Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

2020 ◽  
Author(s):  
Pradeep Lall ◽  
Jinesh Narangaparambil ◽  
Ved Soni ◽  
Scott Miller
Keyword(s):  
Flexible Electronics ◽  
Flow Line ◽  
Unit Length ◽  
Scale Up ◽  
Single Layer ◽  
Consumer Electronics ◽  
Shear Load ◽  
Load To Failure ◽  
Jet Printing ◽  
Aerosol Jet Printing

Abstract Flexible electronics is a rapid emerging trend in consumer-electronics with ever-increasing applications showing feasibility of functionality with flexibility. Aerosol Jet printing technology has gained rapid acceptance for additive printing owing to non-contact deposition and ability to print on non-planar surfaces. Prior work on aerosol-jet print processes primarily focuses on single-layer printing, taking into account different parameters such as mass flow, line width, sintering conditions, and overspray. Flexible PCBs in complex applications are envisioned to be multi-layered, involving stacking of interconnections and connection between successive layers through use of z-axis connections. Aerosol-jet printing method allows the printing of interconnections with a number of inks including silver, copper, and carbon with fine lines and spaces in neighborhood of 10μm. Process recipes for manufacturing multilayer circuits and system scale-up methods are required. The objective of the paper is to establish process-recipes for z-axis interconnects and quantify process variability with Aerosol-jet print process needed for high volume scale-up. Conductive interconnects have been printed using the ultrasonic atomizer and the interlayer dielectrics have been printed using the pneumatic atomizer. The effect of thermal sintering on the performance of the printed circuits has been quantified through measurements of interconnect resistance and shear load to failure. This paper explores the printing of multi-layer upto 8 conductive layers. Sintering profile for lower resistance per unit length and higher shear load to failure was tested.

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Pradeep Lall ◽  
Amrit Abrol ◽  
Nakul Kothari ◽  
Benjamin Leever ◽  
Scott Miller
Keyword(s):  
Mechanical Properties ◽  
Process Parameters ◽  
Process Capability ◽  
High Volume ◽  
Process Efficiency ◽  
Shear Load ◽  
Additive Processes ◽  
Sintering Time ◽  
Load To Failure ◽  
Aerosol Jet Printing

Abstract Traditionally, printed circuit assemblies have been fabricated through a combination of imaging and plating-based subtractive processes involving the use of photo-exposure followed by baths for plating and etching in order to form the necessary circuitry on rigid and flexible laminates. The emergence of a number of additive technologies presents an opportunity for the development of processes for manufacturing of flexible substrates by utilizing mainstream additive processes. Aerosol-jet printing is capable of printing lines and spaces below 10 μm in width. The aerosol-jet system also supports a wide variety of materials, including nanoparticle inks, screen-printing pastes, conductive polymers, insulators, adhesives, and biological matter. The adoption of additive manufacturing for high-volume commercial fabrication requires an understanding of the print consistency and electrical mechanical properties. Little literature that addresses the effect of varying sintering time and temperature on the shear strength and resistivity of the printed lines exists. In this study, the effect of process parameters on the resultant line consistency and mechanical and electrical properties has been studied. Print process parameters studied include sheath rate, mass flow rate, nozzle size, substrate temperature, and chiller temperature. Properties include resistance and shear load to failure of the printed electrical line as a function of varying sintering time and temperature. The aerosol-jet machine has been used to print interconnects. Printed samples have been exposed to different sintering times and temperatures. The resistance and shear load to failure of the printed lines have been measured. The underlying physics of the resultant trend was then investigated using elemental analysis and scanning electron microscopy. The effect of line consistency drift over prolonged runtimes has been measured for up to 10 h of runtime. The printing process efficiency has been gaged as a function of the process capability index (Cpk) and process capability ratio (Cp). Printed samples were studied offline utilizing optical profilometry in order to analyze the consistency within the line width, height, and resistance, and shear load to study the variance in electrical and mechanical properties over time.

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Amrit Abrol ◽  
Nakul Kothari ◽  
Ben Leever ◽  
Scott Miller
Keyword(s):  
Mechanical Properties ◽  
Process Parameters ◽  
Process Capability ◽  
High Volume ◽  
Process Efficiency ◽  
Shear Load ◽  
Additive Processes ◽  
Sintering Time ◽  
Load To Failure ◽  
Aerosol Jet Printing

Abstract Traditionally, the printed circuit assemblies have been fabricated through a combination of imaging and plating based subtractive processes involving use of photo-exposure followed by baths for plating and etching to form the needed circuitry on rigid and flexible laminates. Additive electronics is finding applications for fabrication of IoT sensors. The emergence of a number of additive technologies poses an opportunity for the development of processes for manufacture of flexible substrates using mainstream additive processes, which are now commercially available. Aerosol-Jet printing has shown the capability for printing lines and spaces below 10 μm in width. The Aerosol-Jet system supports a wide variety of materials, including nanoparticle inks and screen-printing pastes, conductive polymers, insulators, adhesives, and even biological matter. The adoption of additive manufacturing for high-volume commercial fabrication requires an understanding of the print consistency, electrical and mechanical properties. Little literature exists that addresses the effect of varying sintering time and temperature on the shear strength and resistivity of the printed lines. In this study, the effect of process parameters on the resultant line-consistency, mechanical and electrical properties has been studied. Print process parameters studied include the sheath rate, mass flow rate, nozzle size, substrate temperature and chiller temperature. Properties include resistance and shear load to failure of the printed electrical line as a function of varying sintering time and varying sintering temperature. Aerosol-Jet machine has been used to print interconnects. Printed samples have been exposed to different sintering times and temperatures. The resistance and shear load to failure of the printed lines has been measured. The underlying physics of the resultant trend was then investigated using elemental analysis and SEM. The effect of line-consistency driftover prolonged runtimes has been measured for up to 10-hours of runtime. Printing process efficiency has been gauged a function of process capability index (Cpk) and process capability ratio (Cp). Printed samples were studied offline using optical Profilometry to analyze the consistency within the line width, line height, line resistance and shear load to study the variance in the electrical and mechanical properties over time.

A State-of-the-Art Review on Aerosol Jet Printing (AJP) Additive Manufacturing Process

2019 ◽  
Author(s):  
Roozbeh Ross Salary ◽  
Jack P. Lombardi ◽  
Darshana L. Weerawarne ◽  
Prahalad K. Rao ◽  
Mark D. Poliks
Keyword(s):  
Additive Manufacturing ◽  
Flexible Electronics ◽  
Manufacturing Process ◽  
Device Fabrication ◽  
Synthesis Process ◽  
Monitoring And Control ◽  
Loop Control ◽  
Wide Range ◽  
Jet Printing ◽  
Aerosol Jet Printing

Abstract The goal of this work is to forward a comprehensive framework, relating to the most recent research works carried out in the area of flexible and hybrid electronics (FHE) fabrication with the aid of aerosol jet printing (AJP) additive manufacturing process. In pursuit of this goal, the objective is to review and classify a wide range of articles, published recently, concerning various aspects of AJP-based device fabrication, such as material synthesis, process monitoring, and control. AJP has recently emerged as the technique of choice for integration as well as fabrication of a broad spectrum of electronic components and devices, e.g., interconnects, sensors, transistors, optical waveguides, quantum dot arrays, photodetectors, and circuits. This is preeminently because of advantages engendered by AJP process. AJP not only allows for high-resolution deposition of microstructures, but also accommodates a wide renege of ink viscosity. However, AJP is intrinsically complex and prone to gradual drifts of the process output (stemming from ink chemistry and formulation). Consequently, a large number of research works in the literature has focused on in situ process characterization, real-time monitoring, and closed-loop control with the aim to make AJP a rapid, reliable, and robust additive manufacturing method for the manufacture of flexible and hybrid electronic devices. It is expected that the market for flexible electronics will be worth over $50 billion by 2020 [1].

Aerosol jet printing of PEDOT:PSS for large area flexible electronics

2020 ◽  
Vol 5 (1) ◽  
pp. 014005 ◽  
Author(s):  
Giuseppe Tarabella ◽  
Davide Vurro ◽  
Stefano Lai ◽  
Pasquale D’Angelo ◽  
Luca Ascari ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Large Area ◽  
Jet Printing ◽  
Aerosol Jet Printing

A knowledge transfer framework to support rapid process modeling in aerosol jet printing

2021 ◽  
Vol 48 ◽  
pp. 101264
Author(s):  
Haining Zhang ◽  
Joon Phil Choi ◽  
Seung Ki Moon ◽  
Teck Hui Ngo
Keyword(s):  
Knowledge Transfer ◽  
Process Modeling ◽  
Rapid Process ◽  
Jet Printing ◽  
Aerosol Jet Printing

scholarly journals Synthesis of Printable Polyvinyl Alcohol for Aerosol Jet and Inkjet Printing Technology

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 220
Author(s):  
Mahmuda Akter Monne ◽  
Chandan Qumar Howlader ◽  
Bhagyashree Mishra ◽  
Maggie Yihong Chen
Keyword(s):  
Polyvinyl Alcohol ◽  
Inkjet Printing ◽  
Micro Electro Mechanical System ◽  
Device Fabrication ◽  
Silicon Substrates ◽  
Excellent Candidate ◽  
Jet Printing ◽  
Inkjet Printing Technology ◽  
Transistor Fabrication ◽  
Aerosol Jet Printing

Polyvinyl Alcohol (PVA) is a promising polymer due to its high solubility with water, availability in low molecular weight, having short polymer chain, and cost-effectiveness in processing. Printed technology is gaining popularity to utilize processible solution materials at low/room temperature. This work demonstrates the synthesis of PVA solution for 2.5% w/w, 4.5% w/w, 6.5% w/w, 8.5% w/w and 10.5% w/w aqueous solution was formulated. Then the properties of the ink, such as viscosity, contact angle, surface tension, and printability by inkjet and aerosol jet printing, were investigated. The wettability of the ink was investigated on flexible (Kapton) and non-flexible (Silicon) substrates. Both were identified as suitable substrates for all concentrations of PVA. Additionally, we have shown aerosol jet printing (AJP) and inkjet printing (IJP) can produce multi-layer PVA structures. Finally, we have demonstrated the use of PVA as sacrificial material for micro-electro-mechanical-system (MEMS) device fabrication. The dielectric constant of printed PVA is 168 at 100 kHz, which shows an excellent candidate material for printed or traditional transistor fabrication.

Considerations of Aerosol-Jet Printing for the Fabrication of Printed Hybrid Electronic Circuits

2021 ◽  
pp. 102325
Author(s):  
D.R. Hines ◽  
Y. Gu ◽  
A.A. Martin ◽  
P. Li ◽  
J. Fleischer ◽  
...  
Keyword(s):  
Electronic Circuits ◽  
Jet Printing ◽  
Aerosol Jet Printing

Online Monitoring of Functional Electrical Properties in Aerosol Jet Printing Additive Manufacturing Process Using Shape-From-Shading Image Analysis

2017 ◽  
Vol 139 (10) ◽  
Author(s):  
Roozbeh (Ross) Salary ◽  
Jack P. Lombardi ◽  
Prahalad K. Rao ◽  
Mark D. Poliks
Keyword(s):  
Cross Section ◽  
Electrical Resistance ◽  
Online Monitoring ◽  
Shape From Shading ◽  
Sectional Area ◽  
Cross Sectional ◽  
Jet Printing ◽  
The Cross ◽  
Aerosol Jet Printing ◽  
Line Resistance

The goal of this research is online monitoring of functional electrical properties, e.g., resistance, of electronic devices made using aerosol jet printing (AJP) additive manufacturing (AM) process. In pursuit of this goal, the objective is to recover the cross-sectional profile of AJP-deposited electronic traces (called lines) through shape-from-shading (SfS) analysis of their online images. The aim is to use the SfS-derived cross-sectional profiles to predict the electrical resistance of the lines. An accurate characterization of the cross section is essential for monitoring the device resistance and other functional properties. For instance, as per Ohm’s law, the electrical resistance of a conductor is inversely proportional to its cross-sectional area (CSA). The central hypothesis is that the electrical resistance of an AJP-deposited line estimated online and in situ from its SfS-derived cross-sectional area is within 20% of its offline measurement. To test this hypothesis, silver nanoparticle lines were deposited using an Optomec AJ-300 printer at varying sheath gas flow rate (ShGFR) conditions. The four-point probes method, known as Kelvin sensing, was used to measure the resistance of the printed structures offline. Images of the lines were acquired online using a charge-coupled device (CCD) camera mounted coaxial to the deposition nozzle of the printer. To recover the cross-sectional profiles from the online images, three different SfS techniques were tested: Horn’s method, Pentland’s method, and Shah’s method. Optical profilometry was used to validate the SfS cross section estimates. Shah’s method was found to have the highest fidelity among the three SfS approaches tested. Line resistance was predicted as a function of ShGFR based on the SfS-estimates of line cross section using Shah’s method. The online SfS-derived line resistance was found to be within 20% of offline resistance measurements done using the Kelvin sensing technique.

Sign in / Sign up

Export Citation Format

Share Document