Ultrasonic bonding of fine-pitch Au stud flip chip bump with flexible printed circuit board
Keyword(s):
2009 ◽
Vol 48
(7)
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pp. 07GA08
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Keyword(s):
Keyword(s):
2010 ◽
Vol 16
(2)
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pp. 172-176
Keyword(s):
Keyword(s):
Optimized Positional Compensation Parameters for Exposure Machine for Flexible Printed Circuit Board
2015 ◽
Vol 11
(6)
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pp. 1366-1377
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2015 ◽
Vol 44
(10)
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pp. 3855-3862
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