URGENCY OF WIRETAPPING IN GETTING EVIDENCE IN CRIMINAL MEASURES

Extraordinary crime requires a special step in its disclosure. Wiretapping is one of the efforts to gather evidence to uncover the crime. But in the RKUHP, wiretapping will also be applied to general criminal offenses. This places the law enforcers have access to personal interests in the name of the law. So vulnerable to human rights violations. Therefore it is important to conduct a study of the urgency of wiretapping in criminal acts. The research method used is normative juridical and the method used is the statutory and conceptual approach. The results of this study indicate that there is an urgency to conduct wiretapping arrangements on specific criminal acts and not on general crime This urgency arises based on the characteristics of the crime. The author's suggestion is that wiretapping of general criminal acts in the criminal procedure code should be abolished, and the state drafted a law on tapping that specifically regulates material and formal law.Keywords: criminal acts; urgency of wiretappingAbstrakKejahatan luar biasa membutuhkan langkah khusus dalam pengungkapannya. Penyadapan adalah salah satu upaya untuk mengumpulkan bukti untuk mengungkap kejahatan. Namun dalam RKUHP, penyadapan juga akan diterapkan pada pelanggaran pidana umum. Ini menempatkan penegak hukum memiliki akses ke kepentingan pribadi atas nama hukum. Sangat rentan terhadap pelanggaran HAM. Oleh karena itu penting untuk melakukan studi tentang urgensi penyadapan dalam tindak pidana. Metode penelitian yang digunakan adalah yuridis normatif dan metode yang digunakan adalah pendekatan hukum dan konseptual. Hasil penelitian ini menunjukkan bahwa ada urgensi untuk melakukan pengaturan penyadapan pada tindakan kriminal tertentu dan bukan pada kejahatan umum. Urgensi ini timbul berdasarkan pada karakteristik kejahatan. Saran penulis adalah bahwa penyadapan tindakan kriminal umum dalam kode prosedur pidana harus dihapuskan, dan negara membuat undang-undang tentang penyadapan yang secara spesifik mengatur materi dan hukum formal.Kata kunci: tindak pidana; urgensi penyadapan

Ultra-Thin, Fine-Pitch Step Stencils For Miniature Component Assembly

Mixed technology applications for Flip-Chip (FC) / SMT require special step stencil designs where flux is printed first for the FC and SMD paste printed next with a second stencil that has a relief pocket etched or formed in the FC area. Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, Step Stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. However as SMT requirements became more complex and consequently more demanding so did the requirements for complex Step Stencils. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 40um with steps of 13um are used to obtain desired print volume. These applications and the associated stencil design to achieve a solution will be discussed in detail in this paper. Various print experiments will be conducted and print quality will be determined by visual inspection and 3D measurement of the paste deposit to understand the volume transfer efficiency.