Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design
Latest Publications

TOTAL DOCUMENTS

10

(FIVE YEARS 0)

H-INDEX

3

(FIVE YEARS 0)

Published By Springer US

9781441907837, 9781441907844

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

System-Level 3D IC Cost Analysis and Design Exploration

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_10 ◽

2009 ◽

pp. 261-280 ◽

Author(s):

Xiangyu Dong ◽

Yuan Xie

Keyword(s):

Cost Analysis ◽

System Level ◽

Design Exploration ◽

3D Ic ◽

Analysis And Design

Download Full-text

Thermal-Aware 3D Placement

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_5 ◽

2009 ◽

pp. 103-144 ◽

Author(s):

Jason Cong ◽

Guojie Luo

Download Full-text

Introduction

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_1 ◽

2009 ◽

pp. 1-13

Author(s):

Kerry Bernstein

Download Full-text

PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_9 ◽

2009 ◽

pp. 219-260 ◽

Author(s):

Taeho Kgil ◽

David Roberts ◽

Trevor Mudge

Keyword(s):

Energy Efficient ◽

Download Full-text

Three-Dimensional Network-on-Chip Architecture

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_8 ◽

2009 ◽

pp. 189-217 ◽

Author(s):

Yuan Xie ◽

Narayanan Vijaykrishnan ◽

Chita Das

Keyword(s):

Three Dimensional ◽

Network On Chip ◽

Dimensional Network ◽

Download Full-text

Thermal Via Insertion and Thermally Aware Routing in 3D ICs

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_6 ◽

2009 ◽

pp. 145-160 ◽

Author(s):

Sachin S. Sapatnekar

Keyword(s):

Download Full-text

Thermal-Aware 3D Floorplan

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_4 ◽

2009 ◽

pp. 63-102 ◽

Author(s):

Jason Cong ◽

Yuchun Ma

Download Full-text

Three-Dimensional Microprocessor Design

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_7 ◽

2009 ◽

pp. 161-188

Author(s):

Gabriel H. Loh

Keyword(s):

Three Dimensional ◽

Microprocessor Design

Download Full-text

Thermal and Power Delivery Challenges in 3D ICs

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_3 ◽

2009 ◽

pp. 33-61 ◽

Author(s):

Pulkit Jain ◽

Pingqiang Zhou ◽

Chris H. Kim ◽

Sachin S. Sapatnekar

Keyword(s):

Power Delivery ◽

Download Full-text

3D Process Technology Considerations

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_2 ◽

2009 ◽

pp. 15-32 ◽

Author(s):

Albert M. Young ◽

Steven J. Koester

Keyword(s):

Process Technology

Download Full-text