Parasitic Consideration of Package Design within Press Pack IGBT
2013 ◽
Vol 433-435
◽
pp. 1782-1785
Keyword(s):
Simulation technology provides a powerful tool for the package design. Parasitic are one of the most important factors for press pack IGBT. By the aid of the simulation software, the package parasitic is extracted and the current distribution among paralleled chips is analyzed. Simulation results confirm the theoretical analysis and verify the efficacy of the new approach.
2014 ◽
Vol 536-537
◽
pp. 1527-1531
2017 ◽
Vol 865
◽
pp. 675-680
◽
Keyword(s):
2014 ◽
Vol 945-949
◽
pp. 1360-1363
◽
Keyword(s):
2012 ◽
Vol 433-440
◽
pp. 7287-7292
2009 ◽
Vol 2009
◽
pp. 1-5
◽
2013 ◽
Vol 753-755
◽
pp. 1318-1323
◽
Keyword(s):
2003 ◽
Vol 13
(06)
◽
pp. 1599-1608
◽