Decentralized Intelligent Search of Tourist Routes Based on Check-In Data

The location social network generates a large amount of data; these dada reflect the user's preferences and the popularity of the route, and a new model is provided for travel route search. Based on this demand, a problem of local distributed travel route search is proposed for group users. In this problem, the personal preferences of group users are combined, and an access route is found with partial POI (point of interest) and the largest group profit. The check-in data are used to generate a POI transfer relationship diagram based on the user's transfer between POIs, and route search is performed on the relationship diagram. In order to improve the search efficiency, a two-layer transfer relationship diagram is designed according to the popularity and transfer relationship of POI, the POI is generalized, and a hierarchical query is realized. A branch and bound search strategy optimization algorithm is designed, and the control relationship between nodes is used for pruning; the search efficiency of the algorithm is further improved.

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

Review and comparison of layer transfer methods for two-dimensional materials for emerging applications

Two-dimensional (2D) materials offer immense potential for scientific breakthroughs and technological innovations.