Partially Hollow Substrate Integrated Waveguide and 1:2 Traveling-Wave Power Combiner using 3D Printing

2021 ◽  
Vol 70 (8) ◽  
pp. 1188-1196
Author(s):  
Seong-Hee Han ◽  
Ha-Wuk Sung ◽  
Dong-Wook Kim
IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 88327-88337 ◽  
Author(s):  
Honglei Sun ◽  
Xiao-Wei Zhu ◽  
Ruijia Liu ◽  
Zhi Hao Jiang

2019 ◽  
Vol 12 (1) ◽  
pp. 48-57
Author(s):  
Honglei Sun ◽  
Xiao-Wei Zhu ◽  
Xuesong Shi ◽  
Ruijia Liu

AbstractThis paper presents a novel assessment method that minimizes test-fixture-induced errors in non-coaxial power combiner measurement by extending the port reduction method. This method involves terminating certain ports to acquire the scattering matrix of an N-port network from the scattering matrix measured at a reduced port order. The entire DUT scattering matrix is obtained from multiple scanning measurements, which are taken from partial coaxial accessible ports, based on a set of configurable terminating states. This advantage is leveraged to exclude a major portion of coaxial launch structures that would otherwise be incorporated in the conventional multiport test fixture. An analogous concept here is applied to measure a waveguide traveling-wave power combiner. A sandwiched twin structure, containing a divider/combiner pair with certain auxiliary through-type components cushioned between them, is utilized to assess the combiner characteristics. A theoretical framework of the proposed method was established to test its potential precision. Thereafter, an in-situ implementation was conducted to test its practical application on a traveling-wave combined amplifier prototype operating at the Q-band (33–39 GHz).


2020 ◽  
Vol 20 (2) ◽  
pp. 131-138
Author(s):  
Sung-June Hong ◽  
Min-Pyo Lee ◽  
Seil Kim ◽  
Jun-Su Lim ◽  
Dong-Wook Kim

In this paper, we present a Ku-band low-loss traveling-wave power divider that uses a hollow substrate integrated waveguide (HSIW). For easy connection with microstrip-based devices and circuits, a low-loss transition between the microstrip line and the HSIW structure was implemented using C-cut via holes at the discontinuity interface, which reduces radiation and leakage effects and improves mismatch performance. To validate the performance of the transition, a back-to-back microstrip-to-HSIW transition was designed, fabricated, and measured from 12.5 GHz to 15.5 GHz. The measured results showed a return loss of 18 dB or more and an insertion loss of 0.5 ± 0.07 dB. An HSIW-based, low-loss 1:3 traveling-wave power divider was fabricated and measured from 13.5 GHz to 14.5 GHz. The power divider showed a return loss of at least 21 dB, an insertion loss of 0.57 ± 0.03 dB, and a power combining efficiency of 87.1%–88.3%.


2015 ◽  
Vol 25 (9) ◽  
pp. 567-569 ◽  
Author(s):  
Jun Dong ◽  
Yu Liu ◽  
Ziqiang Yang ◽  
Hao Peng ◽  
Tao Yang

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