2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Virtual Prototyping and Simulation of Electro-Thermal Systems

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724572 ◽

2019 ◽

Author(s):

Torsten Hauck ◽

Vibhash Jha

Keyword(s):

Virtual Prototyping ◽

Thermal Systems

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Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724562 ◽

2019 ◽

Author(s):

Verena Hein ◽

Kirsten Weide-Zaage ◽

Xi Yang

Keyword(s):

Stress Distribution ◽

Layout Optimization

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Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724538 ◽

2019 ◽

Author(s):

Z. Staliulionis ◽

S. Mohanty ◽

J. H. Hattel

Keyword(s):

Humidity Response ◽

Temperature And Humidity

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Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724529 ◽

2019 ◽

Cited By ~ 2

Author(s):

Karsten Meier ◽

David Leslie ◽

Tamara Storz ◽

Abhijit Dasgupta ◽

Karlheinz Bock

Keyword(s):

Solder Joints ◽

Harmonic Vibration ◽

Lead Free ◽

Lead Free Solder ◽

Isothermal Conditions ◽

Free Solder

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Micro-Transfer-Printing and Potential Process Optimizations by FEA

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724539 ◽

2019 ◽

Author(s):

Kjell Buehler ◽

Georg Lorenz ◽

Marcel Mittag ◽

Uwe Krieger ◽

Niclas Heise ◽

...

Keyword(s):

Transfer Printing

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Finite element method simulation of graphene phononic crystals with cross-shaped nanopores

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724552 ◽

2019 ◽

Author(s):

Seiya Kubo ◽

Marek E. Schimidt ◽

Manoharan Muruganathan ◽

Hiroshi Mizuta

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Finite Element Method Simulation ◽

Phononic Crystals ◽

Element Method

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Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724515 ◽

2019 ◽

Cited By ~ 2

Author(s):

Laura Wambera ◽

Karsten Meier ◽

Robert Hohne ◽

Bjorn Bohme ◽

Christian Gotze ◽

...

Keyword(s):

Harsh Environment ◽

Reliability Testing ◽

Test Setup

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Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724582 ◽

2019 ◽

Author(s):

Raj Sekar Sethu ◽

Hansika Jayawardana ◽

Kok Heng Soon ◽

Almon Wei-Yen Chai

Keyword(s):

Response Surface Methodology ◽

Constitutive Equation ◽

Response Surface ◽

Fea Simulation

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Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724511 ◽

2019 ◽

Cited By ~ 1

Author(s):

Bart Vandevelde ◽

Riet Labie ◽

Ralph Lauwaert ◽

Daniel Werkhoven ◽

Daniel Vanderstraeten ◽

...

Keyword(s):

Thermal Cycling ◽

Melting Temperature ◽

Solder Paste

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Simulation of Self-Heating of Printed Interconnects for Thermal Design

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2019.8724548 ◽

2019 ◽

Author(s):

Daniel Bulz ◽

Petra Streit ◽

Roman Forke ◽

Thomas Otto

Keyword(s):

Thermal Design ◽

Self Heating

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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Virtual Prototyping and Simulation of Electro-Thermal Systems

Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution

Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures

Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions

Micro-Transfer-Printing and Potential Process Optimizations by FEA

Finite element method simulation of graphene phononic crystals with cross-shaped nanopores

Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions

Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Simulation of Self-Heating of Printed Interconnects for Thermal Design

Export Citation Format

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Virtual Prototyping and Simulation of Electro-Thermal Systems

Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution

Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures

Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions

Micro-Transfer-Printing and Potential Process Optimizations by FEA

Finite element method simulation of graphene phononic crystals with cross-shaped nanopores

Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions

Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Simulation of Self-Heating of Printed Interconnects for Thermal Design

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications