Ultra Shallow Junction Formation by B+/BF2+ Implantation at Energy of 0.5 KEV
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ABSTRACTThis paper describes ultra shallow junction formation using 0.5 keV B+/BF2+ implantation, which has the advantage of a reduced channeling tail and no transient enhanced diffusion. In the case of l × 1014 cm−2, 0.5 keV BF2 implantation a junction depth of 19 nm is achieved after RTA at 950°C.
2002 ◽
Vol 31
(10)
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pp. 999-1003
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2013 ◽
Vol 284-287
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pp. 98-102
2005 ◽
Vol 237
(1-2)
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pp. 113-120
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