Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)
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High frequency modeling of interconnects in deep-submicron technologies

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787082 ◽

2003 ◽

Cited By ~ 2

Author(s):

C. Cregut ◽

G. Le Carval ◽

J. Chilo

Keyword(s):

High Frequency ◽

Deep Submicron

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Managing the interconnect continuum...from silicon to package and board

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787061 ◽

2003 ◽

Author(s):

B. Siu

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Carbon-doped copper as a high-conductivity liner for copper/benzocyclobutene (BCB) interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787111 ◽

2003 ◽

Cited By ~ 1

Author(s):

J.M. Neirynck ◽

Y. Xiao ◽

R.J. Gutmann ◽

S.P. Murarka

Keyword(s):

High Conductivity ◽

Carbon Doped

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Comparative study of PE-BPSG and HDP-PSG as PMD for 0.25 μm memory device

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787070 ◽

2003 ◽

Author(s):

Jengyi Yu ◽

P. Gopalan ◽

J. Feng

Keyword(s):

Comparative Study ◽

Memory Device

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Overcoming sheet resistance effects to enable electroplating of copper onto seedless barrier films

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787144 ◽

2003 ◽

Author(s):

K.M. Takahashi

Keyword(s):

Sheet Resistance ◽

Barrier Films

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Impact of interconnect architecture on chip size and die yield

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787066 ◽

2003 ◽

Cited By ~ 1

Author(s):

R. Liu ◽

C.-S. Pai ◽

H.-I. Cong ◽

W. Lai ◽

E. Martinez

Keyword(s):

Chip Size ◽

On Chip

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The projected power consumption of a wireless clock distribution system and comparison to conventional distribution systems

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787135 ◽

2003 ◽

Cited By ~ 12

Author(s):

B.A. Floyd ◽

K.K. O

Keyword(s):

Power Consumption ◽

Distribution System ◽

Distribution Systems ◽

Clock Distribution ◽

Wireless Clock

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A mechanism of stress-induced metal void in narrow aluminum-based metallization with the HDP CVD oxide dielectric

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787105 ◽

2003 ◽

Author(s):

Soo Geun Lee ◽

Heok-Sang Oh ◽

Sun-Rae Kim ◽

Seung-Heon Song ◽

Sun Hu Park ◽

...

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Scaling effect on electromigration in on-chip Cu wiring

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787140 ◽

2003 ◽

Cited By ~ 30

Author(s):

C.-K. Hu ◽

R. Rosenberg ◽

H.S. Rathore ◽

D.B. Nguyen ◽

B. Agarwala

Keyword(s):

Scaling Effect ◽

On Chip

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High frequency simulation and characterization of advanced copper interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787127 ◽

2003 ◽

Cited By ~ 2

Author(s):

C. Cregut ◽

G. Le Carval ◽

J. Chilo

Keyword(s):

High Frequency ◽

Copper Interconnects

Download Full-text

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

High frequency modeling of interconnects in deep-submicron technologies

Managing the interconnect continuum...from silicon to package and board

Carbon-doped copper as a high-conductivity liner for copper/benzocyclobutene (BCB) interconnects

Comparative study of PE-BPSG and HDP-PSG as PMD for 0.25 μm memory device

Overcoming sheet resistance effects to enable electroplating of copper onto seedless barrier films

Impact of interconnect architecture on chip size and die yield

The projected power consumption of a wireless clock distribution system and comparison to conventional distribution systems

A mechanism of stress-induced metal void in narrow aluminum-based metallization with the HDP CVD oxide dielectric

Scaling effect on electromigration in on-chip Cu wiring

High frequency simulation and characterization of advanced copper interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)
Latest Publications