2008 International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications

TOTAL DOCUMENTS

232

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424427390

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH)

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606943 ◽

2008 ◽

Cited By ~ 3

Author(s):

Benedikt J. Knauf ◽

D. Patrick Webb ◽

Changqing Liu ◽

Paul P. Conway

Keyword(s):

Induction Heating ◽

Low Frequency ◽

Microfluidic Systems

Download Full-text

Development of three-dimensional multichip module based on embedded substrate with multiple interconnections

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606955 ◽

2008 ◽

Author(s):

Gaowei Xu ◽

Yanhong Wu ◽

Fei Geng ◽

Qiuping Huang ◽

Jian Zhou ◽

...

Keyword(s):

Three Dimensional ◽

Multichip Module

Download Full-text

Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607057 ◽

2008 ◽

Cited By ~ 1

Author(s):

Lili Zhang ◽

Wenkai Tao ◽

Johan Liu ◽

Yan Zhang ◽

Zhaonian Cheng ◽

...

Keyword(s):

Nano Particles ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

Download Full-text

Hardware /software co-design for Viterbi decoder

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607010 ◽

2008 ◽

Author(s):

Ming Li ◽

Tao Wen

Keyword(s):

Viterbi Decoder

Download Full-text

Application of BP neural network in FBG sensing system performance improvement

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607031 ◽

2008 ◽

Cited By ~ 1

Author(s):

Zhang Jian ◽

Zhao Hong ◽

Rong Xian-wei

Keyword(s):

Neural Network ◽

Performance Improvement ◽

Bp Neural Network ◽

System Performance ◽

Sensing System

Download Full-text

Analysis of the reliability of package-on-package devices manufactured using various underfill methods

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606944 ◽

2008 ◽

Cited By ~ 4

Author(s):

Vicky Wang ◽

Dan Maslyk

Download Full-text

Study on no-fillet SMT solder joint reliability based on solder joint shape CAD

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607023 ◽

2008 ◽

Cited By ~ 1

Author(s):

Wu ZhaoHua ◽

Zhou DeJian ◽

Huang ChunYue

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Joint Shape

Download Full-text

Design advisor for package-on-package (PoP) manufacturing

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606950 ◽

2008 ◽

Cited By ~ 1

Author(s):

Bin Xie ◽

Peng Sun ◽

Daniel Shi

Download Full-text

Optimization of the fatigue life of Epoxy Molding Compounds based on BP neural network prediction model

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607114 ◽

2008 ◽

Cited By ~ 1

Author(s):

Miao Cai ◽

Dao-guo Yang ◽

Quan-yong Li ◽

Li-jun Zhong

Keyword(s):

Neural Network ◽

Fatigue Life ◽

Prediction Model ◽

Bp Neural Network ◽

Molding Compounds ◽

Neural Network Prediction ◽

Network Prediction

Download Full-text

Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607091 ◽

2008 ◽

Author(s):

Ziyang Xiu ◽

Guoqin Chen ◽

Zongquan Deng ◽

Gaohui Wu

Keyword(s):

Electronic Packaging ◽

Microstructure And Properties ◽

Environmental Friendly

Download Full-text

2008 International Conference on Electronic Packaging Technology & High Density PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH)

Development of three-dimensional multichip module based on embedded substrate with multiple interconnections

Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles

Hardware /software co-design for Viterbi decoder

Application of BP neural network in FBG sensing system performance improvement

Analysis of the reliability of package-on-package devices manufactured using various underfill methods

Study on no-fillet SMT solder joint reliability based on solder joint shape CAD

Design advisor for package-on-package (PoP) manufacturing

Optimization of the fatigue life of Epoxy Molding Compounds based on BP neural network prediction model

Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

2008 International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications