Application of B-Scan SAT Mode, an Acoustic Cross Section Technique to Analyze Packaged Components beyond Delamination

2020 ◽  
Author(s):  
Srinath Rajaram ◽  
Denise Barrientos ◽  
Nadia Ahmad ◽  
Robert Carpenter ◽  
Eric Barbian
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Turnaround Time ◽  
Destructive Testing ◽  
Cross Sectional ◽  
Root Cause ◽  
Section Technique ◽  
Customer Returns ◽  
Tomography Method ◽  
Non Destructive

Abstract Failure Analysis labs involved in customer returns always face a greater challenge, demand from customer for a faster turnaround time to identify the root cause of the failure. Unfortunately, root cause identification in failure analysis is often performed incompletely or rushing into destructive techniques, leading to poor understanding of the failure mechanism and root-cause, customer dissatisfaction. Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM) has been adopted by several Failure Analysis labs because it provides reliable non-destructive imaging of package cracks and delamination. The SAM is a vital tool in the effort to analyze molded packages. This paper provides a review of non-destructive testing method used to evaluate Integrated Circuit (IC) package. The case studies discussed in this paper identifies different types of defects and the capabilities of B-Scan (cross-sectional tomography) method employed for defect detection beyond delamination.

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

Non-Destructive Testing of Mass Produced Components by Natural Frequency Measurements

1985 ◽  
Vol 199 (3) ◽  
pp. 161-168 ◽  
Author(s):  
P Cawley
Keyword(s):  
Natural Frequencies ◽  
Production Quality ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Production Quality Control ◽  
Cross Sectional ◽  
Dimensional Changes ◽  
Single Section ◽  
Set Up ◽  
Non Destructive

Vibrations in engineering components may be excited by a light tap and the vibration response may be measured with a microphone and displayed as a frequency spectrum from which the natural frequencies of the component can be extracted. Changes in the natural frequencies of the various modes are observed when small defects such as cracks are present. The use of this technique for the production quality control of mass produced components has been investigated. Tests have been carried out on a cantilever beam, a piston-shaped component and a pulley wheel. It has been shown that, in the absence of dimensional variations, defects removing between 0.5 and 2 per cent of the cross-sectional area of the component at a single section may be detected, the precise size depending on the geometry of the component and the location of the defect. Dimensional variations reduce this sensitivity, but a method has been developed for correcting the results for dimensional changes, without the need for more measurements to be taken. The results show that, unless the likely location of a defect is known in advance, it is essential to measure the natural frequencies of more than one mode of vibration. The test takes less than ten seconds to set up, about one second to carry out and is amenable to automation.

Advancement in Data Engineering and Feature Processing Workflow by Using Deep Learning Techniques for the Automation of ESP Failure Root Cause Analyses

2021 ◽  
Author(s):  
Saniya Karnik ◽  
Navya Yenuganti ◽  
Bonang Firmansyah Jusri ◽  
Supriya Gupta ◽  
Prasanna Nirgudkar ◽  
...  
Keyword(s):  
Deep Learning ◽  
Failure Analysis ◽  
Language Processing ◽  
Turnaround Time ◽  
Process Efficiency ◽  
Root Cause ◽  
Feature Processing ◽  
Learning Techniques ◽  
Electrical Submersible Pump ◽  
Root Cause Identification

Abstract Today, Electrical Submersible Pump (ESP) failure analysis is a tedious, human-intensive, and time-consuming activity involving dismantle, inspection, and failure analysis (DIFA) for each failure. This paper presents a novel artificial intelligence workflow using an ensemble of machine learning (ML) algorithms coupled with natural language processing (NLP) and deep learning (DL). The algorithms outlined in this paper bring together structured and unstructured data across equipment, production, operations, and failure reports to automate root cause identification and analysis post breakdown. This process will result in reduced turnaround time (TAT) and human effort thus drastically improving process efficiency.

scholarly journals Detection of Defects Using Spatial Variances of Guided-Wave Modes in Testing of Pipes

2018 ◽  
Vol 8 (12) ◽  
pp. 2378 ◽  
Author(s):  
Houman Mahal ◽  
Kai Yang ◽  
Asoke Nandi
Keyword(s):  
Detection Algorithm ◽  
Guided Wave ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Cross Sectional ◽  
The Past ◽  
Time Domain Signal ◽  
Non Destructive ◽  
Noise Region ◽  
Detection Of Defects

In the past decade, guided-wave testing has attracted the attention of the non-destructive testing industry for pipeline inspections. This technology enables the long-range assessment of pipelines’ integrity, which significantly reduces the expenditure of testing in terms of cost and time. Guided-wave testing collars consist of several linearly placed arrays of transducers around the circumference of the pipe, which are called rings, and can generate unidirectional axisymmetric elastic waves. The current propagation routine of the device generates a single time-domain signal by doing a phase-delayed summation of each array element. The segments where the energy of the signal is above the local noise region are reported as anomalies by the inspectors. Nonetheless, the main goal of guided-wave inspection is the detection of axisymmetric waves generated by the features within the pipes. In this paper, instead of processing a single signal obtained from the general propagation routine, we propose to process signals that are directly obtained from all of the array elements. We designed an axisymmetric wave detection algorithm, which is validated by laboratory trials on real-pipe data with two defects on different locations with varying cross-sectional area (CSA) sizes of 2% and 3% for the first defect, and 4% and 5% for the second defect. The results enabled the detection of defects with low signal-to-noise ratios (SNR), which were almost buried in the noise level. These results are reported with regard to the three different developed methods with varying excitation frequencies of 30 kHz, 34 kHz, and 37 kHz. The tests demonstrated the advantage of using the information received from all of the elements rather than a single signal.

Possibilities of failure analysis for steel cord conveyor belts using knowledge obtained from non-destructive testing of steel ropes

2016 ◽  
Vol 67 ◽  
pp. 33-45 ◽  
Author(s):  
Gabriel Fedorko ◽  
Vieroslav Molnár ◽  
Želmíra Ferková ◽  
Pavel Peterka ◽  
Jozef Krešák ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Conveyor Belts ◽  
Steel Cord ◽  
Non Destructive

scholarly journals An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Sensors ◽  
2018 ◽  
Vol 18 (7) ◽  
pp. 1981 ◽  
Author(s):  
Pouria Aryan ◽  
Santhakumar Sampath ◽  
Hoon Sohn
Keyword(s):  
Integrated Circuit ◽  
Non Destructive Testing ◽  
Testing Methods ◽  
Destructive Testing ◽  
Non Destructive

Specific Area Planar and Cross-Sectional Lift-Out Techniques: Procedures and Novel Applications

2000 ◽  
Author(s):  
Raghaw S. Rai ◽  
Swaminathan Subramanian ◽  
Stewart Rose ◽  
James Conner ◽  
Phil Schani ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Integrated Circuit ◽  
Ion Beam ◽  
Specific Area ◽  
Cross Sectional ◽  
Site Specific ◽  
Focussed Ion Beam ◽  
Lattice Images ◽  
Novel Applications

Abstract Conventional focussed ion beam (FIB) based specific area transmission electron microscopy (TEM) sample preparation techniques usually requires complex grinding and gluing steps before final FIB thinning of the sample to electron transparency (<0.25 μm). A novel technique known as lift-out, plucking or pullout method that eliminates all the pre-FIB sample preparation has been developed for specific area TEM sample preparation by several authors. The advantages of the lift-out procedure include reduced sample preparation time and possibility of specific area TEM sample preparation of most components of integrated circuit with almost no geometric or dimensional limitations. In this paper, details of liftout method, developed during the present work, for site specific x-sectional and a new site specific planar sample preparation are described. Various methodologies are discussed to maximize the success rate by optimizing the factors that affect the technique. In failure analysis, the geometric and dimensional flexibility offered by the lift-out technique can be used to prepare specific area TEM sample of back thinned die, small particles and packaged parts. Such novel applications of lift-out technique in failure analysis are discussed with the examples of TEM results obtained from GaAs and Si based devices. Importantly, it was possible to obtain high resolution lattice images from the lift-out samples transferred on holey carbon supported 3mm copper grids.

Modern 2D & 3D X-ray Technologies for Testing and Failure Analysis

2019 ◽  
Author(s):  
Herminso Villaraga-Gómez ◽  
Joshua D. Bell
Keyword(s):  
Failure Analysis ◽  
Non Destructive Testing ◽  
Dimensional Metrology ◽  
Destructive Testing ◽  
X Ray ◽  
Advantages And Disadvantages ◽  
Computed Laminography ◽  
Basic Operating ◽  
2D And 3D ◽  
Non Destructive

Abstract Modern 2D and 3D X-ray technologies are among the most useful non-destructive testing methods that enable the inspection of an object's internal features without cutting or disassembling the sample. This paper discusses the basic operating principle, advantages, and disadvantages of 2D and 3D X-ray based approaches for testing and failure analysis and describes how these different methods have practical application for failure analysis and dimensional metrology. The techniques discussed are radiography, classical laminography, computed tomography, and computed laminography.

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