circuit parameters. In this regard, the current task is the antenna radiators design, that is the main focus of this paper.

MMIC on-Wafer Test Method Based on Hybrid Balanced and Unbalanced RF Pad Structures

Nowadays, more and more MMICs (Microwave Monolithic Integrated Circuit), such as limiters and switches, are designed to have balanced and unbalanced test pad structures to solve the challenging size restrictions and integration requirements for MMICs. Hybrid balanced and unbalanced RF (Radio Frequency) probes are adopted for an on-wafer test of the heteromorphy structures. The thru standard based on single balanced or unbalanced structures cannot meet the impedance matching requirements of the hybrid RF probes at the same time, which leads to a dramatic decreasing of the calibration accuracy and cannot satisfy the requirement of MMIC test. Therefore, in this paper, the calibration error estimating of hybrid RF probes based on traditional SOLR (Short Open Load Reciprocal) calibration method is performed, and an on-wafer test approach of MMIC based on hybrid balanced and unbalanced RF probes is proposed which combines the OSL (Open Short Load) second-order de-embedding technique with vector error correction and the matrix transformation technique. The calibration reference plane can be accurately shifted to the probe tip with this method, which greatly improves the test accuracy, and an automatic test system is built for this method based on the object-oriented C# language.