3D Mapping of Subsurface Cracks in Alumina Using FIB

2000 ◽  
Vol 649 ◽  
Author(s):  
B.J. Inkson ◽  
H.Z. Wu ◽  
T. Steer ◽  
G. Möbus
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Mapping Method ◽  
New Method ◽  
3D Mapping ◽  
Data Set ◽  
Subsurface Cracks ◽  
3D Data ◽  
Indentation Site

ABSTRACTA new method has been developed to map cracks in 3D using focused ion beam (FIB) microscopy. Using the FIB, many parallel 2D slices are cut in the specimen. Imaging each 2D slice down several directions enables the 3D co-ordinates of features in the slice to be determined. Computer alignment and reconstruction of the 2D slices generates a 3D data set of the analysed zone. The 3D mapping method has been applied to the analysis of the cracks around an indentation site in a Al2O3-5vol.%SiC nanocomposite. This reveals the 3D location and morphology of radial and deep lateral cracks at the indent periphery, surface localised crack clusters, and a crack deficient zone close to the indent centre.

3D FIB and AFM mapping of Nanoindentation Zones

2000 ◽  
Vol 649 ◽  
Author(s):  
T.J. Steer ◽  
G. Möbus ◽  
O. Kraft ◽  
T. Wagner ◽  
B.J. Inkson
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Mapping Method ◽  
Three Dimensions ◽  
Mapping Technique ◽  
Film Material ◽  
Cross Sectional ◽  
Data Set ◽  
3D Data ◽  
Computer Based

ABSTRACTA novel technique has been developed to examine site-specific, subsurface microstructures in three dimensions. A 3D data set is collected by successive cross-sectional slicing using a gallium focused ion beam (FIB) and imaging using ion-induced secondary electrons, enabling a 3D microstructure map to be generated using computer-based reconstruction techniques. In the first instance, this 3D FIB mapping technique has been applied to copper-based epitaxial metal multilayer coatings which have been deformed by nanoindentation. It is possible to produce 3D profiles of the deformed subsurface interfaces. These individual interface maps allow analysis of the deformation in terms of both the thickness of individual layers and that of the entire film. Material flow, which is seen as pile-up and residual indent zones around the indent, can thus be precisely characterised. The site at which the sectioning is to be carried out can be chosen with high spatial resolution; consequently, nanoscale mechanical properties can be linked directly with an area's microstructure.In an attempt to examine the errors involved in this 3D mapping method the 3D FIB map of the surface of a residual indent has been compared to an atomic force microscopy (AFM) scan of the same region. The sources and significance of the errors are discussed with reference to ways in which they might be reduced.

scholarly journals Analysis of polycrystalline microstructure of AlMgSc alloy observed by 3D EBSD

2020 ◽  
Author(s):  
Jaromír Kopeček ◽  
Jakub Staněk ◽  
Stanislav Habr ◽  
Filip Seitl ◽  
Lukas Petrich ◽  
...  
Keyword(s):  
Spatial Distribution ◽  
Grain Boundaries ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Three Dimensional ◽  
Morphological Characteristics ◽  
Polycrystalline Materials ◽  
Electron Backscattered Diffraction ◽  
Data Set ◽  
3D Data

The aim of this paper is to evaluate an ambitious imaging experiment and to contribute to the methodology of statistical inference of the three-dimensional microstructure of polycrystalline materials. The microstructure of the considered Al-3Mg-0.2Sc alloy was investigated by three-dimensional electron backscattered diffraction (3D-EBSD), i.e., tomographic imaging with xenon plasma focused ion beam (Xe-FIB) alongside EBSD. The samples were subjected to severe plastic deformations by equal channel angular dressing (ECAP) and annealed subsequently prior to the mapping. First we compared the misorientation level needed for  a reliable segmentation of grains distinguishing between conventional evaluation of two-dimensional cuts and the 3D data set. Then, using methods of descriptive spatial statistics, various morphological characteristics of a large number of grains were analyzed, as well as the crystallographic texture and the spatial distribution of grain boundaries. According to the results stated so far in the literature, an even microstructure was expected, nevertheless local inhomogeneities in grains and grain boundaries with regard to their size, texture and spatial distribution were observed and justified.

A new method for mechanical testing of thin films: Application to aluminum

2009 ◽  
Vol 24 (4) ◽  
pp. 1353-1360
Author(s):  
T. Kruml ◽  
M. Stranyanek ◽  
R. Ctvrtlik ◽  
P. Bohac ◽  
T. Vystavel ◽  
...  
Keyword(s):  
Thin Films ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Accurate Determination ◽  
Film Surface ◽  
Strain Curve ◽  
New Method ◽  
Plastic Properties ◽  
Precise Knowledge

A new method for measuring plastic properties of thin films deposited on a substrate is presented. Micrometric cylindrical specimens with the axis perpendicular to the film surface were prepared by milling out the surrounding material using the focused ion beam technique. Such specimens were deformed by means of a nanoindenter outfitted with a flat diamond tip. An equivalent to the macroscopic compressive curve was obtained. Elastic modulus and hardness of the film were then measured using a Berkovich tip. The precise knowledge of the gage length and the independent measurement of elastic properties enable the accurate determination of the stress–strain curve. As compared with the results published in the literature on the specimens with the same dimensions, the studied material deforms less heterogeneously, probably as a consequence of the symmetric crystallographic orientation of the specimens.

Submicrometer Shadow Mask Fabricated by Anisotropic Wet Etching and Focused Ion Beam Techniques for Nanofabrication in UHV

1998 ◽  
Vol 12 (14n15) ◽  
pp. 597-605 ◽  
Author(s):  
Hanyu Sheng ◽  
Daisuke Fujita ◽  
Taizo Ohgi ◽  
Hiroshi Okamoto ◽  
Hitoshi Nejoh
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
High Vacuum ◽  
Wet Etching ◽  
Ultra High Vacuum ◽  
New Method ◽  
Shadow Mask ◽  
Pattern Size

We have developed a new method for fabricating a silicon submicrometer shadow mask for nanofabrication in ultra-high vacuum. Combining KOH anisotropic wet etching, electron beam lithography, reactive ion etching and focused ion beam techniques, a pattern size of 2.5×2.5 mm2 and opaque part about 1 μm can be obtained.

scholarly journals Focused ion beam nano-sectioning and imaging: a new method in characterisation of palaeopalynological remains

Grana ◽  
2012 ◽  
Vol 51 (1) ◽  
pp. 1-9 ◽  
Author(s):  
Uxue Villanueva-Amadoz ◽  
Alessandro Benedetti ◽  
Jesús Méndez ◽  
Luis Miguel Sender ◽  
José Bienvenido Diez
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
New Method

Nanosteps Preparation Based on Focused Ion Beam Technique

2017 ◽  
Vol 870 ◽  
pp. 114-119
Author(s):  
Chen Ying Wang ◽  
Wei Xuan Jing ◽  
Yi Jun Zhang ◽  
Ming Liu ◽  
Qi Jing Lin ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
New Method ◽  
Second Step ◽  
Material Surface ◽  
Force Microscopy ◽  
Atomic Force ◽  
Comparison And Analysis ◽  
Beam Technique

In this paper, nanosteps were fabricated by a new method. This method used the energy of focus imaging of focused ion beam to peel the material surface for fabricating the nanosteps. By changing the number of focus imaging can get different deepness nanosingle-steps. Changing the magnification, the second-step can be fabricated on nanosingle-step. An atomic force microscopy was used to measure the 3D morphology of nanosteps. When the magnification was 25000, the deepness of nanosingle-step was 65.34±3.00 nm and the deepness of the first step of nanodual-step was 56.03 nm. When the magnification was 50000, the deepness of nanosingle-step was 142.28±3.54 nm and the deepness of the second step of nanodual-step was 178.68nm. This means that the redeposition made the deepness of the first step become bigger, that of the second step becomes smaller. Based on comparison and analysis, the relation of the depth, the magnification and the number of the focus imaging were obtained.

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