scholarly journals Influence of powerful electromagnetic pulses on the operation of typical integrated microcontrollers.

2020 ◽  
Vol 2020 (11) ◽  
Author(s):  
V.A. Vdovin ◽  
◽  
A.A. Geraskin ◽  
P.A. Gorbokonenko ◽  
S.A. Sapetskiy ◽  
...  
Keyword(s):  
Electromagnetic Pulse ◽  
Printed Circuit Board ◽  
Supply Voltage ◽  
Circuit Board ◽  
Electromagnetic Pulses ◽  
Passive Components ◽  
Electric Pulses ◽  
Printed Circuit ◽  
Logic Operations ◽  
Electrical Impulses

The effects arising in an integrated microchip (IC) of a microcontroller (MC) performing test logic operations under the action of powerful electrical impulses are investigated. The IC MC STM8S003 was chosen as a typical microcontroller. The exposure was carried out by electric pulses with an electric field strength of up to 20 kV/cm and a duration of 6 ns. It is shown that impulse influences can lead to logical failures when performing IC MC logical operations, the effectiveness of the influence depends not only on the parameters of the electromagnetic pulse, but also on the specific operation performed during which it occurred. The repetition rate of electromagnetic pulses up to 1 kHz does not significantly affect the type of failures of the IC MC. The supply voltage of the IC MC affects its stability; to create a failure, an increase in the amplitude of the electromagnetic pulse is required with an increase in the supply voltage. Passive components of a printed circuit board are more susceptible to electromagnetic influences than IC MC.

Magnetic Emission Mapping for Passive Integrated Components Characterisation

2003 ◽  
Author(s):  
O. Crépel ◽  
Y. Bouttement ◽  
P. Descamps ◽  
C. Goupil ◽  
P. Perdu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Magnetic Sensors ◽  
Circuit Board ◽  
Magnetic Disturbance ◽  
Passive Components ◽  
Printed Circuit ◽  
Integrated Inductor ◽  
The Magnetic Field

Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.

Flexible Electronics Fabrication for Missile Wiring Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001096-001114
Author(s):  
Michael R. Whitley ◽  
Tracy D. Hudson
Keyword(s):  
Unmanned Aerial Vehicles ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polyimide Films ◽  
Passive Components ◽  
Printed Circuit ◽  
Data Formats ◽  
Aerial Vehicles ◽  
Ink Jet

The increased usage of unmanned aerial vehicles has driven the desire for smaller and lighter missile bodies. The wiring harnesses required to connect the missile subsystems constitute a significant portion of the missile weight and cost. We have been exploring the development of flexible electronics substrates manufactured using ink jet technology on polyimide films. This technology has an advantage over traditional flex circuit manufacturing because in addition to creating traditional wiring patterns the ink jet technology enables the creation of passive components such as resistors and capacitors. The Dimatix DMP-2831 ink jet system uses individually controllable piezoelectric driven MEMS nozzles to precisely deposit nanoparticle inks. These inks are then annealed to form wiring patterns. We will present the process for converting traditional printed circuit board data formats to inkjet printable data, the process for depositing the ink, annealing and testing.

A Novel Discrete Passives Integration on Organic Substrate

2005 ◽  
Author(s):  
Vasudivan Sunappan ◽  
Chee Wai Lu ◽  
Lai Lai Wai ◽  
Wei Fan ◽  
Boon Keng Lok
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Electrical Performance ◽  
Core Material ◽  
Bottom Surface ◽  
Passive Components ◽  
Printed Circuit

A novel process has been developed to embed discrete (surface mountable) passive components like capacitors, resistors and inductors using printed circuit board fabrication technology. The process comprises of mounting passive components on top surface of a core PCB (printed circuit board) material using surface mount technology. The passive components mounting were designed in multiple clusters within the PCB. Dielectric sheets are sandwiched between top surface of core PCB and second PCB material for lamination process. A direct interconnection of the passive components to one or more integrated circuits (IC) is further accomplished by mounting the ICs on the bottom surface of the core material in an area directly under the passive components. The close proximity of the embedded passive components such as capacitors to an IC improved electrical performance by providing impedance reduction and resonance suppression at high frequency range. The reliability of solder joints was evaluatedd by temperature cycling test.

SILVerIn: Systematic Integrity Verification of Printed Circuit Board Using JTAG Infrastructure

2021 ◽  
Vol 17 (3) ◽  
pp. 1-28
Author(s):  
Shubhra Deb Paul ◽  
Swarup Bhunia
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Supply Voltage ◽  
Semiconductor Industry ◽  
Electronic System ◽  
Circuit Board ◽  
System Level ◽  
Printed Circuit ◽  
Industry Standard ◽  
Custom Hardware

A printed circuit board (PCB) provides necessary mechanical support to an electronic system and acts as a platform for connecting electronic components. Counterfeiting and in-field tampering of PCBs have become significant security concerns in the semiconductor industry as a result of increasing untrusted entities in the supply chain. These counterfeit components may result in performance degradation, profit reduction, and reputation risk for the manufacturers. While Integrated Circuit (IC) level authentication using physical unclonable functions (PUFs) has been widely investigated, countermeasures at the PCB level are scarce. These approaches either suffer from significant overhead issues, or opportunistic counterfeiters can breach them like clockwork. Besides, they cannot be extended to system-level (both chip and PCB together), and their applications are also limited to a specific purpose (i.e., either counterfeiting or tampering). In this article, we introduce SILVerIn , a novel systematic approach to verify the authenticity of all chips used in a PCB as well as the board for combating attacks such as counterfeiting, cloning, and in-field malicious modifications. We develop this approach by utilizing the existing boundary scan architecture (BSA) of modern ICs and PCBs. As a result, its implementation comes at a negligible (∼0.5%) hardware overhead. SILVerIn  is integrated into a PCB design during the manufacturing phase. We implement our technique on a custom hardware platform consisting of an FPGA and a microcontroller. We incorporate the industry-standard JTAG (Joint Test Action Group) interface to transmit test data into the BSA and perform hands-on measurement of supply current at both chip and PCB levels on 20 boards. We reconstruct these current values to digital signatures that exhibit high uniqueness, robustness, and randomness features. Our approach manifests strong reproducibility of signatures at different supply voltage levels, even with a low-resolution measurement setup. SILVerIn  also demonstrates a high resilience against machine learning-based modeling attacks, with an average prediction accuracy of ∼51%. Finally, we conduct intentional alteration experiments by replacing the on-board FPGA to replicate the scenario of PCB tampering, and the results indicate successful detection of in-field modifications in a PCB.

scholarly journals Design of Circuit System-Based Cryptography

10.28945/2155 ◽  
2015 ◽  
Author(s):  
Folasade Caroline Akinwonmi ◽  
Boniface Kayode Alese ◽  
Folasade M. Dahunsi ◽  
Festus A. Osuolale ◽  
Ayodele E Odo
Keyword(s):  
Printed Circuit Board ◽  
Data Encryption ◽  
Circuit Board ◽  
Protocol Stack ◽  
C Language ◽  
Printed Circuit ◽  
Encryption And Decryption ◽  
Hardware Encryption ◽  
Logic Operations ◽  
Microcontroller Unit

Cryptography is the science of writing in secret codes which can be achieved either by using software encrypter or hardware encrypter. This study presents the development of a pair of circuit system-based (hardware) cryptographic processor. The hardware encryption in this study was achieved using the bitwise logic operations in the registers of the microcontroller and messages are streamed as serial ASCII data from the PC through the USB port to the microcontroller unit. The encryption is performed on each ASCII representation using a pass key embedded in the microcontroller unit. Decryption process is similar but in the reverse order. A comparative analysis of the encryption time for the hardware-based data encryption was made and findings recorded. The processor was implemented using PIC18F4550 microcontroller mounted on a Printed Circuit Board alongside other components to achieve the hardware based circuitry. The software end of the encryption and decryption algorithm was developed based on a library built into C Language Visual Studio version 2010 and the CCS C compiler for communication protocol stack.

scholarly journals Modeling the Impact of Embedding Passives on Manufacturing System Performance

2002 ◽  
Author(s):  
Mandar M. Chincholkar ◽  
Jeffrey W. Herrmann
Keyword(s):  
Real Estate ◽  
System Performance ◽  
Manufacturing System ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Processing Times ◽  
The Impact

With the miniaturization of electronic products, reducing the size of the printed circuit board that forms the backbone of the product is paramount. Embedding passive components, which otherwise occupy valuable “real estate” atop the printed circuit board, into the printed circuit board substrate itself is one way of achieving this objective. This first part of this paper examines the techniques and advantages of embedding passives. Embedding passives also affects manufacturing system performance, due to a change in the processing sequence and changes to the processing times at resources. The latter portion of this paper describes a design for production tool for understanding the impact of embedding passives on the performance of a manufacturing system.

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