Removal Process Technology of Precision Grinding for Complicated Surface Part of High Performance Hard and Brittle Materials

2007 ◽  
Vol 359-360 ◽  
pp. 123-127
Author(s):  
Tian Ji ◽  
Dong Ming Guo ◽  
Gui Hong Bian
Keyword(s):  
High Performance ◽  
Screening Method ◽  
Brittle Materials ◽  
Precision Machining ◽  
Grinding Wheel ◽  
Process Conditions ◽  
Process Technology ◽  
Removal Process ◽  
Hard And Brittle Materials ◽  
Complicated Surface

Some key parts used in such area as the national defence are made of high performance hard and brittle materials, and they should meet not only the requirement of geometry accuracy but also that of specified physical performance in manufacturing. The Radome is one of such key parts in the active homing guidance weapon, with a typical complicated surface. In order to meet the electric thickness requirement, a controlled removal grinding point-by-point is needed for the radome during its precision machining. A special 3-coordinates equipment with spherical diamond grinding wheel is adopted; the grinding paths are generated in the planes normal to the cutter axis with a Z-level profile machining method; the feed step is determined by step screening method; and the stepping between layers is carried out according to the remaining scallop crest height. Process conditions including the grinding depth and the workpiece speed are determined through experiments, and the process errors under different processing conditions are analyzed to put forward an optimized processing tactics. As a result, a basis for precision removal process of any other part of high performance hard and brittle materials with complex surface is established, and a technology support for precision machining of key parts in the national major projects is provided.

Experimental Study of Precision Polishing of Hard and Brittle Material

2007 ◽  
Vol 359-360 ◽  
pp. 274-278
Author(s):  
Li Hua Dong ◽  
Chun Hua Fan ◽  
Jian Huang ◽  
Hong Xia Luo
Keyword(s):  
Experimental Study ◽  
High Speed ◽  
Brittle Materials ◽  
Precision Machining ◽  
High Productivity ◽  
Hard And Brittle Materials ◽  
Hard And Brittle Material ◽  
Ultra Precision ◽  
Diamond Grain ◽  
Polishing Tool

The application of hard and brittle materials become wider and wider because its self-characteristics. It is used widely in finish machining of products, such as memory record device, information products, precision instrument, etc. Traditional grinding-polishing methods have not suited for precision machining requirements of hard and brittle materials. Carbide and ceramic are chosen as workpiece. Diamond polishing film is chosen as polishing tool. Polishing experiments are done by using self-made film polishing machine with high speed and cooling inside. Polishing mechanism and polishing technology of what polishing film polishes hard and brittle materials will be studied by changing polishing speed and diamond grain size and so on. The experimental study of wear shape of gringding grain, desquamation process of grain and surface quality of workpiece will be done in this paper so that the reasonable technology of polishing hard and brittle materials with high productivity is obtained. It enrich and perfect the ultra-precision machining theory. A new method of ultra-precision lapping and polishing of hard and brittle materials is provided.

scholarly journals An Improved Cutting Force Model for Ultrasonically Assisted Grinding of Hard and Brittle Materials

2021 ◽  
Vol 11 (9) ◽  
pp. 3888
Author(s):  
Renke Kang ◽  
Jinting Liu ◽  
Zhigang Dong ◽  
Feifei Zheng ◽  
Yan Bao ◽  
...  
Keyword(s):  
Cutting Force ◽  
Cutting Forces ◽  
Experimental Studies ◽  
Brittle Materials ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Force Model ◽  
Cutting Force Model ◽  
Fillet Radius ◽  
Hard And Brittle Materials

Cutting force is one of the most important factors in the ultrasonically assisted grinding (UAG) of hard and brittle materials. Many theoretical and experimental studies show that UAG can effectively reduce cutting forces. The existing models for UAG mostly assume an ideal grinding wheel with abrasives in both the end and lateral faces to accomplish material removal, whereas the important role of the transition fillet surface is ignored. In this study, a theoretical cutting force model is presented to predict cutting forces with the consideration of the diamond abrasives in the end face, the lateral face, and the transition fillet surface of the grinding tool. This study analyzed and calculated the vibration amplitudes and the cutting forces in both the normal and tangential directions. It discusses the influences of the input parameters (rotation speed, feed rate, amplitude, depth and radius of transition fillet) on cutting forces. The study demonstrates that the fillet radius is an important factor affecting the grinding force. With an increase in fillet radius from 0.2 to 1.2 mm, the grinding force increases by 139.6% in the axial direction and decreases by 70% in the feed direction. The error of the proposed cutting force model is 10.3%, and the experimental results verify the correctness of the force model.

Development of High Performance Monolayer Brazed Diamond Grinding Tool for Ceramics

2010 ◽  
Vol 135 ◽  
pp. 388-392
Author(s):  
Bei Zhang ◽  
Hong Jun Xu ◽  
Yu Can Fu ◽  
Hong Hua Su
Keyword(s):  
High Performance ◽  
High Efficiency ◽  
Ground Surface ◽  
Precision Machining ◽  
Grinding Wheel ◽  
Precision Grinding ◽  
Diamond Tools ◽  
Before And After ◽  
Grinding Tool ◽  
Ceramic Grinding

This study has developed a new kind of high performance monolayer brazed diamond tool for ceramic grinding. The grit size of the diamond brazed in the grinding wheel surface is 300m, which has never been reported in diamond tools for ceramic precision machining. The experiment has achieved wonderful surface finish of Zirconia workpiece. This does owe to the designed and precision conditioned topography of the new developed grinding wheel. The topography of the grinding wheel before and after dressing has been measured by means of laser triangulation method. Then the Zirconia workpiece has been ground. The obtained Ra value decreases with no spark grinding times and the minimum Ra of the ground surface is 0.11m. The study proved that the brazed large grit diamond tools would realize high efficiency and precision grinding, namely, high performance of ceramic grinding.

Application and Development of High-Efficiency Abrasive Finishing

2011 ◽  
Vol 189-193 ◽  
pp. 3113-3116
Author(s):  
Chang He Li ◽  
Ling Yun Qi ◽  
Hua Yang Zhao
Keyword(s):  
High Speed ◽  
High Performance ◽  
High Efficiency ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Machining ◽  
Machining Processes ◽  
Belt Grinding ◽  
Hard And Brittle Materials ◽  
High Removal Rate

High-efficiency abrasive machining is one of the important technology of advanced manufacture. Combined with raw and finishing machining, it can attain high removal rate like turning, milling and planning. The difficult-to-grinding materials can also be ground by means of this method with high performance. In the present paper, development status and latest progresses on high efficiency abrasive machining technologies relate to high speed and super-high speed grinding, high efficiency deep-cut grinding, hard and brittle materials high-efficiency grinding, powerful grinding and belt grinding were summarized. The efficiency and parameters range of these abrasive machining processes were compared. The key technologies of high efficiency abrasive machining, including grinding wheel, spindle and bearing, grinder, coolant supplying, installation and orientation of wheel and workpiece and safety defended, as well as intelligent monitor and NC grinding were investigated.

Effect of Cutting Edge Truncation on Ground Surface Morphology of Hard and Brittle Materials for Optical Devices

2005 ◽  
Vol 291-292 ◽  
pp. 139-144 ◽  
Author(s):  
X. Kang ◽  
Junichi Tamaki ◽  
Akihiko Kubo ◽  
Ji Wang Yan ◽  
Toshirou Iyama
Keyword(s):  
Surface Morphology ◽  
Brittle Materials ◽  
Ground Surface ◽  
Optical Devices ◽  
Cutting Edge ◽  
Grinding Wheel ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Crystal Quartz ◽  
Materials Used

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.

Grindability of Micro Pyramid-Structured Surface for Various Hard and Brittle Materials

2010 ◽  
Vol 126-128 ◽  
pp. 855-860
Author(s):  
Jin Xie ◽  
Y.X. Lu ◽  
Y.W. Zhuo
Keyword(s):  
Aspect Ratio ◽  
Brittle Materials ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Structured Surface ◽  
Diamond Grinding Wheel ◽  
Tool Paths ◽  
Diamond Grinding ◽  
Sic Ceramics ◽  
Hard And Brittle Materials

A novel grinding approach of micro pyramid-structured surface is proposed by using a 60º V-tip of #600 diamond grinding wheel in CNC system. The research objective is to understand the micro grindability of various hard and brittle materials including quartz glass, silicon, SiC ceramics and WC alloy. First, a CNC mutual-wear truing approach was developed to sharpen the wheel V-tip; then, the wheel V-tip was employed to pattern the micro pyramidal array on workpiece surface along CNC tool paths; finally, the machined micro-structured surface and its form accuracy and aspect ratio were investigated. It is shown that this CNC mutual-wear truing approach can not only produce a V-shaped diamond grinding wheel, but also sharpen the diamond grain edges on the wheel V-tip. This wheel V-tip may be used to machine the micron-scale pyramid arrays on silicon, SiC ceramics and WC alloy surfaces with CNC level reticulated cross tool paths, the depth of cut of 1 m and on-machine V-tip form-truing process. Although the average form error of machined micro-structured surface is very small, its pyramidal tops and groove bottoms appear very large form errors, which are dominated by the wheel V-tip sharpness and the grinding conditions, respectively. This leads to a decrease in the aspect ratio by about 38%, 30% and 14% in contrast to the ideal one of 0.87 for silicon, SiC ceramics and WC alloy, respectively.

Sign in / Sign up

Export Citation Format

Share Document