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2012 2nd IEEE CPMT Symposium Japan
Latest Publications
TOTAL DOCUMENTS
101
(FIVE YEARS 0)
H-INDEX
5
(FIVE YEARS 0)
Published By IEEE
9781467326551, 9781467326544, 9781467326537
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Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Integrated package for 100G ethernet optical transmitter
2012 2nd IEEE CPMT Symposium Japan
◽
10.1109/icsj.2012.6523382
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2012
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Cited By ~ 1
Author(s):
Nobuyuki Yasui
◽
Koji Shibuya
◽
Tadashi Murao
◽
Takeshi Yamatoya
◽
Keita Mochizuki
◽
...
Keyword(s):
Optical Transmitter
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Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523404
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2012
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Cited By ~ 1
Author(s):
Masahisa Fujino
◽
Hidenori Terasaka
◽
Tadatomo Suga
◽
Ikuo Soga
◽
Daiyu Kondo
◽
...
Keyword(s):
Carbon Nanotube
◽
Electrical Properties
◽
Vertically Aligned
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Novel technology for power integrity using a metal particle conductive layer
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523445
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2012
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Author(s):
Noifumi Sasaoka
◽
Takafumi Ochi
◽
Masato Oono
◽
Chihiro Ueda
◽
Yutaka Akiyama
◽
...
Keyword(s):
Metal Particle
◽
Conductive Layer
◽
Power Integrity
◽
Novel Technology
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Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523392
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2012
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Cited By ~ 1
Author(s):
Koji Motomura
◽
Hiroki Maruo
◽
Wanyu Tie
◽
Hideki Eifuku
◽
Shoji Sakemi
◽
...
Keyword(s):
Flip Chip
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Productivity Improvement
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Large scale System-in-Package (SiP) module for future networking products
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523401
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2012
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Cited By ~ 1
Author(s):
Ryusuke Ohta
◽
Mohan Nagar
◽
Mudasir Ahmad
◽
Michiaki Tamagawa
◽
Katsumi Miyata
◽
...
Keyword(s):
Large Scale
◽
Large Scale System
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Warpage modeling for 3D packages
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523423
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2012
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Author(s):
Masazumi Amagai
◽
Yutaka Suzuki
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Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
2012 2nd IEEE CPMT Symposium Japan
◽
10.1109/icsj.2012.6523394
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2012
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Cited By ~ 2
Author(s):
Yasumitsu Orii
◽
Kazushige Toriyama
◽
Sayuri Kohara
◽
Hirokazu Noma
◽
Keishi Okamoto
◽
...
Keyword(s):
Organic Substrate
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Cu Pillar
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Cu Pillar Bump
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Wireless body area communication using electromagnetic resonance coupling
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523439
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2012
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Cited By ~ 8
Author(s):
Fukuro Koshiji
◽
Nanako Yuyama
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Kohji Koshiji
Keyword(s):
Body Area
◽
Electromagnetic Resonance
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Resonance Coupling
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3D integration techniques using stacked PCBs and small dipole antenna for wireless sensor nodes
2012 2nd IEEE CPMT Symposium Japan
◽
10.1109/icsj.2012.6523438
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2012
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Cited By ~ 3
Author(s):
Shoichi Oshima
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Kenichi Matsunaga
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Hiroki Morimura
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Mitsuru Harada
Keyword(s):
Dipole Antenna
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Sensor Nodes
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Wireless Sensor
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3D Integration
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Wireless Sensor Nodes
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Small Dipole
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Integration Techniques
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A signal and power integrity oriented packaging for low cost and high performance systems
2012 2nd IEEE CPMT Symposium Japan
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10.1109/icsj.2012.6523446
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2012
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Cited By ~ 3
Author(s):
Daisuke Iguchi
◽
Hideyuki Umekawa
Keyword(s):
High Performance
◽
Low Cost
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Power Integrity
◽
High Performance Systems
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