Magnetic Emission Mapping for Passive Integrated Components Characterisation

2003 ◽  
Author(s):  
O. Crépel ◽  
Y. Bouttement ◽  
P. Descamps ◽  
C. Goupil ◽  
P. Perdu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Magnetic Sensors ◽  
Circuit Board ◽  
Magnetic Disturbance ◽  
Passive Components ◽  
Printed Circuit ◽  
Integrated Inductor ◽  
The Magnetic Field

Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.

Flexible Electronics Fabrication for Missile Wiring Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001096-001114
Author(s):  
Michael R. Whitley ◽  
Tracy D. Hudson
Keyword(s):  
Unmanned Aerial Vehicles ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polyimide Films ◽  
Passive Components ◽  
Printed Circuit ◽  
Data Formats ◽  
Aerial Vehicles ◽  
Ink Jet

The increased usage of unmanned aerial vehicles has driven the desire for smaller and lighter missile bodies. The wiring harnesses required to connect the missile subsystems constitute a significant portion of the missile weight and cost. We have been exploring the development of flexible electronics substrates manufactured using ink jet technology on polyimide films. This technology has an advantage over traditional flex circuit manufacturing because in addition to creating traditional wiring patterns the ink jet technology enables the creation of passive components such as resistors and capacitors. The Dimatix DMP-2831 ink jet system uses individually controllable piezoelectric driven MEMS nozzles to precisely deposit nanoparticle inks. These inks are then annealed to form wiring patterns. We will present the process for converting traditional printed circuit board data formats to inkjet printable data, the process for depositing the ink, annealing and testing.

A Novel Discrete Passives Integration on Organic Substrate

2005 ◽  
Author(s):  
Vasudivan Sunappan ◽  
Chee Wai Lu ◽  
Lai Lai Wai ◽  
Wei Fan ◽  
Boon Keng Lok
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Electrical Performance ◽  
Core Material ◽  
Bottom Surface ◽  
Passive Components ◽  
Printed Circuit

A novel process has been developed to embed discrete (surface mountable) passive components like capacitors, resistors and inductors using printed circuit board fabrication technology. The process comprises of mounting passive components on top surface of a core PCB (printed circuit board) material using surface mount technology. The passive components mounting were designed in multiple clusters within the PCB. Dielectric sheets are sandwiched between top surface of core PCB and second PCB material for lamination process. A direct interconnection of the passive components to one or more integrated circuits (IC) is further accomplished by mounting the ICs on the bottom surface of the core material in an area directly under the passive components. The close proximity of the embedded passive components such as capacitors to an IC improved electrical performance by providing impedance reduction and resonance suppression at high frequency range. The reliability of solder joints was evaluatedd by temperature cycling test.

Economics of materials in mobile phone preprocessing, focus on non-printed circuit board materials

2019 ◽  
Vol 87 ◽  
pp. 78-85 ◽  
Author(s):  
Weitong Liu ◽  
Patrick Ford ◽  
Hugo Uvegi ◽  
Fernanda Margarido ◽  
Eduardo Santos ◽  
...  
Keyword(s):  
Mobile Phone ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Comparison of Leaching Processes of Gold and Copper from Printed Circuit Boards of Waste Mobile Phone

2014 ◽  
Vol 955-959 ◽  
pp. 2743-2746 ◽  
Author(s):  
Jian Feng Yin ◽  
Si Hui Zhan ◽  
He Xu
Keyword(s):  
Mobile Phone ◽  
Inductively Coupled Plasma ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Precious Metals ◽  
Optical Emission ◽  
Optimal Choice ◽  
Circuit Board ◽  
Printed Circuit

Waste mobile phone has become the largest number of electronic waste, and recycling of metals from mobile phone would ensure resource recycling and reduce environmental degradation. Based on the contents of metals analyzed by Inductively Coupled Plasma Optical Emission Spectrometer (ICP-OES), containing copper and precious metals such as gold, the paper compared the extraction processes of gold, copper from waste mobile phone printed circuit board (PCB). In this study, two processes, nitric acid and thiourea (NT), sulfuric acid-hydrogen peroxide and iodine (SAHPI) were used to leach copper and gold, respectively. The recovery rate of copper was found to be 96.42%, and 94.3% of the gold was leached in the former process. Similar trends were obtained for the leaching of copper and gold in the latter process, but it was lower that about 95.27% of copper was recycled, while 93.4% of gold were leached. Both the two processes were nontoxic and non-cyanide system. However, thiourea is not stable and easy to decompose in alkaline solution, and the technology has disadvantage of instability. Iodine leaching on the other hand is comparatively a environmental process. Therefore, the optimal choice is the combined process of SAHPI method, while further research is required to develop cost effective and environmentally friendly processes.

scholarly journals Design and Study of a Wide-Band Printed Circuit Board Near-Field Probe

Electronics ◽  
2021 ◽  
Vol 10 (18) ◽  
pp. 2201 ◽  
Author(s):  
Pedro A. Martinez ◽  
Enrique A. Navarro ◽  
Jorge Victoria ◽  
Adrian Suarez ◽  
Jose Torres ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Transmission Loss ◽  
Near Field ◽  
Fem Simulation ◽  
Numerical Results ◽  
Circuit Board ◽  
Frequency Range ◽  
Printed Circuit

Magnetic near-field probes (NFP) represent a suitable tool to measure the magnetic field level from a small electromagnetic interference (EMI) source. This kind of antenna is useful as a magnetic field probe for pre-compliance EMC measurements or debugging tasks since the user can scan a printed circuit board (PCB) looking for locations with strong magnetic fields. When a strong H-field point is found, the designer should check the PCB layout and components placement in that area to detect if this could result in an EMI source. This contribution focuses on analyzing the performance of an easy to build and low-cost H-field NFP designed and manufactured using a standard PCB stack-up. Thereby, the frequency range and sensitivity of the NFP-PCB are analyzed through a Finite Element Method (FEM) simulation model that makes it possible to evaluate its sensibility and effective frequency range. The numerical results obtained with the FEM models are validated against measurements to verify the design and performance of our NFP. The FEM model reproduces the experimental procedure, which is used to evaluate the performance of the NFP in terms of sensitivity by means of the simulated near-field distribution. The NFP-PCB has almost a flat response from 180 MHz to 6 GHz, with an almost perfect concordance between numerical and experimental S21 results. The numerical results show an average transmission loss of −27.9 dB by considering the flat response bandwidth, whereas the experimental one is −29.7 dB. Finally, the designed NFP is compared to two high-quality commercial probes in order to analyze its performance.

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