Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO2) Particles

2016 ◽  
Vol 857 ◽  
pp. 68-72
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Titanium Oxide ◽  
Composite Solder ◽  
Microwave Sintering ◽  
Lead Free ◽  
Lead Free Solder ◽  
Composite Solder Joint ◽  
Weight Percentage ◽  
Free Solder

In this paper, Sn-0.7Cu composite containing weight percentage of 1.0 wt. % of titanium oxide (TiO2) particles were successfully fabricated by using the powder metallurgy (PM) route assisted hybrid microwave sintering. This research investigated the effect s of TiO2 particles addition on the interfacial reactions formed between Sn-0.7Cu solder/substrate and shear strength of a Sn-0.7Cu solder alloy. With the increasing of TiO2 particles, Sn-0.7Cu-TiO2 composite solder showed decreasing in thickness value and shear strength was increased. This signified that the presence of TiO2 particles effect on the thickness of Cu6Sn5 IMC layer at the interface and mechanical properties Sn-0.7Cu composite solder joint.

Enhancement of Microstructural and Physical Properties of Sn-0.7Cu Lead-Free Solder with the Addition of SiC Particles

2018 ◽  
Vol 280 ◽  
pp. 181-186
Author(s):  
Z. Mahim ◽  
Nurul Razliana Abdul Razak ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Norainiza Saud
Keyword(s):  
Mechanical Properties ◽  
Physical Properties ◽  
Composite Solder ◽  
Physical And Mechanical Properties ◽  
Lead Free ◽  
Attractive Alternative ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
Free Solder ◽  
Sic Particle

Nowadays, composite solder has gained researcher’s attention due to its promising improvement in physical and mechanical properties for lead-free solder. To improve the properties of Sn-0.7Cu (SnCu): the promising lead-free candidate, addition of silicon carbide (SiC) as a reinforcement was used into this study. However, its limitation on solderability as compared with SnAgCu (SAC) make it not an attractive alternative lead-free solder. This study was carried out to investigate the effect of SiC particle on microstructure evolution and physical properties of SnCu based solder alloys. SnCu-SiC composite solders were synthesized by powder metallurgy method (PM), which consists of several processes such as mechanical blending, compaction and sintering. Five different weight percentages of SiC particle; 0.00, 0.25, 0.50, 0.75 and 1.00 were mechanically blended with SnCu lead-free solder. The result shows that the addition of SiC particle has decreased the β-Sn area and refined the microstructure of composite solder. In addition, the improvement in microhardness of composite was achieved.

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

2015 ◽  
Vol 754-755 ◽  
pp. 535-539
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
M.N. Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sintering Process ◽  
Homogeneous Microstructure ◽  
Free Solder

This research has investigated the microstructural analysis and shear strength of Sn-1.0Ag-0.7Cu (SAC107) alloy used as matrix while silicon nitride (Si3N4) as reinforcement particles with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %). The composite solders were fabricated using powder metallurgy (PM) method consisting of mixing, compaction and sintering process. With additions of Si3N4 particles, the composite solders experienced a corresponding increase in strength due to fine and homogeneous microstructure. This is signified that the presence of Si3N4 particles effectively refines the microstructure.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder

2020 ◽  
Vol 49 (12) ◽  
pp. 7394-7399
Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Cunguo Zuo ◽  
Zongxiang Yao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Graphene Nanosheets ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

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