Impact of the STS ground/launch particle contamination environment on an optical sensor

1983 ◽  
Author(s):  
L. BAREISS ◽  
F. JAROSSY
Keyword(s):  
Optical Sensor ◽  
Particle Contamination

Temperature and ablation optical sensor

1980 ◽  
Author(s):  
J. CASSAING ◽  
P. LELIEVRE ◽  
P. DURRENBERGER ◽  
D. BALAGEAS
Keyword(s):  
Optical Sensor

Engineering Test Satellite VII Rendezvous Docking optical sensor system

1994 ◽  
Author(s):  
Masaaki Mokuno ◽  
Isao Kawano ◽  
Hiroshi Horiguchi ◽  
Koichi Kibe
Keyword(s):  
Optical Sensor ◽  
Sensor System

Research of the Brillouin frequency shift damage dependence from mechanical stresses in an optical sensor

2019 ◽  
Vol 9 (5) ◽  
pp. 512-521
Author(s):  
Ruslan V. Aginey ◽  
◽  
Rustem R. Islamov ◽  
Alexander A. Godunov ◽  
◽  
...  
Keyword(s):  
Frequency Shift ◽  
Optical Sensor ◽  
Mechanical Stresses

Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

2000 ◽  
Author(s):  
Y. N. Hua ◽  
Z. R. Guo ◽  
L. H. An ◽  
Shailesh Redkar
Keyword(s):  
Electron Microscope ◽  
Failure Analysis ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Wafer Fabrication ◽  
X Ray ◽  
Particle Contamination ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Scanning Electron

Abstract In this paper, some low yield cases in Flat ROM device (0.45 and 0.6 µm) were investigated. To find killer defects and particle contamination, KLA, bitmap and emission microscopy techniques were used in fault isolation. Reactive ion etching (RIE) and chemical delayering, 155 Wright Etch, BN+ Etch and scanning electron microscope (SEM) were used for identification and inspection of defects. In addition, energy-dispersive X-ray microanalysis (EDX) was used to determine the composition of the particle or contamination. During failure analysis, seven kinds of killer defects and three killer particles were found in Flat ROM devices. The possible root causes, mechanisms and elimination solutions of these killer defects/particles were also discussed.

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