Применение метода диэлектрической спектроскопии для исследования свойств сыворотки крови мышей со злокачественным асцитом

The article presents the results of a study by the method of dielectric spectroscopy of high-frequency relaxation processes in the blood serum of intact mice and mice vaccinated with an oncological disease - Ehrlich's ascites carcinoma. Using the formalism of the electrical module, the relaxation parameters were calculated for the serum samples of the two studied systems.

The use of the formalism of the complex electrical module in the monitoring of oncological diseases

The article discusses the use of the formalism of a complex electrical module to determine the relaxation parameters α, β, τ of blood serum. Approximating formulas for the real and imaginary components of the electrical modulus, obtained from the Havrilyak-Negami equation, are given. The assumption is made that for healthy organisms the parameters α, β, τ are constant (or change insignificantly), and for cancer patients they change, and the more the disease develops, the more these parameters change. It is also assumed that the activation energies Ea of macromolecules in the composition of blood serum are different for healthy and diseased organisms. Thus, the study of the dynamics of changes in the parameters α, β, τ, Ea can be used in the monitoring of oncological diseases.

Thermal Repair of Incomplete Back Contact Insulation (P1) in Cu(In,Ga)Se2 Photovoltaic Thin-Film Modules

We investigate the repair of interruptions in the back contact (P1) scribing line between two Mo back electrodes by thermally induced fractures. The fractures occur during Cu(In,Ga)Se2 (CIGS) absorber co-evaporation, as it is applied in CIGS thin-film module manufacturing and can effectively repair line interruptions of up to about 70 μm. Additionally, we present that a thermal treatment after P1 laser scribing and before CIGS co-evaporation can repair even interruptions of up to 1 mm. The fractures which are required for insulation are only of approximately 4 μm width which indicates the potential for further reduction of the interconnection width in CIGS modules and therefore improvement of the electrical module efficiency.