optical phonon scattering
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Author(s):  
Iyyappa Rajan Panneerselvam ◽  
Man Hea Kim ◽  
Carlos Baldo III ◽  
Yan Wang ◽  
Mahalakshmi Sahasranaman

The tug-of-war between the thermoelectric power factor and the figure-of-merit complicates thermoelectric material selection, particularly for mid-to-high temperature thermoelectric materials. Approaches to reduce lattice thermal conductivity while maintaining a high-power...


2020 ◽  
Vol 33 (1) ◽  
pp. 015301
Author(s):  
Ramji Singh ◽  
Mitra Dutta ◽  
Michael A Stroscio

2020 ◽  
Vol 257 (9) ◽  
pp. 2070033
Author(s):  
Xinhe Yang ◽  
Peng Liu ◽  
Xinhe Wang ◽  
Jiangtao Wang ◽  
Lina Zhang ◽  
...  

2020 ◽  
Author(s):  
Tianqi Zhao ◽  
Quinn Gibson ◽  
Luke Daniels ◽  
Ben Slater ◽  
Furio Cora

Abstract BiOCuSe is a promising thermoelectric material, but its applications are hindered by low carrier mobility. We use first principles calculations to analyse electron-phonon scattering mechanisms and evaluate their contributions to the thermoelectric figure of merit ZT. The combined scattering of carriers by polar optical (PO) and longitudinal acoustic (LA) phonons yields an intrinsic hole mobility of 32 cm2 V-1 s-1 at room temperature and a temperature power law of T-1.5, which agree well with experiments. We demonstrate that electron phonon scattering in the Cu-Se layer dominates at low T, while contributions from the Bi-O layer become increasingly significant at higher T. At room temperature, ZT is calculated to be 0.48 and can be improved by 30% through weakening PO phonon scattering in the Cu-Se layer. This finding agrees with the experimental observation that weakening the carrier-phonon interaction by Te substitution in the Cu-Se layer improves mobility and ZT. At high T, the figure of merit is improved by weakening phonon scattering in the Bi-O layer instead. The theoretical ZT limit of BiOCuSe is calculated to be 2.5 at 875 K.


2020 ◽  
Vol 257 (9) ◽  
pp. 2000103
Author(s):  
Xinhe Yang ◽  
Peng Liu ◽  
Xinhe Wang ◽  
Jiangtao Wang ◽  
Lina Zhang ◽  
...  

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