2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference

Thermal reliability analysis of through-aluminium-nitride-via substrate for high-power LED applications

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761912 ◽

2016 ◽

Cited By ~ 2

Author(s):

C. H. Lin ◽

K. F. Chuang ◽

Y. H. Chang ◽

M. Y. Tsai ◽

C. T. Wu ◽

...

Keyword(s):

Reliability Analysis ◽

High Power ◽

Aluminium Nitride ◽

Thermal Reliability ◽

High Power Led

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Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761937 ◽

2016 ◽

Author(s):

Hayato Sakamoto ◽

Takeru Kato ◽

Ken Suzuki ◽

Hideo Miura

Keyword(s):

Thin Film ◽

Grain Boundary ◽

The Self ◽

Self Diffusion

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Contact resistance of the micro bumps in a typical TSV structure

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761906 ◽

2016 ◽

Author(s):

Ben-Je Lwo ◽

Chia-Liang Teng ◽

Tom Ni ◽

Shirley Lu

Keyword(s):

Contact Resistance

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The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761951 ◽

2016 ◽

Author(s):

Siong Chin Teck ◽

Eu Poh Leng ◽

Tan Lan Chu ◽

Zhang Xi ◽

Loh Wan Yee ◽

...

Keyword(s):

Wire Bonding ◽

Process Characterization

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Thermal substrates for efficient heat dissipation in LED packaging application

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761958 ◽

2016 ◽

Cited By ~ 1

Author(s):

J. W. Mah ◽

S. Shanmugan ◽

Z. Y. Ong ◽

D. Mutharasu ◽

A. Nor Azmi

Keyword(s):

Heat Dissipation

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Cost savings through innovative and LEAN engineering approach for wireless modules

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761988 ◽

2016 ◽

Author(s):

Foo Chong Seng ◽

Tan Jui Ang

Keyword(s):

Cost Savings ◽

Engineering Approach ◽

Lean Engineering

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Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761946 ◽

2016 ◽

Author(s):

Nadhrah Murad ◽

SitiRabiatull Aisha ◽

Mahadzir Ishak Muhammad

Keyword(s):

Mechanical Properties ◽

Solder Alloy ◽

Microstructures And Mechanical Properties

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Redefining IC packages with super-thin Substrates

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761933 ◽

2016 ◽

Author(s):

C. C. Anthony Lee ◽

P. C. Wilson Ang ◽

B. L. Ang ◽

W. J. Tan ◽

K. H. Horng

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EMI shielding performance by metal plating on mold compound

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761978 ◽

2016 ◽

Cited By ~ 1

Author(s):

Min Fee Tai ◽

Swee Leong Kok ◽

Kenichiroh Mukai

Keyword(s):

Emi Shielding ◽

Metal Plating

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QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference ◽

10.1109/iemt.2016.7761936 ◽

2016 ◽

Author(s):

Jacky Lee Sinn Fah ◽

Sreetharan Sekaran ◽

Rameish Rao Subarmaniyan ◽

Camella Chee Guey Yong

Keyword(s):

Failure Mechanism ◽

Lead Frame

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2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal reliability analysis of through-aluminium-nitride-via substrate for high-power LED applications

Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

Contact resistance of the micro bumps in a typical TSV structure

The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications

Thermal substrates for efficient heat dissipation in LED packaging application

Cost savings through innovative and LEAN engineering approach for wireless modules

Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy

Redefining IC packages with super-thin Substrates

EMI shielding performance by metal plating on mold compound

QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame

Export Citation Format

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal reliability analysis of through-aluminium-nitride-via substrate for high-power LED applications

Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

Contact resistance of the micro bumps in a typical TSV structure

The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications

Thermal substrates for efficient heat dissipation in LED packaging application

Cost savings through innovative and LEAN engineering approach for wireless modules

Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy

Redefining IC packages with super-thin Substrates

EMI shielding performance by metal plating on mold compound

QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference
Latest Publications