Influences of processing parameters on metal-bonded diamond wheel wear when grinding a sapphire wafer

2021 ◽  
Vol 113 ◽  
pp. 108275
Author(s):  
Bin Luo ◽  
Qiusheng Yan ◽  
Jisheng Pan ◽  
Jiabin Lu ◽  
Zhanliang Huang
Keyword(s):  
Processing Parameters ◽  
Diamond Wheel ◽  
Wheel Wear ◽  
Sapphire Wafer

Wear of Diamond Grinding Wheel during Low Speed Dressing by Alumina

2015 ◽  
Vol 658 ◽  
pp. 120-124
Author(s):  
Tachai Luangvaranunt ◽  
Natthawat Tangkaratanakul ◽  
Patchanok Sakultantimetha
Keyword(s):  
High Hardness ◽  
Large Mass ◽  
Diamond Wheel ◽  
Grinding Wheel ◽  
Work Piece ◽  
Wheel Wear ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Dressing Tool ◽  
Pin On Disk

Diamond grinding wheel is used in high precision grinding process, when work piece has a very high hardness. For a specific grinding interval, the wheel must be properly dressed, in order to remove swarf, sharpen the worn diamond grits, open up new diamond protrusions, and recondition the bond material. Dressing of diamond grinding wheel by alumina dressing tool has been simulated in a pin-on-disk machine in the research. Sharpening of the wheel is indicated by the increase of its roughness value, and surface microstructure with protruding sharp diamond grits. It was found that increasing of sliding distant from 100 to 500 m will increase the roughness of the wheel. The increase of contact load from 10 to 20 N will also increase roughness of the wheel, and the severity of wheel wear, indicated by high values of friction coefficient. A proper dressing of this nickel bonded SD1200 diamond wheel is by sliding against alumina dressing tool for at least 300 m under 10 N load. Sliding velocity has minimal effect to the results. A too large sliding distant and load will cause severe damage to wheel surface, and severe wheel wear, indicated by its large mass loss.

Grinding Performance of a Grain-Arranged Diamond Wheel against Industrial Pure Aluminum

2007 ◽  
Vol 329 ◽  
pp. 33-38 ◽  
Author(s):  
Shigeki Okuyama ◽  
Takayuki Kitajima ◽  
Akinori Yui
Keyword(s):  
Pure Aluminum ◽  
Diamond Wheel ◽  
General Purpose ◽  
Surface Grinding ◽  
Mirror Surface ◽  
Fluid Type ◽  
Wheel Wear ◽  
Grinding Performance ◽  
Grinding Fluid ◽  
Table Speed

A grain-arranged diamond wheel is developed and grinding performance of the wheel against industrial pure aluminum, one of the most hard-to-grinding materials, is investigated. The developed wheel efficiently ground pure aluminum without adhesion even when general-purpose grinding fluid, Type A3-1, was used. Moreover, wheel wear was not observed during the experiment, and grinding energy was extremely low. By using the developed wheel, a mirror surface can be easily obtained by one-pass surface grinding with very low table speed.

scholarly journals The Effect of Diamond Wheel Wear on Surface and Sub-Surface Quality in Fused Silica Optics Grinding

2019 ◽  
Vol 677 ◽  
pp. 022091
Author(s):  
Lian Zhou ◽  
Qiancai Wei ◽  
Jie Li ◽  
Xianhua Chen ◽  
Jian Wang ◽  
...  
Keyword(s):  
Surface Quality ◽  
Diamond Wheel ◽  
Fused Silica ◽  
Wheel Wear

scholarly journals Analysis of diamond wheel wear and surface integrity in laser-assisted grinding of RB-SiC ceramics

2019 ◽  
Vol 45 (18) ◽  
pp. 24355-24364 ◽  
Author(s):  
Xiaoshuang Rao ◽  
Feihu Zhang ◽  
Yanjun Lu ◽  
Xichun Luo ◽  
Fei Ding ◽  
...  
Keyword(s):  
Surface Integrity ◽  
Diamond Wheel ◽  
Wheel Wear ◽  
Sic Ceramics

Dynamic Monitoring and Intelligent Dressing of Diamond Wheel for Precision Curve Grinding

2006 ◽  
Vol 532-533 ◽  
pp. 77-80
Author(s):  
Da Ping Wan ◽  
De Jin Hu ◽  
Hai Feng Wang ◽  
Yong Hong Zhang
Keyword(s):  
Integrated Control ◽  
Measuring Method ◽  
Diamond Wheel ◽  
Dynamic Monitoring ◽  
Grinding Wheel ◽  
Analysis Method ◽  
Wheel Wear ◽  
Vision Measurement ◽  
Integrated Control System ◽  
Wear Condition

This paper deals with an application for achieving precision curve grinding by automatic dressing and compensation of diamond wheel wear through non-contact measuring method. A realtime vision measurement combined with vibration analysis method for the wear of a grinding wheel is presented. The wear condition is evaluated by analyzing the topography changes of the wheel surface and the vibration signals in the grinding process. A kind of PC-based integrated control system with dynamic monitoring and automatic dressing function is investigated, and the control algorithm is also proposed. The benefits of the proposed methods are confirmed by the grinding experiments. Dynamic monitoring of the wheel facilitates determining the optimum dressing amount and interval. A much higher abrasive machining precision and efficiency are attained by the real-time error measurement and compensation arrangement.

Wear of Diamond Wheel in Groove Grinding of Cemented Carbide - Influences of Speed Ratio and Nitrogen Gas Dissolved Coolant

2014 ◽  
Vol 1017 ◽  
pp. 261-266
Author(s):  
Osamu Horiuchi ◽  
Takashi Samura ◽  
Takeshi Uno ◽  
Takeshi Itazu ◽  
Norihito Ito ◽  
...  
Keyword(s):  
Diamond Wheel ◽  
Experimental Results ◽  
Cemented Carbide ◽  
Speed Ratio ◽  
Grinding Forces ◽  
Wheel Wear ◽  
Nitrogen Gas ◽  
Considerable Decrease ◽  
Water Based ◽  
Grinding Conditions

This paper describes on the experimental results of diamond wheel wear in groove grinding of cemented carbide. The speed ratio of grinding was widely changed. Square grooves and 90 degree V-grooves were ground. The square grooves were ground by using a resin-bonded diamond wheel and the V-grooves were by a vitrified diamond wheel. At first, a water-based coolant was used, but afterward, to investigate a possibility of nitrogen to suppress the wear of wheel, nitrogen gas was dissolved into the water-based coolant. The main results obtained are as follows, (1) The wheel wear increases as the speed ratio decreases, (2) The average grinding forces is almost independent from the grinding conditions but those at the lowest speed ratio are fairly large, (3) The influence of nitrogen gas dissolved coolant is small, but in a case of V-shape grinding at a middle speed ratio there found a considerable decrease of wheel wear.

High Efficiency Precision Surface Grinding of Fused Silica

2011 ◽  
Vol 418-420 ◽  
pp. 1132-1136 ◽  
Author(s):  
Peng Yao ◽  
Ya Dong Gong ◽  
Suo Xian Yuan ◽  
Nobuhito Yoshihara ◽  
Ji Wang Yan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Integrity ◽  
High Efficiency ◽  
High Surface ◽  
Chip Thickness ◽  
Diamond Wheel ◽  
Fused Silica ◽  
Wheel Wear ◽  
Undeformed Chip Thickness ◽  
Creep Feed

High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

Finite Element Analysis on Residual Stress of Laser Brazing Diamond Wheel

2013 ◽  
Vol 712-715 ◽  
pp. 739-742 ◽  
Author(s):  
Zhi Bo Yang ◽  
Pei Fei Luo
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Element Model ◽  
Processing Parameters ◽  
Diamond Wheel ◽  
Laser Brazing ◽  
Element Analysis ◽  
The Matrix ◽  
Simulation And Experiment ◽  
Field Element

The purpose of this paper is to simulate the residual field of laser brazing by FEM of ANSYS. The 2-D coupled field element is elected to create finite element model. The brazing experiments have been done by means of 45steel which is the matrix and Ni-Cr solder and the residual stress of the diamond wheel has been measured by Raman method. The results of measure show that the maximum stress value is less strength of diamond. The residual stress distribution is basically identical between the results of simulation and experiment. According to this paper, it is possible to decrease the costs of study by selecting reasonable processing parameters on laser brazing.

Research of Sapphire Wafer Scribing by Using UV Laser

2011 ◽  
Vol 338 ◽  
pp. 90-93
Author(s):  
Mao Lu Wang ◽  
Lei Qin ◽  
Yang Wang ◽  
Ming Zhou
Keyword(s):  
Surface Quality ◽  
Processing Parameters ◽  
Uv Laser ◽  
Sapphire Wafer ◽  
Laser Parameters ◽  
Machining Quality ◽  
Good Surface ◽  
Good Surface Quality ◽  
Series Of Experiments ◽  
Wafer Processing

The Processing advantages of UV laser were discussed in this paper. A series of experiments were carried out, some good results was achieved, which proved UV laser is fit for sapphire wafer processing. Then how processing parameters affects machining quality was discussed, which provides guidance to machining practice. The formation of grooves with good surface quality can be achieved by selecting appropriate laser parameters.

A Study on Electrolytic In-Process Dressing (ELID) Grinding of Sapphire With Acoustic Emission

2009 ◽  
Author(s):  
Peidong Han ◽  
Ioan D. Marinescu ◽  
Anil Srivastava
Keyword(s):  
Acoustic Emission ◽  
Surface Finish ◽  
High Efficiency ◽  
High Hardness ◽  
Processing Parameters ◽  
Great Promise ◽  
Grinding Wheel ◽  
Wheel Wear ◽  
Elid Grinding ◽  
Wheel Loading

Single crystal sapphire is of significant interest due to its combination of excellent optical, electrical, and mechanical properties. However, fine grinding of sapphire is quite challenging because of its high hardness and low fracture toughness, making it sensitive to cracking. Wheel loading is a common problem in conventional grinding of hard and brittle materials. ELID grinding shows great promise in achieving a mirror surface finish at a relatively high efficiency. ELID grinding of sapphire was investigated using acoustic emission. The effects of processing parameters on surface finish and acoustic emission signals were evaluated. Correlations were found among the dressing current intensity, surface finish and acoustic emission signals. A smoother surface was obtained using a higher dressing current at the cost of a higher wheel wear rate. The wheel wear mechanism in ELID grinding of sapphire was dominated by bond fracture because the bond strength is reduced by electrolysis. Results indicate that the acoustic emission technique has the potential to be used for monitoring ELID grinding process, detecting the condition of the grinding wheel, and investigating the mechanisms of ELID grinding.

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