2012 2nd IEEE CPMT Symposium Japan
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9781467326551, 9781467326544, 9781467326537
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Integrated package for 100G ethernet optical transmitter

2012 ◽  
Author(s):  
Nobuyuki Yasui ◽  
Koji Shibuya ◽  
Tadashi Murao ◽  
Takeshi Yamatoya ◽  
Keita Mochizuki ◽  
...  
Keyword(s):  
Optical Transmitter

Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression

2012 ◽  
Author(s):  
Masahisa Fujino ◽  
Hidenori Terasaka ◽  
Tadatomo Suga ◽  
Ikuo Soga ◽  
Daiyu Kondo ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Electrical Properties ◽  
Vertically Aligned

Novel technology for power integrity using a metal particle conductive layer

2012 ◽  
Author(s):  
Noifumi Sasaoka ◽  
Takafumi Ochi ◽  
Masato Oono ◽  
Chihiro Ueda ◽  
Yutaka Akiyama ◽  
...  
Keyword(s):  
Metal Particle ◽  
Conductive Layer ◽  
Power Integrity ◽  
Novel Technology

Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine

2012 ◽  
Author(s):  
Koji Motomura ◽  
Hiroki Maruo ◽  
Wanyu Tie ◽  
Hideki Eifuku ◽  
Shoji Sakemi ◽  
...  
Keyword(s):  
Flip Chip ◽  
Productivity Improvement

Large scale System-in-Package (SiP) module for future networking products

2012 ◽  
Author(s):  
Ryusuke Ohta ◽  
Mohan Nagar ◽  
Mudasir Ahmad ◽  
Michiaki Tamagawa ◽  
Katsumi Miyata ◽  
...  
Keyword(s):  
Large Scale ◽  
Large Scale System

Warpage modeling for 3D packages

2012 ◽  
Author(s):  
Masazumi Amagai ◽  
Yutaka Suzuki

Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate

2012 ◽  
Author(s):  
Yasumitsu Orii ◽  
Kazushige Toriyama ◽  
Sayuri Kohara ◽  
Hirokazu Noma ◽  
Keishi Okamoto ◽  
...  
Keyword(s):  
Organic Substrate ◽  
Cu Pillar ◽  
Cu Pillar Bump
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