Effect of brazing temperatures on microstructure and properties of TC4/Ti57Zr13Cu21Ni9/316L

Titanium alloy is an important metal material with excellent specific strength, which is widely used in aerospace field, nuclear industry, chemical medicine, and military industry. In order to investigate the connection conditions of TC4 titanium alloy and 316L stainless steel at different temperatures, the braze welding measurement with Ti57Zr13Cu21Ni9 filler metal was conducted in vacuum. The microstructure, morphology and phase of the joint were characterized by SEM (scanning electron microscope), EDS (Energy Dispersive Spectrometer) and XRD (X-ray diffraction), respectively. Microhardness and shear strength of the joint at room temperature and the bonding mechanism of TC4 and 316L were also investigated. The obtained results revealed that the main phases in the diffusion layer were Ti-based solid solution and Ti-Fe (TiFe and TiFe2) intermetallic compoundsands (IMCs) the center of the braze was mainly composed of Ti-Fe IMCs, (Ti, Zr)2(Ni, Cu), Ti-based solid solution. Additionally, the increase of brazing temperature firstly increased and then decreased the average shear strength with the maximum value of 133.9 MPa at 960 °C.

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

Microstructure and Physical Properties of Alloy Brazed with Filler by Mapping Scanning Analysis and Wettability Test

In this paper, a new type of AlSiMgCuNiAg filler metal was developed. The solidus temperature of the filler metal is 509.1°C and the liquidus temperature is 531.3°C. The filler metal has a good wetting and spreading effect on the surface of 6061 aluminum alloy. The CuAl2 phase in the brazing seam was greatly aggregated after brazed, while the CuAl2 phase was reduced and Mg2Si strengthening phase was formed when the brazed joints with heat treatment. The average shear strength of the brazed joint without heat treatment was 47.1MPa, and the average shear strength of the brazed joint with heat treatment reached to 108.7Mpa. The strength of the brazed joint with heat treatment was increased by about 131% relative to the strength of the brazed joint without heat treatment.

Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers

This work aims to investigate the joining of Ti6Al4V alloy to alumina by diffusion bonding using titanium interlayers: thin films (1 µm) and commercial titanium foils (5 µm). The Ti thin films were deposited by magnetron sputtering onto alumina. The joints were processed at 900, 950, and 1000 °C, dwell time of 10 and 60 min, under contact pressure. Experiments without interlayer were performed for comparison purposes. Microstructural characterization of the interfaces was conducted by optical microscopy (OM), scanning electron microscopy (SEM) with energy dispersive X-ray spectroscopy (EDS), and electron backscatter diffraction (EBSD). The mechanical characterization of the joints was performed by nanoindentation to obtain hardness and reduced Young’s modulus distribution maps and shear strength tests. Joints processed without interlayer have only been achieved at 1000 °C. Conversely, joints processed using Ti thin films as interlayer showed promising results at temperatures of 950 °C for 60 min and 1000 °C for 10 and 60 min, under low pressure. The Ti adhesion to the alumina is a critical aspect of the diffusion bonding process and the joints produced with Ti freestanding foils were unsuccessful. The nanoindentation results revealed that the interfaces show hardness and reduced Young modulus, which reflect the observed microstructure. The average shear strength values are similar for all joints tested (52 ± 14 MPa for the joint processed without interlayer and 49 ± 25 MPa for the joint processed with interlayer), which confirms that the use of the Ti thin film improves the diffusion bonding of the Ti6Al4V alloy to alumina, enabling a decrease in the joining temperature and time.

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.

Characterisation of a skin secretion with adhesive properties in the ground frog Eupsophus vertebralis (Alsodidae)

Some skin secretions with adhesive properties allow frogs to distract predators and escape; their nature is poorly studied. Here, we report the sticky skin secretion released by the Patagonian frog Eupsophus vertebralis when stressed. This secretion contained ~ 50% proteins spanning 25–250 kDa and required a fast setting time to turn into strong adhesive, which worked well on synthetic and biological materials. Lap-shear assays with Eupsophus glue secretion showed average shear strength of 3.34 MPa, comparable to cyanoacrylate (5.47 MPa). These properties suggest its biotechnological value for practical applications in industrial and medical sectors.

Comparative Analysis of Shear Strength Parallel to Fiber of Different Local Bamboo Species in the Philippines

There are limited published studies related to the mechanical properties of bamboo species in the Philippines. In this study, the shear strength properties of some economically viable bamboo species in the Philippines were properly characterized based on 220 shear test results. The rationales of selecting this mechanical property are the following: (1) Shear strength, parallel to the fiber, has the highest variability among the mechanical properties; and (2) Shear is one of the governing forces on joint connections, and such connections are the points of failure on bamboo structures when subjected to extreme loading conditions. ISO 22157-1 (2017) test protocol for shear was used for all tests. The results showed that Bambusa blumeana has the highest average shear strength, followed by Gigantochloa apus, Dendrocalamus asper, Bambusa philippinensis, and Bambusa vulgaris. However, comparative analysis, using One-way ANOVA, showed that shear strength values among these bamboo species have significant differences statistically. A linear regression model is also established to estimate the shear strength of bamboo from the physical properties. Characteristic shear strength is also determined using ISO 12122-1 (2014) for future design reference.

Shear strength and cracking behavior of Cr coatings on zirconium alloy fuel claddings at different strain rates

Cr coating on Zr-based fuel tubes is a potential approach for the development of accident tolerant fuels (ATF). To settle the cracking behavior and quantitative evaluation of shear strength of Cr coating under different loading conditions, the average shear strength between Cr coating and zircaloy substrate has been estimated using a modified shear-lag model in this paper. Its key parameters are determined experimentally, and the tensile method has been used to research the cracking behavior of Cr coating under different strain rates. The results show that with the increase of strain rate, the interfacial shear strength increases because of the decrease of cracking spacing, while the shear strength changes erratically with the coating thickness increases. Furthermore, abundant two unequal-crack-spacings and few two equal-crack-spacings are observed which are perpendicular to the loading direction.

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Numerical Simulation and Experimental Study on Compound Casting of Layered Aluminum Matrix Composite Brake Drum

The requirements of high-strength, wear-resistance and lightweight of brake drums have been continually increasing in recent years and any specific aluminum alloy or particle-reinforced aluminum matrix composites may not satisfy all the demands. Combining dissimilar materials to play their respective advantages is a solution to this problem. In this study, a compound casting method was used to combine solid SiCp/A357 composite and a liquid 7050 aluminum alloy to prepare an aluminum matrix composite with a layered structure. The ProCAST numerical simulation software was used to predict the heat transfer in compound casting process and guide the preheating temperature of the wear-resistant ring in the experiment. An Optical Microscope (OM) and Scanning Electron Microscope (SEM) were used to observe microstructures around the solid–liquid bonding interface, the element distribution and phase component of which were analyzed by Energy Dispersive Spectroscopy (EDS) and mechanical properties were evaluated by microhardness and shear tests. The results showed that the interface of the layered aluminum matrix composite prepared by this method achieved complete metallurgical bonding and a transition zone formed on the solid surface. After T6 heat treatment, the average shear strength of the interface increased from 19.8 MPa to 33.8 MPa.