Effect of molecular structure of alcohols on wet anisotropic etching of silicon

2016 ◽  
Vol 242 ◽  
pp. 18-26 ◽  
Author(s):  
Krzysztof P. Rola ◽  
Irena Zubel
Keyword(s):  
Molecular Structure ◽  
Anisotropic Etching ◽  
Wet Anisotropic Etching

FABRICATION OF PYRAMIDAL CAVITY STRUCTURE WITH MICRON-SIZED TIP USING ANISOTROPIC KOH ETCHING OF SILICON (100)

2015 ◽  
Vol 74 (10) ◽  
Author(s):  
Ummikalsom Abidin ◽  
Burhanuddin Yeop Majlis ◽  
Jumril Yunas
Keyword(s):  
Model Comparison ◽  
3D Structure ◽  
Three Dimensional ◽  
Size Variation ◽  
Anisotropic Etching ◽  
Etching Solution ◽  
Cavity Structure ◽  
Wet Anisotropic Etching ◽  
Etching Selectivity ◽  
Koh Etching

Microelectromechanical System (MEMS) are systems of micron-sized structures and typically integrated with microelectronic components. Bulk micromachining using wet anisotropic etching is able to etch silicon substrates to a desired three-dimensional (3D) structure, depending on the silicon crystallographic orientation. To date, MEMS components i.e. thermal, pressure, mechanical, bio/chemical sensors have been fabricated with wet anisotropic etching of silicon. This paper presents the fabrication of a 3D pyramidal cavity structure with micron-sized tip of silicon (100) using anisotropic KOH etching of w/w 45 % at 80 oC temperature. Volume percent of 10 % IPA as a less polar diluent is added to the KOH etching solution in saturating the solution and controlling the etching selectivity and rate. Smooth etched silicon surface of hillock free is able to be achieved with IPA addition to the KOH etching solution. A characteristic V-shaped cavity with side angle of 54.8 degrees has successfully been formed and is almost identical to the theoretical structure model. Comparison of two different silicon nitride window masks on the micron-size tip formation is also investigated. Under etch, over etch and etching selectivity, as common problems effecting the micron-tip size variation, are also addressed in this work. In conclusion, anisotropic KOH etching as a simple, fast and inexpensive bulk micromachining technique, in fabricating 3D MEMS structure using silicon (100), is validated in this work.

The Improvement of Wet Anisotropic Etching with Megasonic Wave

2005 ◽  
pp. 557-561
Author(s):  
Woo Seong Che ◽  
Chang Gil Suk ◽  
Tae Gyu Park ◽  
Jun Tae Kim ◽  
Jun Hyub Park
Keyword(s):  
Anisotropic Etching ◽  
Wet Anisotropic Etching

THIN SILICON STRUCTURES FABRICATION BY WET ANISOTROPIC ETCHING

2003 ◽  
Vol 04 (02) ◽  
pp. 311-314
Author(s):  
AJAY AGARWAL ◽  
X. L. ZHANG ◽  
T. GAN ◽  
J. SINGH
Keyword(s):  
Anisotropic Etching ◽  
Silicon Structures ◽  
Wet Anisotropic Etching ◽  
Thin Silicon

scholarly journals Fabrication of polygonal nanoholes by localized mask-free wet anisotropic etching

AIP Advances ◽  
2017 ◽  
Vol 7 (10) ◽  
pp. 105115 ◽  
Author(s):  
Qi Chen ◽  
Yifan Wang ◽  
Hualv Zhang ◽  
Tao Deng ◽  
Zewen Liu
Keyword(s):  
Anisotropic Etching ◽  
Wet Anisotropic Etching

Fabrication of 45° mirrors together with well-defined v-grooves using wet anisotropic etching of silicon

1995 ◽  
Vol 4 (4) ◽  
pp. 213-219 ◽  
Author(s):  
C. Strandman ◽  
L. Rosengren ◽  
H.G.A. Elderstig ◽  
Y. Backlund
Keyword(s):  
Anisotropic Etching ◽  
Wet Anisotropic Etching

scholarly journals Wet anisotropic etching for fluidic 1D nanochannels

2003 ◽  
Vol 13 (4) ◽  
pp. S62-S66 ◽  
Author(s):  
Jeroen Haneveld ◽  
Henri Jansen ◽  
Erwin Berenschot ◽  
Niels Tas ◽  
Miko Elwenspoek
Keyword(s):  
Anisotropic Etching ◽  
Wet Anisotropic Etching
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