Study on Removal and Embedding Mechanism of CdZnTe Using Loose Abrasive

2007 ◽  
Vol 24-25 ◽  
pp. 201-210
Author(s):  
Yan Li ◽  
Hang Gao ◽  
Ren Ke Kang
Keyword(s):  
Physical Model ◽  
Brittle Material ◽  
Material Removal ◽  
Substrate Material ◽  
Material Surface ◽  
Removal Mechanism ◽  
Hard And Brittle Material ◽  
Series Of Experiments ◽  
Three Body ◽  
Brittle Material Removal

Cd1−xZnxTe (CZT) is an excellent ternary compound semiconductor. CZT is the most suitable substrate material for Hg1−yCdyTe epitaxial growth and can make the detector itself. The researchers have done a lot of works on the hard and brittle material removal mechanism in lapping process. however, no published articles are available regarding the removal mechanism and the abrasives embedding mechanism of the soft and brittle material in lapping progress .and there is its own characteristic if the hard abrasives machining the soft and brittle material in lapping progress, the objective of this paper is to build the physical model ,and divide the abrasive into four kinds of abrasives , they are two-body abrasive ,three-body abrasive ,embedded abrasive and small abrasive, and the authors analyze the effects on the material surface of the above abrasives. At last, design series of experiments, through analyzing the results and observe the surface morphology, the authors prove that the physical model is correct.

Removal Mechanism in Wire-Sawing of Hard-Brittle Material

2004 ◽  
Vol 471-472 ◽  
pp. 192-195 ◽  
Author(s):  
J.F. Meng ◽  
Jian Feng Li ◽  
Pei Qi Ge ◽  
W. Gao
Keyword(s):  
Grain Size ◽  
Brittle Material ◽  
Ductile Deformation ◽  
Material Surface ◽  
Removal Mechanism ◽  
Wire Saw ◽  
Average Grain Size ◽  
The Wire ◽  
Diamond Grain ◽  
Brittle Material Removal

A better understanding of the hard-brittle material removal mechanism in wire-sawing provides a basis for optimizing the wire-saw and processing parameters. The maximum cutting depth of each diamond grain in wire-sawing is given. It is proved theoretically that the deformation mode on the machined hard-brittle material surface gradually shifts from brittle fracture to ductile deformation with the increasing of wire-saw velocity, the decreasing of infeed velocity and the decreasing of average grain size. The experimental investigation on the wire-sawing of granite is carried out. It is shown that in the case of wire-saw velocity of 20m/s, infeed velocity of 0.15mm/s and diamond grain size of 200~230#, the removal mechanism in wire-sawing is ductile mode.

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

Material Removal Mechanism in Vibration-Assisted Magnetic Abrasive Finishing

2008 ◽  
Vol 53-54 ◽  
pp. 57-63 ◽  
Author(s):  
Shao Hui Yin ◽  
Yu Wang ◽  
Takeo Shinmura ◽  
Yong Jian Zhu ◽  
Feng Jun Chen
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Magnetic Abrasive Finishing ◽  
Finishing Process ◽  
Abrasive Finishing ◽  
Vibration Assistance ◽  
Series Of Experiments ◽  
Working Distance

This paper proposed a viewpoint to explain why vibration assistance may increase material removal rate (MRR) in vibration-assisted magnetic abrasive finishing process. A series of experiments on vibration-assisted finishing have been carried out. On the basis of these experiments, the finishing characteristics are represented summarily. It was shown that the increase in material rate is mainly due to an increase in material removal per unit working distance.

Study on Polishing Technology for Hard-Brittle Materials by a Micro Abrasive Water Jet

2014 ◽  
Vol 1027 ◽  
pp. 52-57 ◽  
Author(s):  
Zeng Wen Liu ◽  
R.Y. Liu
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicate Glass ◽  
Material Removal ◽  
Brittle Materials ◽  
Material Surface ◽  
Abrasive Water Jet ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Average Roughness

s: Abrasive jet micromachining is considered as a promising precision processing technology for brittle materials such as silicate glass and silicon nitride that are increasingly used in various applications. In this study, some polishing experiments are conducted for hard-brittle materials by a micro slurry jet. The results show that the morphology and the integrity of the material surface are improved greatly after polishing. The average roughness (Ra) value of the silicate glass decrease from 2.32μm to 0.35μm and the average roughness (Ra) value of the Si3N4 decrease from 2.63μm to 0.34μm. The material removal mechanism and the surface formation mechanism are studied. The factors to influence the surface morphology, the surface quality and the surface roughness are analyzed in order to take measures to improve the surface quality and reduce the surface roughness value.

Study on the Removal Mechanism of Magnetorheological Finishing (MRF) by Using of Nano-Diamond Abrasives

2014 ◽  
Vol 1027 ◽  
pp. 226-229
Author(s):  
Zhi Qiang Xu ◽  
Shao Hui Yin ◽  
Sheng Gong ◽  
Yong Qiang Wang
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
High Efficiency ◽  
Optical Glass ◽  
Magnetorheological Fluid ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Magnetorheological Finishing ◽  
Advanced Machining ◽  
Series Of Experiments

Magnetorheological finishing (MRF) is an advanced machining technology can achieve high efficiency and smoother surfaces. This study discusses the material removal mechanism of MRF, and proposes a kind of magnetorheological fluid with the nano-diamond abrasives. A series of experiments on the BK7 optical glass were conducted to investigate effects of the concentration of nano-diamond abrasives on surface quality and removal efficiency.

Sign in / Sign up

Export Citation Format

Share Document