scholarly journals Analysis of Temperature Field, Heat and Fluid Flow of Two-Phase Zone Continuous Casting Cu–Sn Alloy Wire

2016 ◽  
Vol 16 (1) ◽  
pp. 33-40 ◽  
Author(s):  
J. Luo ◽  
X. Liu ◽  
X. Wang
Keyword(s):  
Temperature Field ◽  
Fluid Flow ◽  
Heat Flow ◽  
Continuous Casting ◽  
Flow Direction ◽  
Phase Zone ◽  
Two Phase ◽  
Alloy Wire ◽  
Heat Flow Direction ◽  
Heat And Fluid Flow

Abstract Cu–4.7 wt. % Sn alloy wire with Ø10 mm was prepared by two-phase zone continuous casting technology, and the temperature field, heat and fluid flow were investigated by the numerical simulated method. As the melting temperature, mold temperature, continuous casting speed and cooling water temperature is 1200 °C, 1040 °C, 20 mm/min and 18 °C, respectively, the alloy temperature in the mold is in the range of 720 °C–1081 °C, and the solid/liquid interface is in the mold. In the center of the mold, the heat flow direction is vertically downward. At the upper wall of the mold, the heat flow direction is obliquely downward and deflects toward the mold, and at the lower wall of the mold, the heat flow deflects toward the alloy. There is a complex circular flow in the mold. Liquid alloy flows downward along the wall of the mold and flows upward in the center.

scholarly journals Influence of heat flow direction on solder ball interfacial layer

2018 ◽  
Vol 69 (4) ◽  
pp. 305-310 ◽  
Author(s):  
Alexandr Otáhal ◽  
Ivan Szendiuch
Keyword(s):  
Heat Flow ◽  
Flow Direction ◽  
Intermetallic Layer ◽  
Point Of View ◽  
Infrared Heating ◽  
Root Mean Square Roughness ◽  
Sac305 Solder ◽  
Heat Flow Direction ◽  
Solder Balls ◽  
Bga Package

Abstract This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were soldered by infrared heating. The heat sources were placed on the top, bottom and both lateral sides of the BGA package. After the solder balls-attach process, a metallographic cross-section was performed, followed by selective etching to visualize the relief of the intermetallic layer. Images of the interfacial between the solder and solder pad were taken from the created samples, followed by measurement of the average thickness and root mean square roughness of the intermetallic layer. The results showed changes in the intermetallic layer. The largest thickness of the intermetallic layer was observed on samples soldered from the top and both sides. Soldering with the bottom infrared heater resulted to the smallest thickness of the intermetallic layer. The same trend was in the roughness of the IMC layer. The greatest roughness was found for samples soldered by the top and both side heaters. The top soldered samples exhibit the smallest roughness.

scholarly journals Orientation and Microstructure Evolution of Al-Al2Cu Regular Eutectic Lamellar Bifurcating in an Abruptly Changing Velocity under Directional Solidification

Materials ◽  
2020 ◽  
Vol 13 (4) ◽  
pp. 1004
Author(s):  
Ka Gao ◽  
Zan Zhang ◽  
Junliang Zhao ◽  
Dejian Sun ◽  
Fu Wang
Keyword(s):  
Heat Flow ◽  
Directional Solidification ◽  
Flow Direction ◽  
Solidification Rate ◽  
Lateral Diffusion ◽  
Interfacial Instability ◽  
Growth Orientation ◽  
Al2cu Phase ◽  
Heat Flow Direction ◽  
Solidification Microstructures

In an abruptly changing velocity under directional solidification, microstructures and the growth orientation of Al-Al2Cu eutectic lamellar were characterized. The change in solidification rate led to an interfacial instability, which results in a bifurcation of the eutectic lamella into new, refined lamellae. The growth orientation of the eutectic Al2Cu phase was also only in its (001) direction and more strongly oriented to the heat flow direction. The results suggest that the eutectic lamellar Al-Al2Cu bifurcation and the spacing adjustment may be caused by the rate determining lateral diffusion of the solutes after interfacial instability.

The importance of heat flow direction for reproducible and homogeneous freezing of bulk protein solutions

2013 ◽  
Vol 29 (5) ◽  
pp. 1212-1221 ◽  
Author(s):  
Miguel A. Rodrigues ◽  
Gustavo Balzan ◽  
Mónica Rosa ◽  
Diana Gomes ◽  
Edmundo G. de Azevedo ◽  
...  
Keyword(s):  
Heat Flow ◽  
Flow Direction ◽  
Protein Solutions ◽  
Heat Flow Direction ◽  
Homogeneous Freezing
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