scholarly journals Laser Patterning a Graphene Layer on a Ceramic Substrate for Sensor Applications

Sensors ◽  
2020 ◽  
Vol 20 (7) ◽  
pp. 2134 ◽  
Author(s):  
Marcin Lebioda ◽  
Ryszard Pawlak ◽  
Witold Szymański ◽  
Witold Kaczorowski ◽  
Agata Jeziorna
Keyword(s):  
High Speed ◽  
Graphene Layer ◽  
Ceramic Substrate ◽  
Direct Process ◽  
Laser Technology ◽  
Sensor Applications ◽  
Laser Patterning ◽  
Good Shape ◽  
Shape Mapping ◽  
Sensory Layer

This paper describes a method for patterning the graphene layer and gold electrodes on a ceramic substrate using a Nd:YAG nanosecond fiber laser. The technique enables the processing of both layers and trimming of the sensor parameters. The main aim was to develop a technique for the effective and efficient shaping of both the sensory layer and the metallic electrodes. The laser shaping method is characterized by high speed and very good shape mapping, regardless of the complexity of the processing. Importantly, the technique enables the simultaneous shaping of both the graphene layer and Au electrodes in a direct process that does not require a complex and expensive masking process, and without damaging the ceramic substrate. Our results confirmed the effectiveness of the developed laser technology for shaping a graphene layer and Au electrodes. The ceramic substrate can be used in the construction of various types of sensors operating in a wide temperature range, especially the cryogenic range.

Multifunctional Properties of High-speed Highly Uniform Femtosecond Laser Patterning on Stainless steel

2017 ◽  
Author(s):  
Iaroslav Gnilitskyi ◽  
Alberto Rota ◽  
Radim Ctvrtlik ◽  
Ana Paula Serro ◽  
Enrico Gualtieri ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Femtosecond Laser ◽  
High Speed ◽  
Laser Patterning ◽  
Highly Uniform ◽  
Multifunctional Properties

scholarly journals Preventing Evaporation Products for High-quality Metal Film in Directed Energy Deposition: A Review

2021 ◽  
Author(s):  
Kang-Hyung Kim ◽  
Chan-Hyun Jung ◽  
Dae-Yong Jeong ◽  
Soong-Keun Hyun
Keyword(s):  
Metal Film ◽  
High Speed ◽  
Energy Deposition ◽  
High Energy ◽  
High Quality ◽  
Laser Technology ◽  
Directed Energy Deposition ◽  
Film Layer ◽  
Directed Energy ◽  
Quality Metal

Directed Energy Deposition (DED) is a process that enables high-speed deposition with a sub-millimeter thickness using laser technology. Thus far, defect studies on additive manufacturing, including DED, have focused mostly on preventing pores and crack defects that reduce fatigue strength. On the other hand, evaporation products, fumes and spatters, generated by the high energy have often been neglected despite being some of the main causes of porosity and defects. In high-quality metal deposition, the problems caused by evaporation products are difficult to solve, but they have not yet caught the attention of metallurgists and physicists. This review examines the effect of the laser, material, and process parameters on the evaporation products to help obtain a high-quality metal film layer in thin-DED.

HIGH FREQUENCY CIRCUITS BASED ON GaAs PHEMT TECHNOLOGY FOR MODERN SENSOR AND COMMUNICATION SYSTEMS

2000 ◽  
Vol 10 (01) ◽  
pp. 393-411 ◽  
Author(s):  
M. SCHLECHTWEG
Keyword(s):  
Integrated Circuits ◽  
Communication Systems ◽  
High Speed ◽  
Coplanar Waveguide ◽  
High Gain ◽  
Low Noise ◽  
Phase Shifters ◽  
60 Ghz ◽  
Sensor Applications ◽  
High Speed Data

For sensor and communication system applications, monolithic microwave integrated circuits (MMICs) feature performance, functionality, reliability, and competitive price. In this paper, the potential of PHEMT ICs for communication and sensor applications up to 100 GHz is discussed. Specifically, I will address the application of coplanar waveguide technology for rf ICs, millimeter-wave multifunctional ICs and power amplifiers, as well as mixed-signal ICs and OEICs. A 77-GHz transceiver MMIC designed for automotive collision avoidance radar is presented as an example of a very compact, multifunctional mm-wave chip. A chip set for active and passive imaging at 94 GHz includes low noise and high gain amplifiers, low phase noise oscillators, and phase shifters. An FMCW module is conceived for material characterization. A family of coplanar power amplifier MMICs for wireless communication in the range of 20 to 60 GHz with output powers up to 1 W is presented. Finally, integrated circuits for high-speed data transmission at 40 Gbit/s will be discussed.

Polyimide-Ceramic Substrate for Supercomputer Packaging

1989 ◽  
Vol 167 ◽  
Author(s):  
K. Kimbara ◽  
A. Dohya ◽  
T. Watari
Keyword(s):  
High Power ◽  
High Speed ◽  
High Performance ◽  
General Purpose ◽  
High Density ◽  
Ceramic Substrate ◽  
Liquid Cooling ◽  
General Purpose Computer ◽  
Performance System ◽  
Cooling Module

AbstractThis paper introduces the Polylmide-Ceramic substrate for NEC SX Supercomputers. In case of high performance system such as supercomputers and top end machines in general purpose computer, sophisticated packaging technologies are essential to achieve fastest operations as well as to use highestspeed, highly integrated LSIs.Wiring substrate which mounts and interconnects LSIs is the key to back up LSI's higher logical-operations.The high speed interconnection wirings and high density LSI mounting are requested for substrate.The Polyimide-Ceramic substrate had been developed to meet these demands and have many features of high density thin film wiring, high power supply, high thermal conductivity and huge number of I/Os, in addition to high speed wiring.25μm wide 75μm center-to-center spacing, two signal layers, 6ns/m signal transmissions, 2.5W/cm2 high power density, 2177 I/Os on a 100mm square substrate have been achieved by using this super substrate technology.The packaging hierarchy, the first level packaging of TAB LSI, the second level of multi-chip packaging by using Polyimide-Ceramic substrate and liquid cooling module, and the third level of board assemblies are introduced.

Sign in / Sign up

Export Citation Format

Share Document