In Situ Electrochemical Investigation of Tungsten Electrochemical Behavior during Chemical Mechanical Polishing

1998 ◽  
Vol 145 (9) ◽  
pp. 3190-3196 ◽  
Author(s):  
David J. Stein ◽  
Dale Hetherington ◽  
Terry Guilinger ◽  
Joseph L. Cecchi
Keyword(s):  
Electrochemical Behavior ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Electrochemical Investigation

Effect of pH on ceria–silica interactions during chemical mechanical polishing

2005 ◽  
Vol 20 (5) ◽  
pp. 1139-1145 ◽  
Author(s):  
Jeremiah T. Abiade ◽  
Wonseop Choi ◽  
Rajiv K. Singh
Keyword(s):  
Photoelectron Spectroscopy ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Force Measurements ◽  
X Ray ◽  
Force Microscopy ◽  
Substrate Interaction ◽  
Atomic Force ◽  
Silica Removal

To understand the ceria–silica chemical mechanical polishing (CMP) mechanisms, we studied the effect of ceria slurry pH on silica removal and surface morphology. Also, in situ friction force measurements were conducted. After polishing; atomic force microscopy, x-ray photoelectron spectroscopy, and scanning electron microscopy were used to quantify the extent of the particle–substrate interaction during CMP. Our results indicate the silica removal by ceria slurries is strongly pH dependent, with the maximum occurring near the isoelectric point of the ceria slurry.

Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process

2019 ◽  
Vol 218 ◽  
pp. 111133 ◽  
Author(s):  
Yeon-Ah Jeong ◽  
Maneesh Kumar Poddar ◽  
Heon-Yul Ryu ◽  
Nagendra Prasad Yerriboina ◽  
Tae-Gon Kim ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Particle Agglomeration ◽  
Oxygen Bubble ◽  
In Situ Generation

Electrochemical behavior of copper chemical mechanical polishing in KIO[sub 3] slurry

2002 ◽  
Vol 20 (2) ◽  
pp. 608 ◽  
Author(s):  
Jyh-Wei Hsu ◽  
Shao-Yu Chiu ◽  
Ming-Shih Tsai ◽  
Bau-Tong Dai ◽  
Ming-Shiann Feng ◽  
...  
Keyword(s):  
Electrochemical Behavior ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing

In Situ Technique for Dynamic Fluid Film Pressure Measurement during Chemical Mechanical Polishing

2000 ◽  
Vol 147 (7) ◽  
pp. 2741 ◽  
Author(s):  
David Bullen ◽  
Alicia Scarfo ◽  
Alia Koch ◽  
Dewi P. Y. Bramono ◽  
Jonathan Coppeta ◽  
...  
Keyword(s):  
Pressure Measurement ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Fluid Film ◽  
Film Pressure ◽  
In Situ Technique

Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing

2021 ◽  
Author(s):  
Lei Xu ◽  
Pengzhan Liu ◽  
Hong Lei ◽  
Kihong Park ◽  
Eungchul Kim ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Auxiliary Mechanism
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