Aerosol jet printing of PEDOT:PSS for large area flexible electronics

2020 ◽  
Vol 5 (1) ◽  
pp. 014005 ◽  
Author(s):  
Giuseppe Tarabella ◽  
Davide Vurro ◽  
Stefano Lai ◽  
Pasquale D’Angelo ◽  
Luca Ascari ◽  
...  
Author(s):  
Pradeep Lall ◽  
Jinesh Narangaparambil ◽  
Ved Soni ◽  
Scott Miller

Abstract Flexible electronics is a rapid emerging trend in consumer-electronics with ever-increasing applications showing feasibility of functionality with flexibility. Aerosol Jet printing technology has gained rapid acceptance for additive printing owing to non-contact deposition and ability to print on non-planar surfaces. Prior work on aerosol-jet print processes primarily focuses on single-layer printing, taking into account different parameters such as mass flow, line width, sintering conditions, and overspray. Flexible PCBs in complex applications are envisioned to be multi-layered, involving stacking of interconnections and connection between successive layers through use of z-axis connections. Aerosol-jet printing method allows the printing of interconnections with a number of inks including silver, copper, and carbon with fine lines and spaces in neighborhood of 10μm. Process recipes for manufacturing multilayer circuits and system scale-up methods are required. The objective of the paper is to establish process-recipes for z-axis interconnects and quantify process variability with Aerosol-jet print process needed for high volume scale-up. Conductive interconnects have been printed using the ultrasonic atomizer and the interlayer dielectrics have been printed using the pneumatic atomizer. The effect of thermal sintering on the performance of the printed circuits has been quantified through measurements of interconnect resistance and shear load to failure. This paper explores the printing of multi-layer upto 8 conductive layers. Sintering profile for lower resistance per unit length and higher shear load to failure was tested.


Author(s):  
Roozbeh Ross Salary ◽  
Jack P. Lombardi ◽  
Darshana L. Weerawarne ◽  
Prahalad K. Rao ◽  
Mark D. Poliks

Abstract The goal of this work is to forward a comprehensive framework, relating to the most recent research works carried out in the area of flexible and hybrid electronics (FHE) fabrication with the aid of aerosol jet printing (AJP) additive manufacturing process. In pursuit of this goal, the objective is to review and classify a wide range of articles, published recently, concerning various aspects of AJP-based device fabrication, such as material synthesis, process monitoring, and control. AJP has recently emerged as the technique of choice for integration as well as fabrication of a broad spectrum of electronic components and devices, e.g., interconnects, sensors, transistors, optical waveguides, quantum dot arrays, photodetectors, and circuits. This is preeminently because of advantages engendered by AJP process. AJP not only allows for high-resolution deposition of microstructures, but also accommodates a wide renege of ink viscosity. However, AJP is intrinsically complex and prone to gradual drifts of the process output (stemming from ink chemistry and formulation). Consequently, a large number of research works in the literature has focused on in situ process characterization, real-time monitoring, and closed-loop control with the aim to make AJP a rapid, reliable, and robust additive manufacturing method for the manufacture of flexible and hybrid electronic devices. It is expected that the market for flexible electronics will be worth over $50 billion by 2020 [1].


2021 ◽  
Vol 48 ◽  
pp. 101264
Author(s):  
Haining Zhang ◽  
Joon Phil Choi ◽  
Seung Ki Moon ◽  
Teck Hui Ngo

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 220
Author(s):  
Mahmuda Akter Monne ◽  
Chandan Qumar Howlader ◽  
Bhagyashree Mishra ◽  
Maggie Yihong Chen

Polyvinyl Alcohol (PVA) is a promising polymer due to its high solubility with water, availability in low molecular weight, having short polymer chain, and cost-effectiveness in processing. Printed technology is gaining popularity to utilize processible solution materials at low/room temperature. This work demonstrates the synthesis of PVA solution for 2.5% w/w, 4.5% w/w, 6.5% w/w, 8.5% w/w and 10.5% w/w aqueous solution was formulated. Then the properties of the ink, such as viscosity, contact angle, surface tension, and printability by inkjet and aerosol jet printing, were investigated. The wettability of the ink was investigated on flexible (Kapton) and non-flexible (Silicon) substrates. Both were identified as suitable substrates for all concentrations of PVA. Additionally, we have shown aerosol jet printing (AJP) and inkjet printing (IJP) can produce multi-layer PVA structures. Finally, we have demonstrated the use of PVA as sacrificial material for micro-electro-mechanical-system (MEMS) device fabrication. The dielectric constant of printed PVA is 168 at 100 kHz, which shows an excellent candidate material for printed or traditional transistor fabrication.


2016 ◽  
Author(s):  
E. Balliu ◽  
H. Andersson ◽  
M. Engholm ◽  
S. Forsberg ◽  
H. Olin

2019 ◽  
Vol 8 (1) ◽  
pp. 199-204 ◽  
Author(s):  
W. Jackson ◽  
Marcia Almanza-Workman ◽  
Alison Chaiken ◽  
Robert Garcia ◽  
Albert Jeans ◽  
...  

2021 ◽  
pp. 102325
Author(s):  
D.R. Hines ◽  
Y. Gu ◽  
A.A. Martin ◽  
P. Li ◽  
J. Fleischer ◽  
...  

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