Modeling of High Efficiency Removal in the Grinding of Aluminal/ZrO2 Nanocomposites with the Aid of Two-Dimensional Ultrasonic Vibration

2007 ◽  
Vol 329 ◽  
pp. 451-458 ◽  
Author(s):  
Yan Wu ◽  
A.G. Sun ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Experimental Results ◽  
Two Dimensional ◽  
Conventional Grinding ◽  
Vibration Assistance

Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional ultrasonic vibration grinding (WTDUVG), the theoretical model representing the material removal rate are deduced and verified, and the reason of high efficiency material removal by applying two-dimensional ultrasonic vibration is analyzed. Finally, experimental researches on material removal rate of ceramics were carried out using coarse grit diamond wheel both with and without workpiece two-dimensional ultrasonic vibration assistance grinding. Experimental results indicated that (1) Material removal rate (MRR) in vibration grinding process is about 1.5 times as large as that of in conventional grinding, the experimental results are in good agreement with the calculated ones. (2)The material removal rate increases along with increases of the grinding depth and workpiece velocity both in with and without vibration grinding. (3)The vibration grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of WTDUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile regime grinding.

Modeling of Material Removal Rate in Two-Dimensional Ultrasonic Grinding Complex Ceramics

2007 ◽  
Vol 359-360 ◽  
pp. 431-435
Author(s):  
Guo Fu Gao ◽  
Bo Zhao ◽  
Qing Hua Kong ◽  
Chuan Shao Liu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Brittle Materials ◽  
Machining Process ◽  
Machining Parameters ◽  
Two Dimensional ◽  
Vibration Assistance ◽  
Micro Indentation

Based on the machining pattern, mechanics of material removal and theory of micro-indentation, in previous studies the models of material removal rate of hard-brittle materials was discussed through the relatively influencing factors of machining parameters from various aspects, reflecting the research advances on mechanics of material removal of hard-brittle materials. However, those models of material removal rate have limitations, which results from impercipient theory of fracture of new kinks of materials, randomicity of practical machining process, inappropriate assumptions and simplification of the machining conditions and so on. In this work firstly, previous models of material removal rate of hard-brittle materials machining with ultrasonic assistance were reviewed briefly. Subsequently, the models of material removal rate of complex ceramics machining with two-dimensional ultrasonic vibration assistance were established based on fracture theory of micro- indentation in fracture regime and plastic removal mechanics in ductile regime respectively. The material removal rate is affected not only by the properties of material and machining parameters, but also by the character of grinding wheel and parameters of ultrasonic vibration.

High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

2009 ◽  
Vol 416 ◽  
pp. 609-613
Author(s):  
Ming Li Zhao ◽  
Bo Zhao ◽  
Yu Qing Wang ◽  
Guo Fu Gao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Material Surface ◽  
Grinding Wheel ◽  
Two Dimensional ◽  
Abrasive Grains ◽  
Ultrasonic Grinding ◽  
High Efficient

Relative motion of single abrasive is analyzed for the different applied directions of longitudinal ultrasonic vibration, and its locus is simulated in the present paper. The research results show that the locus in two-dimensional ultrasonic vibration is only similar to that in y-direction, and both are close to sinusoid curves. The width of grooves scratched by abrasive grains y-direction (axial direction of grinding wheel) is two times of the vibration amplitude, and the material removal rate increases remarkably. In case of x-direction (tangential direction of grinding wheel) ultrasonic vibration, abrasive grains with periodic force impact material surface with high frequency vibration, which make material fracture removal easy. Therefore, the high efficiency essence of material removal in two-dimensional ultrasonic grinding is revealed in view of locus. In addition, according to the results of grinding experiments, under same conditions good surface quality can be obtained in two-dimensional ultrasonic grinding and material removal rate in common grinding is the lowest. Consequently it is further proved that the method of two-dimensional ultrasonic vibration grinding is an effective one for ceramic materials.

Modeling of Material Removal in Workpiece Lateral Ultrasonic Vibration Grinding of Fine-Crystalline Zirconia Ceramics

2006 ◽  
Vol 315-316 ◽  
pp. 304-308 ◽  
Author(s):  
Yan Wu ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Average Diameter ◽  
Diamond Wheel ◽  
Movement Model ◽  
Ultrasonic Grinding ◽  
Conventional Grinding

Based on the grain movement model of ultrasonic grinding, models representing the grinding force of single abrasive and the material removal rate (MRR) are deduced and verified. Mechanism of high efficiency material removal in work lateral ultrasonic vibration grinding (WLUVG) was analyzed. The MRR of fine-crystalline ZrO2 ceramics in WLUVG and conventional grinding (CG) with diamond wheel were researched experimentally in this work. The effects on the MRR, the surface roughness and microstructure of the process parameters and the size of abrasive are measured. It has been concluded that: (1) the MRR in ultrasonic grinding process is two times as large as that of in CG. (2) any increase in the amount of energy imparted to the workpiece in terms of the average diameter of grains, grinding depth both in with and without ultrasonic grinding, will result in an increase in the MRR and the surfaces roughness. (3) the ultrasonic grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of vibration grinding is superior to that of CG, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile mode grinding.

Optimization of μEDM process assisted with rotating magnetic pulling force and ultrasonic vibration

2021 ◽  
pp. 095440892098440
Author(s):  
Gurpreet Singh ◽  
DR Prajapati ◽  
PS Satsangi
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Electrical Discharge ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Machining Process ◽  
Micro Electrical Discharge Machining ◽  
Pulling Force ◽  
Tool Rotation

The micro-electrical discharge machining process is hindered by low material removal rate and low surface quality, which bound its capability. The assistance of ultrasonic vibration and magnetic pulling force in micro-electrical discharge machining helps to overcome this limitation and increase the stability of the machining process. In the present research, an attempt has been made on Taguchi based GRA optimization for µEDM assisted with ultrasonic vibration and magnetic pulling force while µEDM of SKD-5 die steel with the tubular copper electrode. The process parameters such as ultrasonic vibration, magnetic pulling force, tool rotation, energy and feed rate have been chosen as process variables. Material removal rate and taper of the feature have been selected as response measures. From the experimental study, it has been found that response output measures have been significantly improved by 18% as compared to non assisted µEDM. The best optimal combination of input parameters for improved performance measures were recorded as machining with ultrasonic vibration (U1), 0.25 kgf of magnetic pulling force (M1), 600 rpm of tool rotation (R2), 3.38 mJ of energy (E3) and 1.5 mm/min of Tool feed rate (F3). The confirmation trail was also carried out for the validation of the results attained by Grey Relational Analysis and confirmed that there is a substantial improvement with both assistance applied simultaneously.

scholarly journals Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1918
Author(s):  
Dongpo Wang ◽  
Shouxiang Lu ◽  
Dong Xu ◽  
Yuanlin Zhang
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Failure Modes ◽  
High Efficiency ◽  
Abrasive Particle ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Cutting Test ◽  
Sic Composites

C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the a p with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.

Wear Characteristics of the Sub-Aperture Tools and Material Removal Rate in Precision Grinding with Loose Abrasives

2007 ◽  
Vol 329 ◽  
pp. 69-74
Author(s):  
H. Cheng ◽  
H.Y. Tam ◽  
Y. Gao ◽  
Yong Bo Wu ◽  
Y. Wang
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Process Analysis ◽  
Actual Process ◽  
Correlative Function ◽  
Glass Specimen ◽  
Grinding Tool ◽  
The Relationship

This paper proposes a sub-aperture grinding tool for loose abrasive computer controlled surfacing, which is designed to perform epicyclic motion and rotate around its centre at a rapid rate, whilst the entire mechanism revolves around a secondary centre at a slower rate. In actual process, the wear of the tool could affect the material removal function, and make the process unstable, thus in fact, it is difficult to make a deterministic manufacturing. The focus of the present paper is on wearing characteristics of sub-aperture tools and the wear evenness as the main objectives. To make a further study, material removal function of the tool is firstly established through theoretically modelling, next, a correlative function with weighted factors is built, which is suitable for specifying the wearing degree of the tool. Finally, to discover the relationship between the material removal rate and the tool wearing characteristics, and to optimize the grinding process, analysis and experiments are then carried out on a K9 glass specimen by means of three kinds of tool materials, i.e., polyurethane pad, aluminum plate and pitch based on the proposed technique and model. The results indicated that the required high efficiency and precision could be achieved by choosing proper processes.

Material Removal Model and Experimental Verification for Abrasive Jet Precision Finishing with Wheel as Restraint

2006 ◽  
Vol 304-305 ◽  
pp. 555-559 ◽  
Author(s):  
Chang He Li ◽  
Guang Qi Cai ◽  
Shi Chao Xiu ◽  
Q. Li
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Grinding Wheel ◽  
Rate Model ◽  
Material Removal Model ◽  
Material Removal Rate Model ◽  
Three Body ◽  
Precision Finishing

The material removal rate (MRR) model was investigated in abrasive jet precision finishing (AJPF) with wheel as restraint. When abrasive wore and workpiece surface micro-protrusion removed, the size ratio for characteristic particle size to minimum film thickness gradually diminishing, the abrasive machining from two-body lapping to three-body polishing transition in AJPF with grinding wheel as restraint. In the study, the material removal rate model was established according to machining mechanisms and machining modes from two-body to three-body process transition condition, and active number of particles in grinding zone were calculated and simulated. Experiments were performed in the plane grinder for material removal mechanism and academic models verification. It can be observed from experimental results that the surface morphology change dramatically to a grooved or micro-machined surface with all the grooves aligned in the sliding direction in two-body lapping mode. On the other hand, the surface is very different, consists of a random machining pits with very little sign of any directionality to the deformation in the three-body machining mode. Furthermore, the material removal rate model was found to give a good description of the experimental results.

Comparative Study and Mathematical Modeling of Machining Parameters in Ultrasonic-Assisted EDM of AISI H13 Tool Steel by the Application of Workpiece Vibration

2010 ◽  
Vol 154-155 ◽  
pp. 1604-1613
Author(s):  
Mohammad Reza Shabgard ◽  
Babak Sadizadeh ◽  
Keivan Amini ◽  
Hamid Pourziaie
Keyword(s):  
Comparative Study ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Correct Selection ◽  
Machining Parameters ◽  
Machining Performance ◽  
Ultrasonic Assisted ◽  
Aisi H13

The correct selection of the machining parameters is one of the most significant issues to take into consideration in Ultrasonic-assisted Electrical Discharge Machining (US-EDM) and EDM processes. In the present work, a study has been made to develop and extract statistical models to show the relationship between important machining performance data (material removal rate (MRR), tool wear ratio (TWR) and surface roughness Ra) and the input machining parameters (pulse current, and pulse-on time) in the EDM and US-EDM of AISI H13. The models obtained were used to analyze the effects of input parameters on machining performance. In addition, a comparative study was carried out to investigate the effect of ultrasonic vibration of the workpiece on machining performance. The results show that Ultrasonic vibration of the workpiece can significantly reduce the inactive pulses and improves the stability of process. Also US-EDM is effective in attaining a high material removal rate (MRR) in finishing regime in comparison with conventional EDM. The results of Analysis of Variance (ANOVA) indicate that the proposed mathematical models can adequately explain the performance within the limits of the factors being studied.

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

2009 ◽  
Vol 626-627 ◽  
pp. 35-40 ◽  
Author(s):  
Z. Liang ◽  
Yong Bo Wu ◽  
Xin Bing Wang ◽  
Y. Peng ◽  
Wei Xing Xu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Sapphire Substrate ◽  
High Efficiency ◽  
Vibration Mode ◽  
Two Dimensional ◽  
Grinding Forces ◽  
Work Surface ◽  
Conventional Grinding ◽  
Grinding Technique ◽  
Ultrasonic Vibration Assisted Grinding

This paper discusses the feasibility of improving machining efficiency of sapphire substrate by using two-dimensional (2D) ultrasonic vibration assisted grinding. An elliptic ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body (stainless steel, SUS304). The sapphire substrate is fixed onto the top face of the vibrator and ultrasonically vibrates in 2D vibration mode when the PZT is excited by two alternating current voltages with a phase difference. A grinding apparatus mainly composed of the ultrasonic vibrator is constructed, and experiments are performed with lateral modulation of elliptic ultrasonic vibration vertical to the grinding direction. Both the grinding forces and the ground work surface are measured and examined. Experimental results show that the grinding force decreases significantly and the resulted surface is improved in certain degree with the ultrasonic vibration compared to those of conventional grinding without ultrasonication. This indicates that the high efficiency grinding for sapphire substrate can be performed with the two-dimensional vibration grinding technique presented in this paper.

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