Grain Refinement during Superplastic Deformation of Coarse-Grained Al-Mg-Cu Alloys

2006 ◽  
Vol 509 ◽  
pp. 75-80 ◽  
Author(s):  
M.I. Cruz-Palacios ◽  
D. Hernández-Silva ◽  
L.A. Barrales-Mora ◽  
M.A. García-Bernal

In the present study the superplastic behavior of Al-6%Mg–0.5%Cu and Al–8%Mg– 0.5%Cu in a coarse grain size condition has been studied. The alloys are melted in an electrical furnace under argon atmosphere. The ingots (25 mm thick) are homogenized at 400 °C during 72 h and then rolled at 430 °C to a thickness of 5 mm. The mean grain size after rolling is 55 µm for the 6%Mg alloy and 61 µm for the 8%Mg alloy. Tensile test specimens are machined from the rolled plate in the rolling direction. Strain-rate-change tests at temperatures between 300 and 450 °C and strain rates between 1x10-4 and 1x10-1 s-1 are carried out to determine the strain rate sensitivity of the flow stress. Finally, elongation to failure tests are conducted at temperatures and strain rates where the alloys show a high strain rate sensitivity. Elongations higher than 390 % are obtained for the 8%Mg alloy. It is observed that the grip regions of the deformed samples show coarser grains than the regions near to the fracture surface. This means that grain refinement takes place during deformation, suggesting that the principal deformation mechanism is dislocation creep.

2010 ◽  
Vol 45 (17) ◽  
pp. 4790-4795 ◽  
Author(s):  
Byungmin Ahn ◽  
Rahul Mitra ◽  
Enrique J. Lavernia ◽  
Steven R. Nutt

2012 ◽  
Vol 17 ◽  
pp. 35-51 ◽  
Author(s):  
Reza Jafari Nedoushan ◽  
Mahmoud Farzin ◽  
Mohammad Mashayekhi

Recent Experiments on Nano-Crystalline Materials Show an Increase of Strain-Rate Sensitivity in Contrast to the Conventional Coarse-Grained Materials. these Materials Also Show a Different Grain Size Dependency as Compared to Coarse-Grained Materials. to Explain these Issues, a Constitutive Equation Is Proposed which Considers Dominant Deformation Mechanisms Including Grain Interior Plasticity, Grain Boundary Diffusion and Grain Boundary Sliding. the Stresses Obtained from these Constitutive Equations Match Well with the Experimental Data for Nanocrystalline Copper at Different Strains and Strain Rates. the Model Also Well Predicts Variation of Strain Rate Sensitivity Parameter. this Variation Can Be Explained with Regard to the above Mentioned Effective Deformation Mechanisms. Deviation from the Hall-Petch Law and Inverse Hall-Petch Effect Are Also Well Illustrated by the Model.


2008 ◽  
Vol 23 (8) ◽  
pp. 2238-2244 ◽  
Author(s):  
Guoyong Wang ◽  
Zhonghao Jiang ◽  
Hanzhuo Zhang ◽  
Jianshe Lian

A fully dense nanocrystalline (nc) Cu with mean grain size of 72 nm and a broad grain size distribution was synthesized by electrodeposition. Uniaxial tensile tests were done at different strain rates and room temperature. A very high strength of 1.04 G was obtained at strain rate of 0.1 s−1. The nearly perfect plasticity with a large strain of close to 20% was displayed at specific low strain rates of 4 × 10−5 to 10−4 s−1. With increasing strain rate, the nearly perfect plasticity disappeared. Strain rate sensitivity and activation volume of the nc Cu were estimated from the flow stress at a fixed strain of 1% and a strain rate change (jump) test. It was deduced from the high strain rate sensitivity exponent of 0.08 and small activation volume of 12b3 that both dislocation and grain boundary activities would take place in this nc Cu, which explained the nearly perfect plasticity observed in the tensile test.


2006 ◽  
Vol 503-504 ◽  
pp. 31-36 ◽  
Author(s):  
Johannes Mueller ◽  
Karsten Durst ◽  
Dorothea Amberger ◽  
Matthias Göken

The mechanical properties of ultrafine-grained metals processed by equal channel angular pressing is investigated by nanoindentations in comparison with measurements on nanocrystalline nickel with a grain size between 20 and 400 nm produced by pulsed electrodeposition. Besides hardness and Young’s modulus measurements, the nanoindentation method allows also controlled experiments on the strain rate sensitivity, which are discussed in detail in this paper. Nanoindentation measurements can be performed at indentation strain rates between 10-3 s-1 and 0.1 s-1. Nanocrystalline and ultrafine-grained fcc metals as Al and Ni show a significant strain rate sensitivity at room temperature in comparison with conventional grain sized materials. In ultrafine-grained bcc Fe the strain rate sensitivity does not change significantly after severe plastic deformation. Inelastic effects are found during repeated unloading-loading experiments in nanoindentations.


2019 ◽  
Vol 2019 (1) ◽  
pp. 000480-000487
Author(s):  
Luke A. Wentlent ◽  
James Wilcox ◽  
Xuanyi Ding

Abstract As the electronics industry continues to evolve a concerted effort has developed to implement lower melting point solders. The ability to minimize the thermal exposure that an assembly is subjected to affords significant benefits with respect to both the reliability and the materials that can be used. One of the most popular low melt solder alloys currently being investigated by the industry is the Bi-Sn eutectic system, which has a melting point of 139°C. The BiSn system itself is not particularly novel as it was posited as a SAC alternative during the initial shift from Pb based solders. While a body of knowledge currently exists regarding this system, and the near eutectic variant BiSnAg, there are still concerns regarding its ductility, especially as a function of thermal exposure and strain rate. Bismuth is widely acknowledged as a brittle element and its presence in such quantities raises concerns of not just Cu6Sn5 embrittlement but also solder fragility in high strain rate types of environments. A challenge with regards to near term implementation is that most packages are not available with BiSn solder bumps. Therefore, it will be necessary to use components already balled with SAC 305 solder. This means that the resulting solder interconnect, reflowed below conventional SAC reflow temperatures, will form a type of mixed hybrid microstructure. This non-equilibrium microstructure will be composed of two regions, one Bi-rich region which is well past saturation and a second region which is Bi-deficient. It is of specific industrial interest then to not just investigate the BiSn solder system but also within the context of a realistic mixed interconnect. Recent work by several researchers has shown that this hybrid microstructure is unstable and quite active with respect to the movement and localized concentration of the Bismuth. The degree of mixing of these two regions has been shown to be highly dependent upon reflow temperature and the paste to ball volume ratio. Mixed SAC-BiSn solder joints were formed by placing SAC 305 spheres on BiSn paste deposits for a paste to ball volume ratio of .18. These samples were then reflowed at either 175°C or 200°C. SAC 305 control samples were also made using a conventional Pb-free reflow profile with a peak temperature of 247°C. A 22 mil Cu-OSP pad on a 1.0 mm thick FR4 substrate was used for all samples. A selection of the solder joints were then isothermally aged at 90°C for 200 hours. Using a joint level micromechanical tester, ball shear tests were conducted at a range of strain rates for samples in the as-reflowed and aged state. Using this information, the strain rate sensitivity of the interconnects was mapped and correlated with the observed failure modes. Investigations into the fracture mechanisms were conducted by examining the shear fracture surface with optical and scanning electron microscopy. Additionally, the evolution of the microstructure was characterized. Results showed a clear transition from ductile solder failure to a brittle separation failure at the higher strain rates.


Metals ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 344 ◽  
Author(s):  
Simon Sevsek ◽  
Christian Haase ◽  
Wolfgang Bleck

The strain-rate-dependent deformation behavior of an intercritically annealed X6MnAl12-3 medium-manganese steel was analyzed with respect to the mechanical properties, activation of deformation-induced martensitic phase transformation, and strain localization behavior. Intercritical annealing at 675 °C for 2 h led to an ultrafine-grained multi-phase microstructure with 45% of mostly equiaxed, recrystallized austenite and 55% ferrite or recovered, lamellar martensite. In-situ digital image correlation methods during tensile tests revealed strain localization behavior during the discontinuous elastic-plastic transition, which was due to the localization of strain in the softer austenite in the early stages of plastic deformation. The dependence of the macroscopic mechanical properties on the strain rate is due to the strain-rate sensitivity of the microscopic deformation behavior. On the one hand, the deformation-induced phase transformation of austenite to martensite showed a clear strain-rate dependency and was partially suppressed at very low and very high strain rates. On the other hand, the strain-rate-dependent relative strength of ferrite and martensite compared to austenite influenced the strain partitioning during plastic deformation, and subsequently, the work-hardening rate. As a result, the tested X6MnAl12-3 medium-manganese steel showed a negative strain-rate sensitivity at very low to medium strain rates and a positive strain-rate sensitivity at medium to high strain rates.


2012 ◽  
Vol 735 ◽  
pp. 271-277 ◽  
Author(s):  
Tomoyuki Kudo ◽  
Akira Goto ◽  
Kazuya Saito

Blow forming accompanied with superplasticity makes possible the forming of complex parts, which cannot be formed by cold press forming. The conventional superplastic AA5083 alloy ‘ALNOVI-1’ developed by the Furukawa-Sky Aluminum Corp. shows high superplasticity because of its fine grain and is widely used for blow forming. However, for mass production of components, an Al-Mg alloy with finer-sized grains is needed. In this research, the newly developed high Mn version of the Al-Mg alloy ‘ALNOVI-U’ is used, and this material possesses grains finer than those of the conventional AA5083 alloy. The effects of finer grain size on the blow formability at high strain rates over 10-2/s and the properties of the resulting moldings were studied.


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